Patents by Inventor Yoshitsugu Katoh
Yoshitsugu Katoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7692294Abstract: A semiconductor device with a structure having superior heat sink characteristics. A first heat sink member is located over a wiring board by using an adhesive material. A semiconductor element is stuck over the first heat sink member by using an adhesive material. The semiconductor element and electrodes located over the wiring board are connected by wires. A second heat sink member which covers the semiconductor element and the wires is joined to the first heat sink member by using a conductive adhesive material. The inside and outside of the second heat sink member are sealed by resin except a flat top thereof. By doing so, the semiconductor device is fabricated. Heat which is generated in the semiconductor element and which is transmitted to the first heat sink member is released from an edge portion of the first heat sink member.Type: GrantFiled: August 23, 2007Date of Patent: April 6, 2010Assignee: Fujitsu Microelectronics LimitedInventors: Yoshitsugu Katoh, Tetsuya Fujisawa, Mitsutaka Sato, Eiji Yoshida
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Patent number: 7682140Abstract: A mold includes a pot for accommodating resin, a cavity for accommodating a semiconductor chip to be resin-molded and a runner as a resin passage for transporting the resin accommodated in the pot to the cavity. A foreign matter retention pocket is disposed which is a recess formed by digging further a partial inner surface of the runner. A runner magnet attracts and attaches a metallic foreign matter contained in fluid transported in the runner to the inner surface of the foreign matter retention pocket.Type: GrantFiled: January 22, 2007Date of Patent: March 23, 2010Assignee: Fujitsu Microelectronics LimitedInventors: Futoshi Fukaya, Yoshitsugu Katoh
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Publication number: 20080067672Abstract: A semiconductor device with a structure having superior heat sink characteristics. A first heat sink member is located over a wiring board by using an adhesive material. A semiconductor element is stuck over the first heat sink member by using an adhesive material. The semiconductor element and electrodes located over the wiring board are connected by wires. A second heat sink member which covers the semiconductor element and the wires is joined to the first heat sink member by using a conductive adhesive material. The inside and outside of the second heat sink member are sealed by resin except a flat top thereof. By doing so, the semiconductor device is fabricated. Heat which is generated in the semiconductor element and which is transmitted to the first heat sink member is released from an edge portion of the first heat sink member.Type: ApplicationFiled: August 23, 2007Publication date: March 20, 2008Applicant: FUJITSU LIMITEDInventors: Yoshitsugu KATOH, Tetsuya FUJISAWA, Mitsutaka SATO, Eiji YOSHIDA
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Publication number: 20070231956Abstract: A mold includes a pot for accommodating resin, a cavity for accommodating a semiconductor chip to be resin-molded and a runner as a resin passage for transporting the resin accommodated in the pot to the cavity. A foreign matter retention pocket is disposed which is a recess formed by digging further a partial inner surface of the runner. A runner magnet attracts and attaches a metallic foreign matter contained in fluid transported in the runner to the inner surface of the foreign matter retention pocket.Type: ApplicationFiled: January 22, 2007Publication date: October 4, 2007Applicant: FUJITSU LIMITEDInventors: Futoshi Fukaya, Yoshitsugu Katoh
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Patent number: 6796024Abstract: According to the method of producing a semiconductor device, the substrate is provided with an opening formed at a substantially central position, interconnections and joining parts. The heat spreading plate has a fixed portion fixed to the substrate, a stage portion caved with respect to the fixed potion and connecting portions connecting the fixed portion and the stage portion. The heat spreading plate is fixed by positioning the stage portion at a position opposing the opening, then the heat spreading plate is welded to the substrate and the semiconductor chip is mounted on the stage portion through the opening. Then the semiconductor chip and interconnections formed on the substrate are electrically connected and sealing resin is formed on both sides of the heat spreading plate such that at least the semiconductor chip is sealed.Type: GrantFiled: March 20, 2003Date of Patent: September 28, 2004Assignee: Fujitsu LimitedInventors: Yoshitsugu Katoh, Mitsuo Abe, Yoshihiko Ikemoto, Sumikazu Hosoyamada
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Publication number: 20030161112Abstract: A semiconductor device includes a semiconductor chip, a substrate electrically connected to the semiconductor chip and heat spreading plate thermally connected to the semiconductor chip. The substrate is provided with external connection terminals on a first surface and electrically connects the semiconductor chip and the external connection terminals. The substrate is provided with joining parts made of metal on a second surface. The heat spreading plate and the substrate are joined together by welding the joining parts and the heat spreading plate.Type: ApplicationFiled: March 20, 2003Publication date: August 28, 2003Applicant: FUJITSU LIMITEDInventors: Yoshitsugu Katoh, Mitsuo Abe, Yoshihiko Ikemoto, Sumikazu Hosoyamada
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Patent number: 6559536Abstract: A semiconductor device includes a semiconductor chip, a substrate electrically connected to the semiconductor chip and heat spreading plate thermally connected to the semiconductor chip. The substrate is provided with external connection terminals on a first surface and electrically connects the semiconductor chip and the external connection terminals. The substrate is provided with joining , parts made of metal on a second surface. The heat spreading plate and the substrate are joined together by welding the joining parts and the heat spreading plate.Type: GrantFiled: July 7, 2000Date of Patent: May 6, 2003Assignee: Fujitsu LimitedInventors: Yoshitsugu Katoh, Mitsuo Abe, Yoshihiko Ikemoto, Sumikazu Hosoyamada
