Abstract: When a stage increasing signal, which is input into a sub boosting circuit, is at the L level, three boosting stages are used within the sub boosting circuit to boost a supply potential. On the other hand, when the stage increasing signal is at an H level, four boosting stages are used within the sub boosting circuit to boost the supply potential. Thus, by the semiconductor integrated circuit device of the invention, an internal potential can be boosted at a high speed while power consumption can be reduced.

Abstract: A specific row of memory cells in a flash memory is set to be in a lock mode state, which affects reading of data in other rows of memory cells in a common memory array. Thus, a flash memory having a data concealing function is achieved.

Abstract: An internal voltage from an internal voltage generating circuit is transmitted to a pad in accordance with a control signal, and a buffer circuit coupled to the pad is set in an inactive state. The pad is connected to an external pin terminal via a bonding wire. Consequently, a semiconductor integrated circuit capable of monitoring and forcedly setting an internal voltage from an outside of the circuit device is realized with a minimum number of pin terminals without increasing the number of external pin terminals.

Abstract: When a stage increasing signal, which is input into a sub boosting circuit, is at the L level, three boosting stages are used within the sub boosting circuit to boost a supply potential. On the other hand, when the stage increasing signal is at an H level, four boosting stages are used within the sub boosting circuit to boost the supply potential. Thus, by the semiconductor integrated circuit device of the invention, an internal potential can be boosted at a high speed while power consumption can be reduced.

Abstract: A specific row of memory cells in a flash memory is set to be in a lock mode state, which affects reading of data in other rows of memory cells in a common memory array. Thus, a flash memory having a data concealing function is achieved.

Abstract: An internal voltage from an internal voltage generating circuit is transmitted to a pad in accordance with a control signal, and a buffer circuit coupled to the pad is set in an inactive state. The pad is connected to an external pin terminal via a bonding wire. Consequently, a semiconductor integrated circuit capable of monitoring and forcedly setting an internal voltage from an outside of the circuit device is realized with a minimum number of pin terminals without increasing the number of external pin terminals.

Abstract: An improved output driver circuit for a semiconductor integrated circuit device, wherein a stepped control voltage generation circuit is connected to the gate of a driving transistor for driving an output terminal DQ. The stepped control voltage generation circuit responds to an applied input data signal to provide a stepped control voltage changing in a stepped form including a plurality of steps to the gate of the driving transistor. The driving transistor therefore changes its state on a step by step basis from a cut off state to a conduction state. Thus, sharp change in output current flowing through the output terminal can be prevented, and noise caused by a parasitic inductance can be avoided, thus preventing an erroneous operation in the device.