Abstract: An information processing apparatus (10) includes a time and space information acquisition unit (110) that acquires high-risk time and space information indicating a spatial region with an increased possibility of an accident occurring or of a crime being committed and a corresponding time slot, a possible surveillance target acquisition unit (120) that identifies a video to be analyzed from among a plurality of videos generated by capturing an image of each of a plurality of places, on the basis of the high-risk time and space information, and analyzes the identified video to acquire information of a possible surveillance target, and a target time and space identification unit (130) that identifies at least one of a spatial region where surveillance is to be conducted which is at least a portion of the spatial region or a time slot when surveillance is to be conducted, from among the spatial region and the time slot indicated by the high-risk time and space information, on the basis of the information of the

Abstract: An information processing apparatus (10) includes a time and space information acquisition unit (110) that acquires high-risk time and space information indicating a spatial region with an increased possibility of an accident occurring or of a crime being committed and a corresponding time slot, a possible surveillance target acquisition unit (120) that identifies a video to be analyzed from among a plurality of videos generated by capturing an image of each of a plurality of places, on the basis of the high-risk time and space information, and analyzes the identified video to acquire information of a possible surveillance target, and a target time and space identification unit (130) that identifies at least one of a spatial region where surveillance is to be conducted which is at least a portion of the spatial region or a time slot when surveillance is to be conducted, from among the spatial region and the time slot indicated by the high-risk time and space information, on the basis of the information of the

Abstract: The power conversion device includes a semiconductor module having a connection terminal, a cooler, a control board, a capacitor module, a cover, a case, and a connection busbar. The semiconductor module, the cooler, the control board, and the capacitor module are arranged in an overlapped manner as seen in the direction perpendicular to the top surface of the cooler. The capacitor module has a capacitor cell, a capacitor case, resin, and a capacitor busbar. The capacitor busbar has an inner extending portion, an opening-side extending portion, and an outer extending portion. The connection busbar extends from the connection terminal of the semiconductor module to an outer surface of the outer extending portion and has a part extending in parallel to the extending direction of the outer extending portion. The connection busbar has a capacitor connection portion at an end thereof on the outer extending portion side.

Abstract: In a power conversion device, a semiconductor module, a bus bar assembly, and a smoothing capacitor are superposed on a cooler in the stated order from the cooler side. At least one of a cooling column-equipped member, which is at least one of the smoothing capacitor and the bus bar assembly, and the cooler is provided with a cooling column configured to transfer heat of the cooling column-equipped member to the cooler.

Abstract: The power conversion device includes a semiconductor module having a connection terminal, a cooler, a control board, a capacitor module, a cover, a case, and a connection busbar. The semiconductor module, the cooler, the control board, and the capacitor module are arranged in an overlapped manner as seen in the direction perpendicular to the top surface of the cooler. The capacitor module has a capacitor cell, a capacitor case, resin, and a capacitor busbar. The capacitor busbar has an inner extending portion, an opening-side extending portion, and an outer extending portion. The connection busbar extends from the connection terminal of the semiconductor module to an outer surface of the outer extending portion and has a part extending in parallel to the extending direction of the outer extending portion. The connection busbar has a capacitor connection portion at an end thereof on the outer extending portion side.

Abstract: A connector cover (1) for protecting a wire (80) extending rearward from a connector (100) includes a cover body (10) mountable to extend rearwardly of the connector (100) and fixed to the connector (100), a rear cover (50) disposed behind the cover body (10), a coupling (70) coupling the rear cover (50) and the cover body (10), and extending shape holding portions (60) capable of holding the rear cover (50) in a rearward extending state to extend rearwardly of the connector (100). The rear cover (50) transitions to a rearward extension released state where the rearward extending state is released by being laterally pushed by the wire (80).

Abstract: A connector cover (1) for protecting a wire (80) extending rearward from a connector (100) includes a cover body (10) mountable to extend rearwardly of the connector (100) and fixed to the connector (100), a rear cover (50) disposed behind the cover body (10), a coupling (70) coupling the rear cover (50) and the cover body (10), and extending shape holding portions (60) capable of holding the rear cover (50) in a rearward extending state to extend rearwardly of the connector (100). The rear cover (50) transitions to a rearward extension released state where the rearward extending state is released by being laterally pushed by the wire (80).