Abstract: A cross-linked silicone adhesive sheet has stability of peeling surfaces during peeling protective films away from both sides of the sheet. An adhesive sheet of a cross-linked silicone has protective films on both sides of the sheet. The protective films each have a thickness of 100 ?m or less. A force of peeling of the protective films from the sheet is equal to or below 5.0 N/m. The difference between peeling forces of the films is equal to or exceeds 0.2 N/m. A method of manufacturing the adhesive sheet of a cross-linked silicone includes the steps of forming a film-like body by placing a cross-linkable silicone composition in a layer having a thickness of 100 ?m or less between two protective films of different materials and then cross-linking the composition.

Abstract: Adhesive silicone elastomer sheet afforded by the cure of a hydrosilylation-curing silicone elastomer composition comprising: (A) an organopolysiloxane that contains at least one diorganosiloxane unit and that has at least two silicon-bonded alkenyl groups in each molecule, (B) an organopolysiloxane resin with the average unit formula: (R13SiO1/2)x(SiO4/2)1.0 in which R1 is substituted or unsubstituted monovalent hydrocarbon group and x is a number from 0.5 to 1.0, (C) an organopolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule, and (D) a hydrosilylation catalyst. The adhesive silicone elastomer sheet is transparent, and whose surface exhibits a stable and permanent adhesiveness.

Abstract: An anisotropically electroconductive adhesive film is characterized by containing an electroconductive elastomer that traverses the thickness of the adhesive film and is insulated in the plane of the adhesive film comprising electrically insulating elastomer, and both the electroconductive elastomer and the electrically insulating elastomer have a modulus of elasticity at 150° C. that is no greater than 100 MPa. A method for producing the anisotropically electroconductive adhesive film is characterized by forming through holes across the thickness of the adhesive film comprising electrically insulating elastomer, thereafter filling the through holes with an electroconductive elastomer composition, and curing the electroconductive elastomer composition to form the electroconductive elastomer after filling the through holes.

Abstract: A silicone-based adhesive sheet has either a layer of clay-like curable silicone composition on one side and a layer of slower curing clay-like curable silicone composition than the first composition layer on the other side, or a cured silicone layer on one side and a layer of clay-like curable silicone composition on the other side. The silicone-based adhesive sheet may be used in a method for bonding semiconductor chip and a chip attachment component. A semiconductor device may be prepared by the method.

Abstract: An anisotropically electroconductive adhesive film is characterized by containing an electroconductive elastomer that traverses the thickness of the adhesive film and is insulated in the plane of the adhesive film comprising electrically insulating elastomer, and both the electroconductive elastomer and the electrically insulating elastomer have a modulus of elasticity at 150° C. that is no greater than 100 MPa. A method for producing the anisotropically electroconductive adhesive film is characterized by forming through holes across the thickness of the adhesive film comprising electrically insulating elastomer, thereafter filling the through holes with an electroconductive elastomer composition, and curing the electroconductive elastomer composition to form the electroconductive elastomer after filling the through holes.

Abstract: A cross-linked silicone adhesive sheet has stability of peeling surfaces during peeling protective films away from both sides of the sheet. An adhesive sheet of a cross-linked silicone has protective films on both sides of the sheet. The protective films each have a thickness of 100 &mgr;m or less. A force of peeling of the protective films from the sheet is equal to or below 5.0 N/m. The difference between peeling forces of the films is equal to or exceeds 0.2 N/m. A method of manufacturing the adhesive sheet of a cross-linked silicone includes the steps of forming a film-like body by placing a cross-linkable silicone composition in a layer having a thickness of 100 &mgr;m or less between two protective films of different materials and then cross-linking the composition.

Abstract: A silicone adhesive sheet for bonding a semiconductor chip to a chip attachment component comprising a crosslinkable silicone composition containing a silatrane derivative, and a method for manufacturing a silicone adhesive sheet by subjecting a crosslinkable silicone composition containing a silatrane derivative to a crosslinking reaction between backing materials that do not stick to the crosslinked product of said composition, where at least one of the backing materials has a larger dielectric constant than that of the crosslinked product. The present silicone adhesive sheet allows a semiconductor chip and a chip attachment component to be bonded in a short time at a relatively low temperature.