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Patent number: 6433418Abstract: A semiconductor device includes a resin package in which a semiconductor chip is sealed, the resin package having a first surface and a second surface opposite to the first surface; a plurality of leads having inner lead parts connected to the semiconductor chip and outer lead parts extending outside the resin package, the outer lead parts being bent along the shape of the resin package so as to form first terminal parts on the second surface and second terminal parts on the first surface; connection means electrically connecting the semiconductor chip and the leads; and a positioning mechanism provided either on the leads or on the resin package, which positions the outer lead parts by engaging a part of the outer lead parts to the resin package. Further, at least one of the leads and/or connection means is cut so as to electrically disconnect the semiconductor chip and the one of the leads and/or connection elements.Type: GrantFiled: April 29, 1999Date of Patent: August 13, 2002Assignee: Fujitsu LimitedInventors: Tetsuya Fujisawa, Mitsutaka Sato, Seiichi Orimo, Kazuhiko Mitobe, Masaaki Seki, Masaki Waki, Toshio Hamano, Katsuhiro Hayashida, Yoshitsugu Katoh, Hiroshi Inoue
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Patent number: 6424032Abstract: In a semiconductor device, an influence of the simultaneous switching noise is reduced by increasing the decoupling capacity between a ground ring and a power supply ring. A semiconductor element having a plurality of electrode pads is mounted on a redistribution substrate. The power supply ring and the ground ring are formed on the redistribution substrate in a surrounding area of the semiconductor element. One of the ground ring and the power supply ring has a plurality of convex portions protruding toward the other of the ground ring and the power supply ring. The other of the ground ring and the power supply ring has a plurality of concave portions each of which receives the corresponding one of the convex portions with a predetermined distance therebetween.Type: GrantFiled: August 23, 2000Date of Patent: July 23, 2002Assignee: Fujitsu LimitedInventors: Yoshihiko Ikemoto, Mitsuo Abe, Yoshitsugu Katoh, Sumikazu Hosoyamada
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Patent number: 6333564Abstract: A semiconductor device and a method of producing the same, the device including a semiconductor chip; balls which function as external connecting terminals; a substrate which electrically connects the semiconductor chip and the balls; a mold resin which seals at least a part of the semiconductor chip; and a connecting portion sealing resin which seals the connecting portion between the substrate and the semiconductor chip. The semiconductor device is mounted onto a printed circuit board via the balls. The thermal expansion coefficient of the mold resin is matched with the thermal expansion coefficient of the printed circuit board. A side surface holding portion for the holding the side surfaces of the semiconductor chip is formed in the mold resin to restrict thermal deformation of the semiconductor chip.Type: GrantFiled: June 21, 1999Date of Patent: December 25, 2001Assignee: Fujitsu LimitedInventors: Yoshitsugu Katoh, Mitsutaka Sato, Hiroshi Inoue, Seiichi Orimo, Akira Okada, Yoshihiro Kubota, Mitsuo Abe, Toshio Hamano, Yoshitaka Aiba, Tetsuya Fujisawa, Masaaki Seki, Noriaki Shiba
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Publication number: 20010052653Abstract: A semiconductor device and a method of producing the semiconductor device are provided. This semiconductor device includes a semiconductor chip, a printed wiring board, a heat spreader, a sealing resin, and solder balls. The printed wiring board is provided with the solder balls on an outer portion and a wiring layer on an inner portion. Wires are bonded to the wiring layer, and an opening is formed in the center of the printed wiring board. The heat spreader is bonded to the printed wiring board, with the semiconductor chip being thermally connected to the stage portion of the heat spreader. The sealing resin is made up of a first sealing resin portion and a second sealing resin portion. The first and second sealing resin portions sandwich the heat spreader.Type: ApplicationFiled: July 13, 2001Publication date: December 20, 2001Inventors: Mitsuo Abe, Yoshihiro Kubota, Yoshitsugu Katoh, Michio Hayakawa, Ryuji Nomoto, Mitsutaka Sato, Seiichi Orimo, Hiroshi Inoue, Toshio Hamano
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Publication number: 20010045643Abstract: A semiconductor device includes an elastic member which has an adhesive contact with at least one other member. The adhesive contact forces said elastic member to stay in a deformed shape different from an original shape to which said elastic member tries to return, wherein a force generated by said elastic member trying to return to the original shape serves to counteract a heat-generated stress applied to said semiconductor device.Type: ApplicationFiled: March 25, 1999Publication date: November 29, 2001Inventors: YOSHITSUGU KATOH, SHINYA NAKASEKO, TAKASHI HOZUMI
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Patent number: 6288444Abstract: A semiconductor device and a method of producing the semiconductor device are provided. This semiconductor device includes a semiconductor chip, a printed wiring board, a heat spreader, a sealing resin, and solder balls. The printed wiring board is provided with the solder balls on an outer portion and a wiring layer on an inner portion. Wires are bonded to the wiring layer, and an opening is formed in the center of the printed wiring board. The heat spreader is bonded to the printed wiring board, with the semiconductor chip being thermally connected to the stage portion of the heat spreader. The sealing resin is made up of a first sealing resin portion and a second sealing resin portion. The first and second sealing resin portions sandwich the heat spreader.Type: GrantFiled: June 4, 1999Date of Patent: September 11, 2001Assignee: Fujitsu LimitedInventors: Mitsuo Abe, Yoshihiro Kubota, Yoshitsugu Katoh, Michio Hayakawa, Ryuji Nomoto, Mitsutaka Sato, Seiichi Orimo, Hiroshi Inoue, Toshio Hamano