Patents by Inventor Yoshito Konno
Yoshito Konno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9508559Abstract: A semiconductor wafer including patterns transferred to a plurality of shot regions of the semiconductor wafer respectively, a plurality of chip regions being formed in the plurality of shot regions respectively, a plurality of first dummy patterns being formed respectively in a first chip region of the plurality of chip regions of each of the plurality of shot regions, the plurality of first dummy patterns being arranged repeatedly in a first manner, a plurality of second dummy patterns being formed respectively in a second chip region of the plurality of chip regions of each of the plurality of shot regions, the plurality of second dummy patterns being arranged repeatedly in a second manner different from the first manner.Type: GrantFiled: September 18, 2013Date of Patent: November 29, 2016Assignee: FUJITSU SEMICONDUCTOR LIMITEDInventors: Shoko Saito, Tomoyuki Okada, Kanji Takeuchi, Mitsufumi Naoe, Masahiko Minemura, Yukihiro Sato, Yoshito Konno, Yasuhiko Inada, Tomoaki Inaoka, Naoya Sashida
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Patent number: 8991464Abstract: A method of peeling an electronic component. The method includes a step of, when the electronic component is adhered onto a first main surface of a tape member, bringing a bellowphragm into contact with a second main surface, which is the other main surface of the tape member; and a step of, after the bellowphragm is brought into contact with the second main face, deforming the bellowphragm and the tape member by supplying a fluid to the bellowphragm to thereby peel the electronic component from the tape member.Type: GrantFiled: August 17, 2012Date of Patent: March 31, 2015Assignee: Fujitsu Semiconductor LimitedInventors: Yoshito Konno, Yutaka Yamada
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Patent number: 8828186Abstract: A method of peeling an electronic component. The method includes a step of, when the electronic component is adhered onto a first main surface of a tape member, bringing a bellowphragm into contact with a second main surface, which is the other main surface of the tape member; and a step of, after the bellowphragm is brought into contact with the second main face, deforming the bellowphragm and the tape member by supplying a fluid to the bellowphragm to thereby peel the electronic component from the tape member.Type: GrantFiled: March 25, 2009Date of Patent: September 9, 2014Assignee: Fujitsu Semiconductor LimitedInventors: Yoshito Konno, Yutaka Yamada
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Publication number: 20140110712Abstract: A semiconductor wafer including patterns transferred to a plurality of shot regions of the semiconductor wafer respectively, a plurality of chip regions being formed in the plurality of shot regions respectively, a plurality of first dummy patterns being formed respectively in a first chip region of the plurality of chip regions of each of the plurality of shot regions, the plurality of first dummy patterns being arranged repeatedly in a first manner, a plurality of second dummy patterns being formed respectively in a second chip region of the plurality of chip regions of each of the plurality of shot regions, the plurality of second dummy patterns being arranged repeatedly in a second manner different from the first manner.Type: ApplicationFiled: September 18, 2013Publication date: April 24, 2014Applicant: FUJITSU SEMICONDUCTOR LIMITEDInventors: Shoko Saito, Tomoyuki Okada, Kanji Takeuchi, MITSUFUMI NAOE, Masahiko Minemura, Yukihiro Sato, Yoshito Konno, Yasuhiko Inada, Tomoaki Inaoka, Naoya SASHIDA
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Patent number: 8445906Abstract: A method for sorting and acquiring a semiconductor element, including: disposing a plurality of semiconductor elements in an effective section in a semiconductor substrate; disposing a standard semiconductor element outside of the effective section in the semiconductor substrate; forming a bump in each of the plurality of the semiconductor elements and in the standard semiconductor element; performing a test on the plurality of the semiconductor elements in the effective section; forming a location map using the standard semiconductor element as a base point; and picking up the semiconductor elements determined as non-defective in the test from the plurality of the semiconductor elements based on the location map.Type: GrantFiled: January 20, 2010Date of Patent: May 21, 2013Assignee: Fujitsu Semiconductor LimitedInventors: Yoshito Konno, Yutaka Yamada
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Patent number: 8349624Abstract: A method of manufacturing a semiconductor device, includes providing a mark above a main surface on a semiconductor substrate, separating the semiconductor substrate into a plurality of semiconductor elements by cutting the semiconductor substrate, determining a reference semiconductor element on the basis of a coordinate data indicating coordinates of the mark and coordinates of all of the semiconductor elements on the semiconductor substrate, and picking-out the semiconductor elements on the basis of the coordinate data using a pick-out apparatus. The providing operation includes forming a protective coat onto the main surface of the semiconductor substrate, irradiating a point on the main surface of the semiconductor substrate with a laser beam through the protective coat, and eliminating the protective coat from the main surface of the semiconductor substrate.Type: GrantFiled: October 20, 2010Date of Patent: January 8, 2013Assignee: Fujitsu Semiconductor LimitedInventor: Yoshito Konno
