Abstract: A curable silicone composition containing an organopolysiloxane that contains in one molecule at least one epoxy-containing organic group, has a polystyrene-referenced weight-average molecular weight at least 500, and is expressed by the following general unit formula: (RSiO3/2)x[R1aSiO(4-a)/2]y (where R represents a cycloalkyl group, and R1 represents hydrogen atom or a univalent organic group, except for an aromatic group and a cycloalkyl group, at least one R1 in one molecule being an epoxy-containing univalent organic group, and where the following condition is observed: 0<a?3; x>0; y>0; and x+y=1).

Abstract: A composite cured silicone powder comprising: cured silicone powder (A) that has an average particle size of 0.1 to 500 micrometers; an inorganic fine powder (B) coated on the surface of said cured silicone powder (A); and a surface-active agent (C) coated on the surface of said inorganic fine powder (B); a method for producing the composite cured silicone powder which comprises the step of mixing the following components under conditions of mechanical shearing: (A) a cured silicone powder that has an average particle size of 0.1 to 500 micrometers, (B) an inorganic fine powder, and (C) a surface-active agent.

Abstract: Composite silicone rubber particles of this invention include silicone rubber particles A and silicone rubber particles B, wherein the surface of said particles A is covered with said particles B having sizes smaller than sizes of particles A. The composite silicone rubber particles are characterized by exhibiting excellent flowability and dispersibility, and in case of adding the particles to various materials, improving tactile feeling, reducing inner stress, and providing lubricating and oil-and-fat absorption properties.

Abstract: A composite silicone rubber powder comprising: (A) a silicone rubber powder having an average particle size within the range of 0.1 to 500 ?m and hardness of at least 15 by type A durometer according to JIS K 6253, wherein the surface of said silicone rubber powder is coated with (B) a microfine inorganic powder having the BET specific surface area of at least 10 m2/g, said composite silicone rubber powder being characterized by the fact that the surface thereof is treated with (C) an organic silicon compound having a silicon-bonded hydrolyzable group, or with a product of partial hydrolysis of said compound, is characterized by excellent dispersibility in coating and cosmetic materials and having the possibility of improving matting properties of coating materials, and feel of use of cosmetic materials.

Abstract: A method of manufacturing an optical semiconductor device (16) sealed in a transparent or semitransparent cured silicone body (50) by placing an unsealed optical semiconductor device (16) into a mold (23, 34) and subjecting a transparent or semitransparent curable silicone composition (50) that fills the spaces between the mold and the unsealed device (70) to compression molding; provides the sealed optical semiconductor device that is free of voids, allows control of the coating layer thickness, protects the bonding wires from breakage and accidental contact, reduces concentration of stress on an optical semiconductor element, has long service life with reducing discoloration and disconnection of the sealing resin from the optical semiconductor element (16), and has excellent reliability.

Abstract: A curable silicone composition comprising: (A) an organopolysiloxane that has a branched molecular structure and contains in one molecule at least two univalent hydrocarbon groups with phenolic hydroxyl groups therein; (B) a linear-chain organopolysiloxane having at least two univalent hydroxyl groups with epoxy groups that are free of aromatic rings; and (C) a curing accelerator.

Abstract: A method of manufacturing a semiconductor device sealed in a cured silicone body by placing an unsealed semiconductor device into a mold and subjecting a curable liquid silicone composition that fills the spaces between the mold and the unsealed semiconductor device to compression molding under a predetermined molding temperature, wherein the curable liquid silicone composition has viscosity of 90 Pa·s or less at room temperature, a time interval from the moment directly after measurement of a torque with a curometer at the molding temperature to the moment when the torque reached 1 kgf·cm being not less than 1 min.