Abstract: Silicone rubber composition comprising an alkenyl-substituted diorganopolysiloxane, an inorganic filler, an organopolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule, in a quantity that affords a value from 0.4 to 10 for the molar ratio of silicon-bonded hydrogen in the organopolysiloxane to alkenyl groups in the alkenyl-substituted diorganopolysiloxane, an organohydrogenpolysiloxane, in a quantity that affords a value from 0.01 to 0.5 for the molar ratio of silicon-bonded hydrogen in this component to alkenyl groups in the alkenyl-substituted diorganopolysiloxane, and a platinum catalyst.A fluororesin-covered fixing roll in which a fluororesin layer is placed over the circumference of a roll shaft with a silicone rubber layer interposed between the fluororesin layer and the roll shaft, wherein said silicone rubber composition is formed by curing the silicone rubber composition described above.

Abstract: Silicone rubber composition comprising an alkenyl-substituted diorganopolysiloxane, an inorganic filler, an organopolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule, in a quantity that affords a value from 0.4 to 10 for the molar ratio of silicon-bonded hydrogen in the organopolysiloxane to alkenyl groups in the alkenyl-substituted diorganopolysiloxane, an organohydrogenpolysiloxane, in a quantity that affords a value from 0.01 to 0.5 for the molar ratio of silicon-bonded hydrogen in this component to alkenyl groups in the alkenyl-substituted diorganopolysiloxane, and a platinum catalyst. A fluororesin-covered fixing roll in which a fluororesin layer is placed over the circumference of a roll shaft with a silicone rubber layer interposed between the fluororesin layer and the roll shaft, wherein said silicone rubber composition is formed by curing the silicone rubber composition described above.

Abstract: A novel primer composition, which is especially adapted for promoting the adhesion of thermosetting rubbers to substrates having exceptionally inert surfaces, such a nickel, stainless steel and organic resins is disclosed. The composition comprises: (A) 100 parts, by weight, of an organosilicon compound selected from the group consisting of (1) alkenyltrialkoxysilane and (2) mild hydrolyzates of (1); (B) 0.01-200 parts, by weight, of a platinum compound; (C) 0.1-100 parts by weight of an organic titanic acid ester; and optionally (D) a solvent.

Abstract: A silicone rubber composition that yields silicone rubber whose durometer can be freely reduced without a concomitant reduction in the mechanical properties of the silicone rubber. The reduction in durometer is achieved by controlling the concentration of an organosiloxane having hydrogen substitution on terminal silicon atoms.

Abstract: A low durometer fixing roll comprising a roller shaft, a peelable organic resin layer established on the external circumferential surface of the roller shaft, and a silicone gel layer interposed between them. A silicone gel composition for use in a fixing roll, said gel composition comprising (A) an alkenyl-substituted organopolysiloxane, (B) an organohydrogenpolysiloxane, in a quantity sufficient to provide 0.1 to 5 moles of silicon-bonded hydrogen in component (B) per mole of alkenyl groups in component (A) and (C) a sufficient quantity of platinum catalyst for curing the silicone gel composition.

Abstract: Thermally conductive silicone rubber compositions, curable to elastomers having low permanent compression strain ratios, consisting of a polyorganosiloxane, a thermally conductive inorganic filler, an organosilicon compound having in each molecule at least three groups represented by the general formula of HR.sup.1.sub.2 Si, and an organic peroxide.

Abstract: The present invention relates to a silicone rubber composition for fixing roll service. More specifically, the invention relates to a silicone rubber composition for fixing roll service that is easily molded into a fixing roll as used in devices such as electrophotographic copiers, facsimile machines, and laser printers and that yields a fixing roll with an excellent mechanical strength and excellent toner release properties.

Abstract: A silicone rubber composition is prepared by mixing a diorganopolysiloxane which contains 0.1 to 5 weight % of low-molecular-weight organosiloxane with a vapor pressure at 200.degree. C. of at least 10 mm Hg, with at least 90 weight % of a low-molecular-weight organosiloxane with a boiling point not exceeding 250.degree. C. at 760 mm Hg and a curing agent with filler being optional. These silicone rubber compositions are useful for silicone rubber moldings which can be used to in applications involving electrical switch contacts resulting in electrical switch contact conduction free of defects.