Abstract: A substrate processing apparatus includes a film processing unit configured to perform a preset processing including formation of a resist film on a front surface of a substrate; and a carry-in/out unit configured to perform a carry-in/carry-out of the substrate into/from the film processing unit. The film processing unit includes a resist film forming unit configured to form the resist film on the front surface of the substrate; a film removing unit configured to supply, to a rear surface film formed on a rear surface of the substrate opposite to the front surface, a processing liquid configured to remove the rear surface film; and a foreign substance removing unit configured to move a brush along the rear surface of the substrate, while keeping the brush in contact with the rear surface of the substrate after being processed by the film removing unit.

Abstract: Provided is a headrest in which devices can be placed and which is easy to manufacture. A headrest comprises a pillar supported by a seat back on which the headrest is provided; a core supported by the pillar and having one or more receiving recesses recessed inward from an outer surface of the core; one or more devices, each device received in a corresponding receiving recess; and a skin material covering the core and the devices.

Abstract: Disclosed herein is an antenna module that includes a substrate, a coil pattern formed on the first surface of the substrate, and a magnetic member covering the second surface of the substrate and having a through hole formed therein. The coil pattern has first and second coil sections. The second coil section is disposed in the opening of the first coil section. The inner peripheral end of the first coil section is connected to the outer peripheral end of the second coil section. The second coil section has a first extending section extending along the first coil section and a second extending section protruding from the first extending section toward the through hole in a plan view and wound in an opposite direction to a winding direction of the first extending section in a state overlapping the through hole.

Abstract: A substrate processing apparatus according to an embodiment includes a cassette placing section, a processing unit, a transfer area, and an image capturing unit. On the cassette placing section, a cassette accommodating a plurality of substrates is placed. The processing unit washes or etches a peripheral portion of each substrate taken out from the cassette. The transfer area is interposed between the cassette placing section and the processing unit, and the substrate is transferred therein. The image capturing unit is disposed in the transfer area to capture an image of the substrate processed by the processing unit. The image includes both of (i) a peripheral portion of an upper surface or a lower surface of the substrate and (ii) an end face of the substrate.

Abstract: A belt unit includes a belt member, a cleaning member that scrapes off a developer being attached and carried on the belt member, a waste developer accommodation chamber that accommodates the developer as a waste developer, a waste developer carrying member that carries the waste developer accommodated in the waste developer accommodation chamber in correspondence with a rotation thereof; and a waste developer taking-up member that takes up the waste developer in correspondence with a rotation thereof and supplies the waste developer to a contact portion between the cleaning member and the belt member, wherein the waste developer taking-up member is composed with a shaft and a brush attached to the shaft.

Abstract: A belt unit includes a belt member, a cleaning member that scrapes off a developer being attached and carried on the belt member, a waste developer accommodation chamber that accommodates the developer as a waste developer, a waste developer carrying member that carries the waste developer accommodated in the waste developer accommodation chamber in correspondence with a rotation thereof; and a waste developer taking-up member that takes up the waste developer in correspondence with a rotation thereof and supplies the waste developer to a contact portion between the cleaning member and the belt member, wherein the waste developer taking-up member is composed with a shaft and a brush attached to the shaft.

Abstract: A substrate processing apparatus according to an embodiment includes a cassette placing section, a processing unit, a transfer area, and an image capturing unit. On the cassette placing section, a cassette accommodating a plurality of substrates is placed. The processing unit washes or etches a peripheral portion of each substrate taken out from the cassette. The transfer area is interposed between the cassette placing section and the processing unit, and the substrate is transferred therein. The image capturing unit is disposed in the transfer area to capture an image of the substrate processed by the processing unit. The image includes both of (i) a peripheral portion of an upper surface or a lower surface of the substrate and (ii) an end face of the substrate.

Abstract: Disclosed herein is antenna device that includes: a first metal member having a first main surface; a second metal member having a second main surface parallel to the first main surface; and an antenna coil having a coil axis perpendicular to the first and second main surfaces, wherein the first metal member constitutes at least a part of a housing of a portable electronic device in which the antenna coil is mounted, at least one slit is formed between the first and second metal members, an inner diameter section of the antenna coil overlaps with the slit in planar view, and the slit has a constant width at least in a region that overlaps with the antenna coil in planar view.

Abstract: Disclosed herein is antenna device that includes: a first metal member having a first main surface; a second metal member having a second main surface parallel to the first main surface; and an antenna coil having a coil axis perpendicular to the first and second main surfaces, wherein the first metal member constitutes at least a part of a housing of a portable electronic device in which the antenna coil is mounted, at least one slit is formed between the first and second metal members, an inner diameter section of the antenna coil overlaps with the slit in planar view, and the slit has a constant width at least in a region that overlaps with the antenna coil in planar view.

Abstract: There is provided a periphery coating method of coating a coating liquid on a periphery region of a substrate. The method includes performing a scan-in process of moving the coating liquid nozzle from an outside of an edge of the substrate to a position above the periphery region of the substrate while rotating the substrate and discharging the coating liquid from the coating liquid nozzle; and performing a scan-out process of moving the coating liquid nozzle from the position above the periphery region of the substrate to the outside of the edge of the substrate while rotating the substrate and discharging the coating liquid from the coating liquid nozzle. Further, in the scan-out process, the coating liquid nozzle is moved at a speed lower than a speed at which the coating liquid is moved to a side of an edge of the substrate.

Abstract: There is provided a periphery coating method of coating a coating liquid on a periphery region of a substrate. The method includes performing a scan-in process of moving the coating liquid nozzle from an outside of an edge of the substrate to a position above the periphery region of the substrate while rotating the substrate and discharging the coating liquid from the coating liquid nozzle; and performing a scan-out process of moving the coating liquid nozzle from the position above the periphery region of the substrate to the outside of the edge of the substrate while rotating the substrate and discharging the coating liquid from the coating liquid nozzle. Further, in the scan-out process, the coating liquid nozzle is moved at a speed lower than a speed at which the coating liquid is moved to a side of an edge of the substrate.

Abstract: A periphery coating unit performs a scan-in process of moving a resist liquid nozzle 27 from an outside of an edge Wb of a wafer W to a position above a periphery region Wc of the wafer W while rotating the wafer W and discharging a resist liquid from the resist liquid nozzle 27; and a scan-out process of moving the resist liquid nozzle 27 from the position above the periphery region Wc of the wafer W to the outside of the edge Wb of the wafer W while rotating the wafer W and discharging the resist liquid from the resist liquid nozzle 27. Further, in the scan-out process, the resist liquid nozzle 27 is moved at a speed v2 lower than a speed v3 at which the resist liquid is moved to a side of the edge Wb of the wafer W.

Abstract: A periphery coating unit performs a scan-in process of moving a resist liquid nozzle 27 from an outside of an edge Wb of a wafer W to a position above a periphery region Wc of the wafer W while rotating the wafer W and discharging a resist liquid from the resist liquid nozzle 27; and a scan-out process of moving the resist liquid nozzle 27 from the position above the periphery region Wc of the wafer W to the outside of the edge Wb of the wafer W while rotating the wafer W and discharging the resist liquid from the resist liquid nozzle 27. Further, in the scan-out process, the resist liquid nozzle 27 is moved at a speed v2 lower than a speed v3 at which the resist liquid is moved to a side of the edge Wb of the wafer W.