Abstract: To provide a curable resin composition, from which a cured product having high heat resistance, a low dielectric loss tangent, high adhesion to a conductor can be obtained. A dry film, a resin-clad copper foil, a cured product, and an electronic component containing the curable resin composition are to be provided. A curable resin composition containing (A) an epoxy resin and (B) a compound having an active ester group is obtained, which has ratio of the total amount of epoxy group(s) in (A) the epoxy resin/the total amount of active ester group(s) in (B) the compound having an active ester group in the composition in the range of 0.2 to 0.6. A dry film, a resin-clad copper foil, a cured product, and an electronic component containing the curable resin composition are also obtained.

Abstract: To provide a curable resin composition, from which a cured product having high heat resistance, a low dielectric loss tangent, high adhesion to a conductor can be obtained. A dry film, a resin-clad copper foil, a cured product, and an electronic component containing the curable resin composition are to be provided. A curable resin composition containing (A) an epoxy resin and (B) a compound having an active ester group is obtained, which has ratio of the total amount of epoxy group(s) in (A) the epoxy resin/the total amount of active ester group(s) in (B) the compound having an active ester group in the composition in the range of 0.2 to 0.6. A dry film, a resin-clad copper foil, a cured product, and an electronic component containing the curable resin composition are also obtained.

Abstract: Provided is a heat curable adhesive that can strongly bond a base material formed of a crystalline polyester resin, can freely regulate the thickness of an adhesive layer, has excellent chemical resistance, and, at the same time, has excellent storage stability. Furthermore, provided is a resin laminated-type IC card, in which a liquid heat curable adhesive of which use has been difficult in the past can be used, and the liquid heat curable adhesive can be coated with a good accuracy by a printing method without the need to perform molding into a hot-melt sheet to bond a base material formed of a crystalline polyester resin. Accordingly, the resin laminated-type IC card can have a high degree of freedom in design of the thickness of an IC card. The heat curable adhesive comprises (a) a hydroxyl group-containing non-crystalline polyester resin, (b) a resin containing a carboxylic acid anhydride, and (c) a solvent for dissolving (a) the hydroxyl group-containing non-crystalline polyester resin.

Abstract: Provided is a heat curable adhesive that can strongly bond a base material formed of a crystalline polyester resin, can freely regulate the thickness of an adhesive layer, has excellent chemical resistance, and, at the same time, has excellent storage stability. Furthermore, provided is a resin laminated-type IC card, in which a liquid heat curable adhesive of which use has been difficult in the past can be used, and the liquid heat curable adhesive can be coated with a good accuracy by a printing method without the need to perform molding into a hot-melt sheet to bond a base material formed of a crystalline polyester resin. Accordingly, the resin laminated-type IC card can have a high degree of freedom in design of the thickness of an IC card. The heat curable adhesive comprises (a) a hydroxyl group-containing non-crystalline polyester resin, (b) a resin containing a carboxylic acid anhydride, and (c) a solvent for dissolving (a) the hydroxyl group-containing non-crystalline polyester resin.

Abstract: A polishing cloth has a base material of a woven cloth formed by weaving in woven bundles of plastic fibers and its surface layer is formed by portions of these woven bundles which are cut and raised from a surface. When such a polishing cloth is used for texturing a target surface of a disk substrate, the target surface is rubbed by such a cloth while a liquid slurry containing free abrasive particles are supplied to the surface.

Abstract: A polishing cloth has a base material of a woven cloth formed by weaving in woven bundles of plastic fibers and its surface layer is formed by portions of these woven bundles which are cut and raised from a surface. When such a polishing cloth is used for texturing a target surface of a disk substrate, the target surface is rubbed by such a cloth while a liquid slurry containing free abrasive particles are supplied to the surface.

Abstract: A polishing cloth has a base material of a woven cloth formed by weaving in woven bundles of plastic fibers and its surface layer is formed by portions of these woven bundles which are cut and raised from a surface. Such a polishing cloth can be produced by preparing a woven cloth as its base material by weaving in woven bundles of plastic fibers, cutting portions of these woven bundles over a surface of the woven cloth, and forming a surface layer by raising the cut portions of the woven bundles from a surface. When such a polishing cloth is used for texturing a target surface of a disk substrate, the target surface is rubbed by such a cloth while a liquid slurry containing free abrasive particles are supplied to the surface.

Abstract: A polishing cloth having a base material of a woven cloth formed by weaving in woven bundles of plastic fibers and its surface layer formed by portions of these woven bundles which are cut and raised from a surface is produced by preparing a woven cloth as its base material by weaving in woven bundles of plastic fibers, cutting portions of these woven bundles over a surface of the woven cloth, and forming a surface layer by raising the cut portions of the woven bundles from a surface.