Abstract: A curable organopolysiloxane composition includes: (A) a straight-chain organopolysiloxane having per molecule at least two silicon-bonded alkenyl groups and at least one silicon-bonded aryl group; (B) a branched-chain organopolysiloxane with siloxane units represented by the following general formula: RSiO3/2, where R is a substituted or unsubstituted monovalent hydrocarbon group, and having per molecule at least one silicon-bonded alkenyl group and at least one silicon-bonded aryl group; (C) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst; and a semiconductor device with a semiconductor element coated with a cured body of the aforementioned composition.

Abstract: An aqueous suspension of cross-linked silicone particles comprising (A) cross-linked silicone particles having an average diameter of 0.1 to 500 ?m, (B) polyoxyethylene sorbitan monolaurate, and (C) water. And, in a second embodiment, an aqueous emulsion of cross-linked silicone particles comprising (A) cross-linked silicone particles having an average diameter of 0.1 to 500 ?m, (B) polyoxyethylene sorbitan monolaurate, (C) water, and (D) oil.

Abstract: A curable silicone composition includes: (A) an organopolysiloxane represented by the siloxane unit formula (1) given below and having at least two univalent organic groups that contain epoxy groups and are free of aromatic rings: [R13SiO1/2]a [R22SiO2/2]b [R3SiO3/2]c (where R1, R2, and R3 are univalent organic groups, at least two of which are contain epoxy groups and are free of aromatic rings; more than 20 mole % of R3 are aryl groups; a+b+c & equals; 1; on average, “a” satisfies the following condition: 0?a?0.8; on average, “b” satisfies the following condition: 0?b?0.8; and, on average satisfies the following condition: 0.2?c?1.0); (B) a linear-chain organopolysiloxane having at least two univalent organic groups that contain phenolic hydroxyl groups; and (C) a curing accelerator.

Abstract: A method of manufacturing a semiconductor device sealed in a cured silicone body by placing a semiconductor device into a mold and subjecting a curable silicone composition that fills the spaces between said mold and said semiconductor device to compression molding, wherein the curable silicone composition comprises the following components: (A) an organopolysiloxane having at least two alkenyl groups per molecule; (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule; (C) a platinum-type catalyst; and (D) a filler, wherein either at least one of components (A) and (B) contains a T-unit siloxane and/or Q-unit siloxane. By the utilization this method, a sealed semiconductor device is free of voids in the sealing material, and a thickness of the cured silicone body can be controlled.

Abstract: A method of manufacturing a semiconductor device sealed with silicone rubber, characterized by 1) placing an unsealed semiconductor device into a mold, 2) thereafter filling in spaces between the mold and the semiconductor device with a sealing silicone rubber composition, and 3) subjecting the composition to compression molding. By the utilization of this method, a sealed semiconductor device is free of voids, and a thickness of a sealing silicone rubber can be controlled.

Abstract: Method for preparation of an aqueous emulsion from a curable silicone composition consisting of (A) an organopolysiloxane having at least two silicon-bonded hydroxyl groups, (B) an organohydrogensiloxane, and (C) a curing catalyst, said method being characterized by (i) continuously supplying component (A), component (B) and component (C), or a mixture of components (A) and (B) and component (C) through individual inlet ports into a continuous mixer and mixing said components at a temperature not exceeding 10° C., (ii) continuously supplying the obtained mixture and (D) an aqueous solution of a surface-active agent to an emulsifier, and emulsifying the components at a temperature not exceeding 20° C. An apparatus for the preparation of an aqueous emulsion of a curable silicone composition comprising of a continuous mixer for mixing components (A) through (C), a distribution unit connected to the lower part of the mixer, and an emulsifier.

Abstract: A method of manufacturing a layered silicone composite material comprising the steps of: applying a second addition-curable organopolysiloxane composition that contains a second adhesion promoter onto a first silicone layer that is formed by curing a first addition-curable organopolysiloxane composition containing a first adhesion promoter and where the first silicone layer has a hardness of less than JIS A 50; and forming a second silicone layer that has hardness of JIS A 50 or more by curing said second addition-curable organopolysiloxane composition.

