Patents by Inventor Yoshitsugu Okada

Yoshitsugu Okada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060011702
    Abstract: The solder contains Sn—Zn alloy(s) having a single composition ratio or a plurality of composition ratios, and Sn—Bi—Ag alloy(s) having a single composition ratio or a plurality of composition ratios. The solder includes zinc at 7 to 10 weight % both inclusive, bismuth at 0.001 to 6 weight % both inclusive, silver at 0.001 to 0.1 weight % both inclusive, and the remainder of tin when the alloys are melted in mixture.
    Type: Application
    Filed: July 1, 2003
    Publication date: January 19, 2006
    Inventors: Takuo Funaya, Osamu Myohga, Yoshitsugu Okada, Hiroshi Kubota, Junya Sakurai
  • Patent number: 6512424
    Abstract: A magnetic member 2 for nonreciprocal circuit is fitted in a first hole formed in a dielectric substrate 1 and at least one magnetic member 3 is fitted in a second hole formed in a portion of the dielectric substrate 1, which surrounds the first hole. An electrical conductor is printed on surfaces of the dielectric substrate 1 and the magnetic member 2 for nonreciprocal circuit to form a micro strip line 4. A grounding conductor 5 is formed on the other surface of the dielectric substrate 1. Changing the magnetization of the magnetic member 3 for frequency regulation can reversibly perform a regulation of the frequency characteristics of the nonreciprocal circuit.
    Type: Grant
    Filed: April 13, 2001
    Date of Patent: January 28, 2003
    Assignee: NEC Corporation
    Inventors: Mitsuru Furuya, Osamu Myohga, Yoshitsugu Okada
  • Patent number: 6504444
    Abstract: Holes are formed in a ceramic substrate before sintering, magnetic parts and dielectric parts are fitted in the holes and the substrate is sintered at a temperature equal to or lower than the sintering temperature of the magnetic parts. It is possible to obtain a very compact high frequency integrated circuit, particularly, a micro wave integrated circuit which can be utilized in a frequency band of several tens GHz, by using hard ferrite as a material of the magnetic parts and magnetizing them after the sintering.
    Type: Grant
    Filed: November 6, 1998
    Date of Patent: January 7, 2003
    Assignee: NEC Corporation
    Inventors: Mitsuru Furuya, Osamu Myohga, Yoshitsugu Okada
  • Patent number: 6348843
    Abstract: A magnetic member 2 for nonreciprocal circuit is fitted in a first hole formed in a dielectric substrate 1 and at least one magnetic member 3 is fitted in a second hole formed in a portion of the dielectric substrate 1, which surrounds the first hole. An electrical conductor is printed on surfaces of the dielectric substrate 1 and the magnetic member 2 for nonreciprocal circuit to form a micro strip line 4. A grounding conductor 5 is formed on the other surface of the dielectric substrate 1. Changing the magnetization of the magnetic member 3 for frequency regulation can reversibly perform a regulation of the frequency characteristics of the nonreciprocal circuit.
    Type: Grant
    Filed: May 24, 1999
    Date of Patent: February 19, 2002
    Assignee: NEC Corporation
    Inventors: Mitsuru Furuya, Osamu Myohga, Yoshitsugu Okada
  • Publication number: 20010024144
    Abstract: A magnetic member 2 for nonreciprocal circuit is fitted in a first hole formed in a dielectric substrate 1 and at least one magnetic member 3 is fitted in a second hole formed in a portion of the dielectric substrate 1, which surrounds the first hole. An electrical conductor is printed on surfaces of the dielectric substrate 1 and the magnetic member 2 for nonreciprocal circuit to form a micro strip line 4. A grounding conductor 5 is formed on the other surface of the dielectric substrate 1. Changing the magnetization of the magnetic member 3 for frequency regulation can reversibly perform a regulation of the frequency characteristics of the nonreciprocal circuit.
