Patents by Inventor Yoshito Imai

Yoshito Imai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11401446
    Abstract: An object of the present invention is to provide an electroconductive adhesive composition which has excellent thermal conductivity and which, even when repeatedly undergoing fluctuations in temperature, is less apt to cause adherend separation. The present invention relates to an electroconductive adhesive composition which contains: an electroconductive filler (A) containing metal particles (a1) having an average particle diameter of 0.5-10 ?m and silver particles (a2) having an average particle diameter of 10-200 nm; and particles (B) of a thermoplastic resin which is solid at 25° C.
    Type: Grant
    Filed: July 10, 2018
    Date of Patent: August 2, 2022
    Assignee: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Koyo Kobori, Yoshito Imai, Shintaroh Abe, Takeshi Kondo
  • Publication number: 20210317342
    Abstract: An object of the present invention is to provide an electroconductive adhesive composition which has excellent thermal conductivity and which, even when repeatedly undergoing fluctuations in temperature, is less apt to cause adherend separation. The present invention relates to an electroconductive adhesive composition which contains: an electroconductive filler (A) containing metal particles (a1) having an average particle diameter of 0.5-10 ?m and silver particles (a2) having an average particle diameter of 10-200 nm; and particles (B) of a thermoplastic resin which is solid at 25° C.
    Type: Application
    Filed: July 10, 2018
    Publication date: October 14, 2021
    Applicant: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Koyo KOBORI, Yoshito IMAI, Shintaroh ABE, Takeshi KONDO
  • Publication number: 20190136099
    Abstract: The present invention is to provide an electroconductive adhesive composition which contains a thermoplastic resin and has high heat dissipation properties and which is inhibited from suffering the bleeding-out phenomenon in which a nonpolar solvent undesirably bleeds out after die bonding. The present invention relates to an electroconductive adhesive composition including (A) electroconductive particles, (B) a thermoplastic resin, (C) a nonpolar solvent, and (D) a water-insoluble fluorochemical surfactant.
    Type: Application
    Filed: March 28, 2018
    Publication date: May 9, 2019
    Inventors: Koyo KOBORI, Yoshito IMAI, Shintaro ABE, Takeshi KONDO
  • Patent number: 9982155
    Abstract: [Problem] Provided is a photocurable electroconductive ink composition for screen printing which can provide printability, printing precision and adhesiveness on a substrate good enough for screen printing, and can show stable electroconductive properties. [Solution] A photocurable electroconductive ink composition for screen printing, comprising: (A) an electroconductive filler, (B) a photopolymerizable resin precursor consisting of an oligomer of urethane acrylate, monofunctional acrylate and polyfunctional acrylate, (C) an alkyd resin, (D) two or more photopolymerization initiators and (E) a polymer dispersant, in which the content of the electroconductive filler (A) is 70 to 90 mass % relative to the total mass of the photocurable electroconductive ink composition, and more than 50 mass % of the electroconductive filler is silver powder in a scale-like, foil-like or flake-like form having a particle diameter at 50 % particle size distribution of 0.3 to 3.
    Type: Grant
    Filed: June 22, 2015
    Date of Patent: May 29, 2018
    Assignee: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Kanako Furutachi, Rikia Furusho, Yoshito Imai, Kenichiro Takaoka
  • Patent number: 9668343
    Abstract: Disclosed is a photocurable electroconductive ink composition including: (A) an oligomer of urethane acrylates, (B) three types of acrylates composed of either tetrafunctional acrylates or trifunctional acrylates, difunctional acrylates and monofunctional acrylates, (C) an electroconductive filler, (D) two or more types of photopolymerization initiators and (E) a polymeric dispersing agent, wherein the amount of the electroconductive filler (C) to be mixed is from 77 to 85% by mass based on the total mass of the photocurable electroconductive ink composition, and 80% by mass or more of the electroconductive filler (C) is a scaly, foil-like or flakey silver powder having a particle size corresponding to a particle size distribution at 50% of more than 5 ?m.
    Type: Grant
    Filed: October 24, 2012
    Date of Patent: May 30, 2017
    Assignee: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Rikia Furusho, Yoshito Imai
  • Publication number: 20170137655
    Abstract: [Problem] Provided is a photocurable electroconductive ink composition for screen printing which can provide printability, printing precision and adhesiveness on a substrate good enough for screen printing, and can show stable electroconductive properties. [Solution] A photocurable electroconductive ink composition for screen printing, comprising: (A) an electroconductive filler, (B) a photopolymerizable resin precursor consisting of an oligomer of urethane acrylate, monofunctional acrylate and polyfunctional acrylate, (C) an alkyd resin, (D) two or more photopolymerization initiators and (E) a polymer dispersant, in which the content of the electroconductive filler (A) is 70 to 90 mass % relative to the total mass of the photocurable electroconductive ink composition, and more than 50 mass % of the electroconductive filler is silver powder in a scale-like, foil-like or flake-like form having a particle diameter at 50 % particle size distribution of 0.3 to 3.
    Type: Application
    Filed: June 22, 2015
    Publication date: May 18, 2017
    Applicant: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Kanako FURUTACHI, Rikia FURUSHO, Yoshito IMAI, Kenichiro TAKAOKA
  • Publication number: 20140311779
    Abstract: Disclosed is a photocurable electroconductive ink composition including: (A) an oligomer of urethane acrylates, (B) three types of acrylates composed of either tetrafunctional acrylates or trifunctional acrylates, difunctional acrylates and monofunctional acrylates, (C) an electroconductive filler, (D) two or more types of photopolymerization initiators and (E) a polymeric dispersing agent, wherein the amount of the electroconductive filler (C) to be mixed is from 77 to 85% by mass based on the total mass of the photocurable electroconductive ink composition, and 80% by mass or more of the electroconductive filler (C) is a scaly, foil-like or flakey silver powder having a particle size corresponding to a particle size distribution at 50% of more than 5 ?m.
    Type: Application
    Filed: October 24, 2012
    Publication date: October 23, 2014
    Applicant: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Rikia Furusho, Yoshito Imai