Abstract: A curable organopolysiloxane composition comprising (A) a linear organopolysiloxane having at least two alkenyl groups and at least one aryl group per molecule, (B) a branched organopolysiloxane having at least one alkenyl group and at least one aryl group per molecule, and having siloxane units represented by the general formula: RsiO2/3, (C) a linear organopolysiloxane with both terminal ends of the molecular chain blocked by silicon bonded hydrogen atoms having at least one aryl group per molecule, and (D) a hydrosilation reaction catalyst, and a semiconductor device whose semiconductor elements are coated with the cured product of the above-described composition. The curable organopolysiloxane composition shows low viscosity, excellent filling properties, and excellent curability that cures to form a soft cured product of a large refractive index, high light transmittance, and high adhesion to substrates, as well as the semiconductor device shows superior reliability.

Abstract: Method for preparation of an aqueous emulsion from a curable silicone composition consisting of (A) an organopolysiloxane having at least two silicon-bonded hydroxyl groups, (B) an organohydrogensiloxane, and (C) a curing catalyst, said method being characterized by (i) continuously supplying component (A), component (B) and component (C), or a mixture of components (A) and (B) and component (C) through individual inlet ports into a continuous mixer and mixing said components at a temperature not exceeding 10° C., (ii) continuously supplying the obtained mixture and (D) an aqueous solution of a surface-active agent to an emulsifier, and emulsifying the components at a temperature not exceeding 20° C. An apparatus for the preparation of an aqueous emulsion of a curable silicone composition comprising of a continuous mixer for mixing components (A) through (C), a distribution unit connected to the lower part of the mixer, and an emulsifier.

Abstract: An ink package including: an ink bag including a pair of flexible walls which are opposed to each other and accommodating ink, and an ink delivering portion having a passage through which an interior space and an exterior space of the ink bag are held in communication for delivering the ink in the ink bag to the exterior space; wherein the ink delivering portion includes a fixing portion which is fixed to one of opposite ends of the ink bag, and an extending portion which is formed adjacent to the fixing portion so as to extend therefrom into the interior space of the ink bag, the extending portion having a cross sectional area which gradually decreases in a direction from the above-indicated one of the opposite ends of the ink bag toward the other end thereof.

Abstract: The present invention relates to a silicone resin composition of low melt viscosity and excellent reactivity and dispersibility in organic resins. The present invention also relates to a curable resin composition for forming a cured resin of excellent moldability and superior flame retardant properties while having little adverse impact on the human body and the environment as a result of containing no antimony oxides or halogenated epoxy resins. The present invention also relates to a cured resin having little adverse impact on the human body or the environment and possessing superior flame retardant properties.

Abstract: A curable epoxy resin composition comprising at least: (A) a crystalline epoxy resin, (B) a phenol resin, and (C) a silicone resin composed of epoxy-containing organic groups and phenyl groups that define an average unit formula of this component. Component (C) is used in an amount of 0.1 to 500 parts by weight for 100 parts by weight of the sum of weights of components (A) and (B). The composition of the invention is suitable for transfer and injection molding and may find use as a curable epoxy resin composition for sealing parts of electrical and electronic devices.

Abstract: Aqueous suspensions of cross-linked silicone particles comprising: (A) cross-linked silicone particles with an average particle size of from 0.1 to 500 ?m, (B) N-acyl-, N-hydrocarbon taurines and/or their salts, and (C) water, aqueous emulsions of oil containing cross-linked silicone particles comprising: (A) cross-linked silicone particles with an average particle size of from 0.1 to 500 ?m, (D) oil, (B) N-acyl-, N-hydrocarbon taurines and/or their salts, and (C) water, with component (A) contained in droplets of component (D) dispersed in water, and cosmetic raw materials comprising said aqueous suspensions or said aqueous emulsions. The suspensions and emulsions are characterized by superior stability and by low environmental impact and minimal effects on the human body. In addition, they are extremely useful as cosmetic raw materials because of their superior cosmetics functionality such as wetness and smoothness.