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Publication number: 20120312482Abstract: A method of peeling an electronic component. The method includes a step of, when the electronic component is adhered onto a first main surface of a tape member, bringing a bellowphragm into contact with a second main surface, which is the other main surface of the tape member; and a step of, after the bellowphragm is brought into contact with the second main face, deforming the bellowphragm and the tape member by supplying a fluid to the bellowphragm to thereby peel the electronic component from the tape member.Type: ApplicationFiled: August 17, 2012Publication date: December 13, 2012Applicant: FUJITSU SEMICONDUCTOR LIMITEDInventors: Yoshito KONNO, Yutaka YAMADA
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Publication number: 20110097828Abstract: A method of manufacturing a semiconductor device, includes providing a mark above a main surface on a semiconductor substrate, separating the semiconductor substrate into a plurality of semiconductor elements by cutting the semiconductor substrate, determining a reference semiconductor element on the basis of a coordinate data indicating coordinates of the mark and coordinates of all of the semiconductor elements on the semiconductor substrate, and picking-out the semiconductor elements on the basis of the coordinate data using a pick-out apparatus. The providing operation includes forming a protective coat onto the main surface of the semiconductor substrate, irradiating a point on the main surface of the semiconductor substrate with a laser beam through the protective coat, and eliminating the protective coat from the main surface of the semiconductor substrate.Type: ApplicationFiled: October 20, 2010Publication date: April 28, 2011Applicant: FUJITSU SEMICONDUCTOR LIMITEDInventor: Yoshito KONNO
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Publication number: 20100117084Abstract: A method for sorting and acquiring a semiconductor element, including: disposing a plurality of semiconductor elements in an effective section in a semiconductor substrate; disposing a standard semiconductor element outside of the effective section in the semiconductor substrate; forming a bump in each of the plurality of the semiconductor elements and in the standard semiconductor element; performing a test on the plurality of the semiconductor elements in the effective section; forming a location map using the standard semiconductor element as a base point; and picking up the semiconductor elements determined as non-defective in the test from the plurality of the semiconductor elements based on the location map.Type: ApplicationFiled: January 20, 2010Publication date: May 13, 2010Applicant: FUJITSU MICROELECTRONICS LIMITEDInventors: Yoshito Konno, Yutaka Yamada
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Publication number: 20090242124Abstract: A method of peeling an electronic component. The method includes a step of, when the electronic component is adhered onto a first main surface of a tape member, bringing a bellowphragm into contact with a second main surface, which is the other main surface of the tape member; and a step of, after the bellowphragm is brought into contact with the second main face, deforming the bellowphragm and the tape member by supplying a fluid to the bellowphragm to thereby peel the electronic component from the tape member.Type: ApplicationFiled: March 25, 2009Publication date: October 1, 2009Applicant: FUJITSU MICROELECTRONICS LIMITEDInventors: Yoshito Konno, Yutaka Yamada
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Patent number: 6930566Abstract: A nonreciprocal circuit element of the present invention comprises a first yoke and a second yoke that form a magnetic closed circuit. A plurality of chip capacitors with a first electrode and a second electrode are installed in the box-shaped second yoke. Subsequently, a circuit substrate used for the nonreciprocal circuit element can be smaller than conventional circuit substrates, and the assembly of the nonreciprocal circuit element is excellent. Further, since the capacitances of the chip capacitors can be adjusted through windows of the second yoke, the electrical performance of the nonreciprocal circuit element is excellent.Type: GrantFiled: January 6, 2003Date of Patent: August 16, 2005Assignee: Alps Electric Co., Ltd.Inventors: Masahiko Koseki, Yoshito Konno
