Abstract: A composition having excellent curability and adhesive bonding ability is provided. A composition, comprising the following components (1) to (5): (1) a polymerizable vinyl monomer containing 10 to 70 parts by mass of (1-1), 10 to 60 parts by mass of (1-2), and 10 to 60 parts by mass of (1-3) based on 100 parts by mass of (1) the polymerizable vinyl monomer, in which (1-1) is a (meth)acrylic monomer represented by the formula (A) Formula (A) Z—O—R1 (wherein, Z represents a (meth)acryloyl group, and R1 represents an alkyl group.

Abstract: A photocurable composition for three-dimensional modeling capable of high-speed modeling, a three-dimensional modeled object using the composition, and a method for producing the three-dimensional modeled object is provided. A photocurable composition for three-dimensional modeling, comprising a polymerizable organic compound component is provided. The photocurable composition has a steady flow viscosity of 30,000 mPa s or less measured with a rotary rheometer at 25° C. and a shear rate of 0.01 per second. When the photocurable composition for three-dimensional modeling is irradiated with a light having a light intensity of 1.3 mW/cm2, G? becomes 1×106 Pa or more after a start of photopolymerization in an integrated light irradiation time of 4 seconds or less. After the start of photopolymerization, a maximum value of tan ? on and after a gel point is 0.5 or more. The gel point is the point where G?=G? is satisfied for the first time after the start of photopolymerization.

Abstract: A thermoelectric conversion element includes a first thermoelectric conversion module and a first substrate including a first main face and a second main face, a first electrode provided on the first main face, a first n-type thermoelectric conversion layer, a first p-type thermoelectric conversion layer in contact with the first n-type thermoelectric conversion layer, and a second electrode, and a sealing layer provided on the first main face. Each of the pair of sheet members of the thermoelectric conversion element includes a first high thermal conduction portion, a second high thermal conduction portion, and a low thermal conduction portion. The first electrode, the first n-type thermoelectric conversion layer, the first p-type thermoelectric conversion layer, and the second electrode are arranged in order along the alignment direction.

Abstract: A thermoelectric conversion element includes a substrate having a first main face and a second main face, a first electrode, an n-type thermoelectric conversion layer, a p-type thermoelectric conversion layer, and a second electrode provided on the first main face, a sealing layer provided on the first main face, and a first high thermal conduction portion, a second high thermal conduction portion, and a low thermal conduction portion provided on the second main face. The first electrode, the n-type thermoelectric conversion layer, the p-type thermoelectric conversion layer, and the second electrode are arranged, the first electrode is overlapped with the first high thermal conduction portion the second electrode is overlapped with the second high thermal conduction portion, and a contact portion of the n-type thermoelectric conversion layer and the p-type thermoelectric conversion layer is overlapped with the low thermal conduction portion.

Abstract: A photocurable composition for three-dimensional modeling capable of high-speed modeling, a three-dimensional modeled object using the composition, and a method for producing the three-dimensional modeled object is provided. A photocurable composition for three-dimensional modeling, comprising a polymerizable organic compound component is provided. The photocurable composition has a steady flow viscosity of 30,000 mPa s or less measured with a rotary rheometer at 25° C. and a shear rate of 0.01 per second. When the photocurable composition for three-dimensional modeling is irradiated with a light having a light intensity of 1.3 mW/cm2, G? becomes 1×106 Pa or more after a start of photopolymerization in an integrated light irradiation time of 4 seconds or less. After the start of photopolymerization, a maximum value of tan ? on and after a gel point is 0.5 or more. The gel point is the point where G?=G? is satisfied for the first time after the start of photopolymerization.

Abstract: A composition for temporary bonding, including the following (A) to (C). An adhesive for temporary bonding for manufacturing an electronic device, including the composition for temporary bonding. (A) A (meth)acrylate comprising the following (A-1) and (A-2): (A-1) a monofunctional (meth)acrylate whose homopolymer has a Tg of ?100° C. to 60° C., and (A-2) a polyfunctional (meth)acrylate; (B) a polyisobutene homopolymer; and (C) a photo radical polymerization initiator.

Abstract: A memory includes a plurality of memory dies that includes a plurality of memory regions stacked on each other, the plurality of memory regions including a memory cell region that stores data and a redundant cell region that stores data as an alternative when a part of the memory cell region fails; a multiplexer that outputs data supplied to a local memory region or data supplied to another memory region to the redundant cell region of the local memory region on a basis of an input selection signal from outside; and a selector that outputs data output from the redundant cell region of the local memory region or data output from the redundant cell region of the other memory region to a data terminal of the local memory region on a basis of an output selection signal from outside.

Abstract: An object of the present invention is to provide a two-part composition containing a first agent and a second agent: the first agent comprising (1) (meth)acrylate and (2) organoboron compound, and having an oxygen content of 5 ppm or less, and the second agent comprising (3) phosphate ester.

Abstract: A composition having excellent curability and adhesive bonding ability is provided. A composition, comprising the following components (1) to (5): (1) a polymerizable vinyl monomer containing 10 to 70 parts by mass of (1-1), 10 to 60 parts by mass of (1-2), and 10 to 60 parts by mass of (1-3) based on 100 parts by mass of (1) the polymerizable vinyl monomer, in which (1-1) is a (meth)acrylic monomer represented by the formula (A) Formula (A) Z—O—R1 (wherein, Z represents a (meth)acryloyl group, and R1 represents an alkyl group.

Abstract: A resin composition is provided that is capable of inhibiting degradation of the organic EL device. The resin composition, includes: (A) an alicyclic epoxy compound; (B) a bisphenol A epoxy resin; (C) a bisphenol F epoxy resin; and (D) a photocationic polymerization initiator. The bisphenol A epoxy resin (B) and the bisphenol F epoxy resin (C) are compounds not having the alicyclic epoxy compound (A) and the resin composition has a moisture content of 1000 ppm or less. Alternatively, the resin composition may further include a filler (H) and may have a moisture content of 50 ppm or more.

