Abstract: An electronic component device includes an electronic component element including a lower surface having a metal surface provided thereon, a metal plate arranged so that a first principal surface thereof faces the lower surface of the electronic component element, and a first solder provided between the lower surface of the electronic component element and the first principal surface of the metal plate, the first solder arranged to connect the electronic component element to the metal plate. At least a portion of a peripheral portion of the first principal surface of the metal plate is located outwardly beyond an outer periphery of the lower surface of the electronic component element. A ridge defined by the first solder is provided in the peripheral portion of the first principal surface of the metal plate along the outer periphery of the lower surface of the electronic component element.

Abstract: An electronic component comprises a substrate having a surface on which an electrode is formed and an SAW circuit element having a surface on which a circuit is formed. The circuit element is held such that the surface of the circuit element and the surface of the substrate are opposed to each other. A bump electrode joins the circuit on the circuit element and the electrode of the substrate together, and a sealing material joins the circuit element and the substrate together in the periphery of the space between the circuit-forming surface of the circuit element and the substrate. The space between the circuit-forming surface of the circuit element and the substrate is hermetically sealed by the circuit element, the substrate, and the sealing material. Advantageously, a low-temperature soldering material such as solder, or an adhesive, is used as the sealing material.

Abstract: A surface acoustic wave device includes a surface acoustic wave substrate having two IDT electrodes including wiring electrode portions made of aluminum disposed thereon. First, second and third metal films are laminated on each of the wiring electrode portions. The first metal film has superior bondability to aluminum, and the third metal film has superior bondability to bumps. In addition, the second metal film has an ability to suppress the diffusion of the metal defining the first metal film.

Abstract: An electronic component comprises a substrate having a surface on which an electrode is formed and an SAW circuit element having a surface on which a circuit is formed. The circuit element is held such that the surface of the circuit element and the surface of the substrate are opposed to each other. A bump electrode joins the circuit on the circuit element and the electrode of the substrate together, and a sealing material joins the circuit element and the substrate together in the periphery of the space between the circuit-forming surface of the circuit element and the substrate. The space between the circuit-forming surface of the circuit element and the substrate is hermetically sealed by the circuit element, the substrate, and the sealing material. Advantageously, a low-temperature soldering material such as solder, or an adhesive, is used as the sealing material.

Abstract: An electronic component comprises a substrate having a surface on which an electrode is formed and an SAW circuit element having a surface on which a circuit is formed. The circuit element is held such that the surface of the circuit element and the surface of the substrate are opposed to each other. A bump electrode joins the circuit on the circuit element and the electrode of the substrate together, and a sealing material joins the circuit element and the substrate together in the periphery of the space between the circuit-forming surface of the circuit element and the substrate. The space between the circuit-forming surface of the circuit element and the substrate is hermetically sealed by the circuit element, the substrate, and the sealing material. Advantageously, a low-temperature soldering material such as solder, or an adhesive, is used as the sealing material.

Abstract: An electronic circuit device is provided which can avoid unnecessary spreading of a sealing resin and on which components can be mounted at a high mounting density. An enclosure for preventing the resin from flowing outside its intended boundaries and having a larger size than a chip in a chip mounting area of a circuit board is formed. The chip is mounted in a face-down orientation in the chip mounting area enclosed by the enclosure. A sealing resin is cast through a gate for casting a resin and introduced into the gap between the chip and the circuit board. It can be judged whether the charging of the resin has been completed or not, by checking the flowing of the resin into the groove.

Abstract: A surface acoustic wave device includes a surface acoustic wave substrate having two IDT electrodes including wiring electrode portions made of aluminum disposed thereon. First, second and third metal films are laminated on each of the wiring electrode portions. The first metal film has superior bondability to aluminum, and the third metal film has superior bondability to bumps. In addition, the second metal film has an ability to suppress the diffusion of the metal defining the first metal film.

Abstract: An electronic circuit device is provided which can avoid unnecessary spreading of a sealing resin and on which components can be mounted at a high mounting density. An enclosure for preventing the resin from flowing outside its intended boundaries and having a larger size than a chip in a chip mounting area of a circuit board is formed. The chip is mounted in a face-down orientation in the chip mounting area enclosed by the enclosure. A sealing resin is cast through a gate for casting a resin and introduced into the gap between the chip and the circuit board. It can be judged whether the charging of the resin has been completed or not, by checking the flowing of the resin into the groove.

Abstract: A mounting arrangement of a chip type component onto a printed circuit board, which includes a chip type component having terminal electrodes at its opposite end portions, and land portions provided on a printed circuit board so as to fix the chip type component on them by soldering through cream type solder applied onto the land portions. The land portions are each formed to have such a length as will not project externally in a longitudinal direction of the chip type component.