Abstract: A method for bonding a LSI chip having terminals on a wiring base having electrodes which comprises the steps of coating a heat sensitive adhesive on the surface of a wafer forming a plurality of LSI chips, sprinkling electrically conductive particles thereon, dopping the electrically conductive particles, scribing the wafer to be divided into each of the LSI chips, positioning each of the terminals of the LSI chip and each of the electrodes of the wiring base face to face, and bonding the LSI chip on the wiring base.

Abstract: An electrically conducting hot melt adhesive is located at limited contact regions of a flexible circuit support, which typically carries a large scale integrated circuit (LSI) chip. A non-conducting hot melt adhesive is disposed between the limited contact regions at the non-contact regions. The resulting electrical connector can then be brought into contact with the corresponding areas of flexible or rigid circuit supports and through the application of heat and pressure, fuse the respective members so as to establish circuit paths between their limited contact regions via the electrically conducting hot melt adhesive. Heat and pressure are applied to the conducting hot melt adhesive in the same way as for an electrically non-conducting hot melt adhesive after contacting limited contact regions of another flexible circuit support or a rigid circuit support with the molten adhesive. Subsequently, the molten adhesive is left to cool so as to solidify.

Abstract: In an electronic calculator essentially comprising a multidigit display, a keyboard and a data processor unit, a multidigit liquid crystal display is deposited together with integral key actuators of the keyboard on a flexible circuit film which carries electrical conductor leaves in a desired pattern. The conductor leaves to be in contact with terminals of the liquid crystal display are formed to extend in the direction of length of the liquid crystal display to thereby establish room for a battery compartment.