Abstract: A two-component (meth) acrylic adhesive excellent in peel strength at low temperature and impact resistance is provided. A composition comprising components of (1) to (4): (1) a polymerizable vinyl monomer comprising (1-1) to (1-4); (2) a polymerization initiator; (3) a reducing agent; and (4) an elastomer having no polymerizable unsaturated double bond at the end and having 10 to 30 mol % of a (meth) acrylonitrile. A composition comprising components of (1) to (4): (1) a polymerizable vinyl monomer comprising (1-1) to (1-4); (2) a polymerization initiator; (3) a reducing agent; (4) an elastomer having a polymerizable unsaturated double bond at the end and having 10 to 30 mol % of a (meth) acrylonitrile; and (5) an elastomer having no polymerizable unsaturated double bond at the end.

Abstract: A memory device includes a memory, and a processor coupled to the memory and configured to hold memory information corresponding to the memory, access information corresponding to access to the memory, and storage information indicating a storage area of the access information, extract, based on the storage information, an access information code including the access information, output the memory information in response to a read request from an external, and output the extracted access information code in response to an acknowledgment received from the external corresponding to the memory information.

Abstract: Provided is a resin composition comprising (A) an epoxy compound, (B) an epoxy resin, and (C) a photocationic polymerization initiator. Preferably, this resin composition has a moisture content of 1000 ppm or less and a chlorine content of 1000 ppm or less. This resin composition is an energy beam-curable resin composition having accurate coating properties, excellent adhesiveness, low moisture permeability, excellent adhesive durability, and excellent storage stability.

Abstract: A semiconductor device in which a plurality of chips each including a memory circuit are stacked, the semiconductor device includes measurement circuitry each of which is disposed in each of a plurality of memory areas of the plurality of chips and each of which measures a temperature, calculation circuitry that calculates a temperature of each of the memory areas based on the temperature measured by the measurement circuitry and a temperature obtained from a thermal resistance model of the semiconductor device, and control circuitry that sets a refresh interval of each of the memory areas based on the temperature of each of the memory areas, which has been calculated by the calculation circuitry, and performs a refresh operation of the memory circuit of each of the memory areas at the set refresh interval.

Abstract: A two-component (meth) acrylic adhesive excellent in peel strength at low temperature and impact resistance is provided. A composition comprising components of (1) to (4): (1) a polymerizable vinyl monomer comprising (1-1) to (1-4); (2) a polymerization initiator; (3) a reducing agent; and (4) an elastomer having no polymerizable unsaturated double bond at the end and having 10 to 30 mol % of a (meth) acrylonitrile. A composition comprising components of (1) to (4): (1) a polymerizable vinyl monomer comprising (1-1) to (1-4); (2) a polymerization initiator; (3) a reducing agent; (4) an elastomer having a polymerizable unsaturated double bond at the end and having 10 to 30 mol % of a (meth) acrylonitrile; and (5) an elastomer having no polymerizable unsaturated double bond at the end.

Abstract: A semiconductor device in which a plurality of chips each including a memory circuit are stacked, the semiconductor device includes measurement circuitry each of which is disposed in each of a plurality of memory areas of the plurality of chips and each of which measures a temperature, calculation circuitry that calculates a temperature of each of the memory areas based on the temperature measured by the measurement circuitry and a temperature obtained from a thermal resistance model of the semiconductor device, and control circuitry that sets a refresh interval of each of the memory areas based on the temperature of each of the memory areas, which has been calculated by the calculation circuitry, and performs a refresh operation of the memory circuit of each of the memory areas at the set refresh interval.

Abstract: A memory apparatus, includes: a memory including memory regions; a table storing a memory address and a number of reading times of data; a first buffer storing first data from another memory apparatus and a first memory address of the first data; a second buffer storing second data to the another memory apparatus and a second memory address of the second data; and a controller configured to store, when a first number of reading times being minimum in the table is smaller than a second number of reading times of the first data, the first data and the first memory address into the first buffer and outputs third data in a memory region of the first number and a third memory address of the third data to the another memory apparatus via the second buffer, and rewrites the third data and memory address with the first data and memory address.

Abstract: A memory device includes a memory, and a processor coupled to the memory and configured to hold memory information corresponding to the memory, access information corresponding to access to the memory, and storage information indicating a storage area of the access information, extract, based on the storage information, an access information code including the access information, output the memory information in response to a read request from an external, and output the extracted access information code in response to an acknowledgment received from the external corresponding to the memory information.

Abstract: A resin composition is provided that is capable of inhibiting degradation of the organic EL device. The resin composition, includes: (A) an alicyclic epoxy compound; (B) a bisphenol A epoxy resin; (C) a bisphenol F epoxy resin; and (D) a photocationic polymerization initiator. The bisphenol A epoxy resin (B) and the bisphenol F epoxy resin (C) are compounds not having the alicyclic epoxy compound (A) and the resin composition has a moisture content of 1000 ppm or less. Alternatively, the resin composition may further include a filler (H) and may have a moisture content of 50 ppm or more.

Abstract: A memory apparatus, includes: a memory including memory regions; a table storing a memory address and a number of reading times of data; a first buffer storing first data from another memory apparatus and a first memory address of the first data; a second buffer storing second data to the another memory apparatus and a second memory address of the second data; and a controller configured to store, when a first number of reading times being minimum in the table is smaller than a second number of reading times of the first data, the first data and the first memory address into the first buffer and outputs third data in a memory region of the first number and a third memory address of the third data to the another memory apparatus via the second buffer, and rewrites the third data and memory address with the first data and memory address.