Patents by Inventor Yoshitsugu Kato

Yoshitsugu Kato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070114642
    Abstract: A semiconductor element has a circuit formation surface on which electrode terminals are arranged in a peripheral part thereof. The semiconductor element is encapsulated by a mold resin on a substrate which has openings at positions corresponding to the electrodes of the semiconductor element. The semiconductor element is mounted to the substrate in a state where the circuit formation surface faces the substrate and the electrode terminals are positioned at the openings and a back surface opposite to the circuit formation surface of the semiconductor element is exposed from the mold resin. A heat-emitting member formed of a metal plate is provided on a surface of the substrate opposite to a surface on which the semiconductor element is mounted. The surface of the heat-emitting member being exposed from the mold resin.
    Type: Application
    Filed: January 19, 2007
    Publication date: May 24, 2007
    Applicant: FUJITSU LIMITED
    Inventors: Sumikazu Hosoyamada, Yoshitsugu Kato, Mitsuo Abe, Kazuto Tsuji, Masaharu Minamizawa, Toshio Hamano, Toshiyuki Honda, Katsuro Hiraiwa, Masashi Takenaka
  • Patent number: 7216044
    Abstract: A battery state diagnosing device applies load to a battery from a load applying section, measures input and output characteristics of the battery, and diagnoses a state of the battery by plugging a result of measurement into a mathematical expression obtained by a system identification method. In the battery state diagnosing device, a current load is used as the load applying section. With this arrangement, the battery state diagnosing device is capable of suitably determining, for example, life and state-of-charge of the battery.
    Type: Grant
    Filed: August 28, 2003
    Date of Patent: May 8, 2007
    Assignee: ESPEC Corporation
    Inventors: Yoshitsugu Kato, Hirohito Funato, Alexandru Forrai
  • Patent number: 7193320
    Abstract: A semiconductor element has a circuit formation surface on which electrode terminals are arranged in a peripheral part thereof. The semiconductor element is encapsulated by a mold resin on a substrate which has openings at positions corresponding to the electrodes of the semiconductor element. The semiconductor element is mounted to the substrate in a state where the circuit formation surface faces the substrate and the electrode terminals are positioned at the openings and a back surface opposite to the circuit formation surface of the semiconductor element is exposed from the mold resin. A heat-emitting member formed of a metal plate is provided on a surface of the substrate opposite to a surface on which the semiconductor element is mounted. The surface of the heat-emitting member being exposed from the mold resin.
    Type: Grant
    Filed: January 28, 2003
    Date of Patent: March 20, 2007
    Assignee: Fujitsu Limited
    Inventors: Sumikazu Hosoyamada, Yoshitsugu Kato, Mitsuo Abe, Kazuto Tsuji, Masaharu Minamizawa, Toshio Hamano, Toshiyuki Honda, Katsuro Hiraiwa, Masashi Takenaka
  • Publication number: 20040158418
    Abstract: A battery state diagnosing device applies load to a battery from a load applying section, measures input and output characteristics of the battery, and diagnoses a state of the battery by plugging a result of measurement into a mathematical expression obtained by a system identification method. In the battery state diagnosing device, a current load is used as the load applying section. With this arrangement, the battery state diagnosing device is capable of suitably determining, for example, life and state-of-charge of the battery.
    Type: Application
    Filed: August 28, 2003
    Publication date: August 12, 2004
    Applicant: ESPEC CORP.
    Inventors: Yoshitsugu Kato, Hirohito Funato, Alexandru Forrai
  • Publication number: 20030222344
    Abstract: A semiconductor element has a circuit formation surface on which electrode terminals are arranged in a peripheral part thereof. The semiconductor element is encapsulated by a mold resin on a substrate which has openings at positions corresponding to the electrodes of the semiconductor element. The semiconductor element is mounted to the substrate in a state where the circuit formation surface faces the substrate and the electrode terminals are positioned at the openings and a back surface opposite to the circuit formation surface of the semiconductor element is exposed from the mold resin. A heat-emitting member formed of a metal plate is provided on a surface of the substrate opposite to a surface on which the semiconductor element is mounted. The surface of the heat-emitting member being exposed from the mold resin.
    Type: Application
    Filed: January 28, 2003
    Publication date: December 4, 2003
    Applicant: FUJITSU LIMITED
    Inventors: Sumikazu Hosoyamada, Yoshitsugu Kato, Mitsuo Abe, Kazuto Tsuji, Masaharu Minamizawa, Toshio Hamano, Toshiyuki Honda, Katsuro Hiraiwa, Masashi Takenaka
  • Patent number: 6391383
    Abstract: A high emittance glass coating material which is applied to a surface of a specific structural body and fired on the surface, for providing on the surface a glass coating having a glass structure in which pigment particles having a predetermined degree of emissivity are dispersed, the high emittance glass coating material being characterized by including: a pigment covering film having a predetermined thickness, which is provided to cover each of the pigment particles, and which includes silicon dioxide (SiO2) such that a content of the silicon dioxide in the pigment covering film is higher than a content of the silicon dioxide in each portion of the glass structure which is adjacent to a corresponding one of the pigment particles.
    Type: Grant
    Filed: November 27, 1998
    Date of Patent: May 21, 2002
    Assignee: Noritake Co., Ltd.
    Inventors: Hirokazu Matsunaga, Misao Iwata, Shinji Kato, Kenji Yano, Kazuhiro Horimi, Yoshitsugu Kato, Takamitsu Isogai, Masakazu Hiyoshi, Takamitsu Fukui
  • Patent number: 5376599
    Abstract: Carbon fiber reinforced silicon nitride based nanocomposite material is produced by mixing a powder mixture of silicon nitride powders (with or without alumina powders), and fine silicon carbide powders, with a solution of a preceramic polymer containing silicon and nitrogen, to form a solution for impregnation, by passing carbon fibers through the solution to produce a mass of impregnated carbon fibers, forming the mass to a desired shape and by sintering in an inert atmosphere. Ultra-high strength and toughness are produced due to reinforcement by nanocompositization of the matrix phase, that by dispersion of fine particles and that by long carbon fibers, part of matrix phase is generated by thermal cracking of preceramic polymer.
    Type: Grant
    Filed: October 13, 1992
    Date of Patent: December 27, 1994
    Assignees: Noritake Co., Limited, Koichi Niihara
    Inventors: Kenji Oshima, Tsugio Ito, Yoshitsugu Kato, Koichi Niihara, Atsushi Nakahira, Misao Iwata