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Patent number: 6774650Abstract: A probe card for testing a wafer having formed a plurality of semiconductor chips, the probe card including a board and a multi-layer substrate. The probe card may also include a flexible substrate. A contact electrode, located opposite from an electrode on one of the chips, is disposed above or below the flexible substrate, or may be provided on an elastic material on the multi-layered substrate. A first wiring has a first portion connected to the contact electrode, a level transitioning portion extending from a level of the first portion to the multi-layer substrate at a lower level, and a connecting terminal at an end of the level transitioning portion connected to an internal terminal on the multi-layered substrate. A second wiring in the multi-layered substrate connects the internal terminal to an external terminal at a periphery of the multi-layer substrate. A third wiring on the board connects the external terminal on the multi-layer substrate to an external connecting terminal on the board.Type: GrantFiled: March 21, 2003Date of Patent: August 10, 2004Assignee: Fujitsu LimitedInventors: Shigeyuki Maruyama, Daisuke Koizumi, Naoyuki Watanabe, Yoshito Konno, Eiji Yoshida, Toshiyuki Honda, Toshimi Kawahara, Kenichi Nagashige
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Publication number: 20030160626Abstract: A probe card for testing a wafer having formed a plurality of semiconductor chips, the probe card including a board and a multi-layer substrate. The probe card may also include a flexible substrate. A contact electrode, located opposite from an electrode on one of the chips, is disposed above or below the flexible substrate, or may be provided on an elastic material on the multi-layered substrate. A first wiring has a first portion connected to the contact electrode, a level transitioning portion extending from a level of the first portion to the multi-layer substrate at a lower level, and a connecting terminal at an end of the level transitioning portion connected to an internal terminal on the multi-layered substrate. A second wiring in the multi-layered substrate connects the internal terminal to an external terminal at a periphery of the multi-layer substrate. A third wiring on the board connects the external terminal on the multi-layer substrate to an external connecting terminal on the board.Type: ApplicationFiled: March 21, 2003Publication date: August 28, 2003Applicant: FUJITSU LIMITEDInventors: Shigeyuki Maruyama, Daisuke Koizumi, Naoyuki Watanabe, Yoshito Konno, Eiji Yoshida, Toshiyuki Honda, Toshimi Kawahara, Kenichi Nagashige
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Publication number: 20030128078Abstract: A nonreciprocal circuit element of the present invention comprises a first yoke and a second yoke that form a magnetic closed circuit. A plurality of chip capacitors with a first electrode and a second electrode are installed in the box-shaped second yoke. Subsequently, a circuit substrate used for the nonreciprocal circuit element can be smaller than conventional circuit substrates, and the assembly of the nonreciprocal circuit element is excellent. Further, since the capacitances of the chip capacitors can be adjusted through windows of the second yoke, the electrical performance of the nonreciprocal circuit element is excellent.Type: ApplicationFiled: January 6, 2003Publication date: July 10, 2003Applicant: Alps Electric Co., Ltd.Inventors: Masahiko Koseki, Yoshito Konno
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Patent number: 6563330Abstract: A probe card for testing a wafer having formed a plurality of semiconductor chips, the probe card including a board and a multi-layer substrate. The probe card may also include a flexible substrate. A contact electrode, located opposite from an electrode on one of the chips, is disposed above or below the flexible substrate, or may be provided on an elastic material on the multi-layered substrate. A first wiring has a first portion connected to the contact electrode, a level transitioning portion extending from a level of the first portion to the multi-layer substrate at a lower level, and a connecting terminal at an end of the level transitioning portion connected to an internal terminal on the multi-layered substrate. A second wiring in the multi-layered substrate connects the internal terminal to an external terminal at a periphery of the multi-layer substrate. A third wiring on the board connects the external terminal on the multi-layer substrate to an external connecting terminal on the board.Type: GrantFiled: March 31, 2000Date of Patent: May 13, 2003Assignee: Fujitsu LimitedInventors: Shigeyuki Maruyama, Daisuke Koizumi, Naoyuki Watanabe, Yoshito Konno, Eiji Yoshida, Toshiyuki Honda, Toshimi Kawahara, Kenichi Nagashige
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Patent number: 6461942Abstract: Semiconductor chips are formed on a wafer. The wafer is diced, while a dicing tape applied to the wafer is kept intact. Each of the semiconductor chips is fixed by suction and then removed from the dicing tape. Each of the semiconductor chips is unfixed by ceasing the suction and picked up and conveyed.Type: GrantFiled: December 26, 2000Date of Patent: October 8, 2002Assignee: Fujitsu LimitedInventors: Mitsuhisa Watanabe, Kazuo Teshirogi, Eiji Yoshida, Yuzo Shimobeppu, Yoshito Konno, Kyouhei Tamaki
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Publication number: 20010049160Abstract: Semiconductor chips are formed on a wafer. The wafer is diced, while a dicing tape applied to the wafer is kept intact. Each of the semiconductor chips is fixed by suction and then removed from the dicing tape. Each of the semiconductor chips is unfixed by ceasing the suction and picked up and conveyed.Type: ApplicationFiled: December 26, 2000Publication date: December 6, 2001Applicant: FUJITSU LIMITEDInventors: Mitsuhisa Watanabe, Kazuo Teshirogi, Eiji Yoshida, Yuzo Shimobeppu, Yoshito Konno, Kyouhei Tamaki