    Type: Application
    Filed: April 13, 2001
    Publication date: September 27, 2001
    Inventors: Mitsuru Furuya, Osamu Myohga, Yoshitsugu Okada
  • Patent number: 6127907
    Abstract: Dielectric parts 12 which become resonators are fitted in holes formed in a dielectric substrate 11 and magnetic parts 13 for setting resonance frequencies of the dielectric parts 12 are also fitted in holes formed in the dielectric substrate 11. With such construction in which the dielectric parts are fitted in the holes of the dielectric substrate, the physical preciseness of a high frequency filter is improved. Further, by fitting not only the dielectric parts 12 but also the magnetic parts 13 in the holes of the dielectric substrate 11, it is possible to form the high frequency filter operating in a frequency band of several tens GHz as a micro wave integrated circuit to thereby improve the uniformality and mass-producibility of the high frequency filter.
    Type: Grant
    Filed: November 6, 1998
    Date of Patent: October 3, 2000
    Assignee: NEC Corporation
    Inventors: Mitsuru Furuya, Osamu Myohga, Yoshitsugu Okada
  • Patent number: 5876618
    Abstract: A Ni--Zn type ferrite has the composition represented by the general formula: Ni.sub.X Zn.sub.1-X Fe.sub.2-Y-Z Mn.sub.Y Zr.sub.Z O.sub.4 (0.55.ltoreq.X.ltoreq.0.80, 0.001.ltoreq.Y.ltoreq.0.20, 0.001.ltoreq.Z.ltoreq.0.04). The Ni--Zn type ferrite is formed with the step described below. A raw powder is first mixed for 64 hours and then fired at 850.degree. C. in an oxygen atmosphere for two hours. Next, the fired powder is crushed and then the crushed powder is again mixed. Then, a binder is added to the resulting powder, which is then press-formed under a pressure of 2.5 ton/cm.sup.2, and the press-formed powder is sintered at 1350.degree. C. for 5 hours in an oxygen atmosphere.
    Type: Grant
    Filed: November 19, 1997
    Date of Patent: March 2, 1999
    Assignee: NEC Corporation
    Inventors: Katsuhisa Ishikawa, Yasuhiro Sasaki, Atsushi Ochi, Osamu Myohga, Yoshitsugu Okada
  • Patent number: 5874020
    Abstract: A Ni--Zn base ferrite is provided with a relatively small dielectric loss (tan.delta.(.epsilon.)) of the order of 10.sup.-3. Its saturation magnetization (4.pi.Ms) is relatively still high. A Ni--Zn base ferrite having a small dielectric loss (of the order of 10.sup.-3) can be obtained by proportioning raw materials to give a finished composition range of Ni.sub.X Zn.sub.1-X Fe.sub.2-Y-Z Mn.sub.Y M.sub.Z O.sub.4 where M: Ge and/or Sn, 0.55.ltoreq.X.ltoreq.1.00, 0.001.ltoreq.Y.ltoreq.0.36, and 0.002.ltoreq.Z.ltoreq.0.36, by calcination.
    Type: Grant
    Filed: May 5, 1997
    Date of Patent: February 23, 1999
    Assignee: NEC Corporation
    Inventors: Katsuhisa Ishikawa, Yasuhiro Sasaki, Atsushi Ochi, Yoshitsugu Okada, Mitsuru Furuya
  • Patent number: 4882839
    Abstract: According to a method of manufacturing a multi-layered wiring substrate, a palladium thin film is formed on an entire surface of a substrate including a conductor wiring layer. A portion except for a predetermined via formation portion on the palladium thin film is masked by a first photoresist. A polyimide-based conductive resin is embedded in the via formation portion through the first photoresist. The first photoresist is removed. The conductor wiring layer and the via formation portion are masked by a second photoresist. The exposed palladium thin film is etched. The second photoresist is removed. The conductive resin is cured. A photosensitive polyimide resin is applied to an entire surface of the substrate, a via-hole is formed in the via formation portion, and the photosensitive polyimide resin is cured.
    Type: Grant
    Filed: April 18, 1989
    Date of Patent: November 28, 1989
    Assignee: NEC Corporation
    Inventor: Yoshitsugu Okada
  • Patent number: 4294428
    Abstract: A butterfly valve comprising a valve body mounted on a valve stem in a valve housing. The valve housing is provided with valve seats to contact the periphery of the valve body when the valve is closed. Elastic seal members are disposed between the end surfaces of the valve seats and the valve stem in a manner to surround the latter. The butterfly valve of the invention further comprises tubular holder members rotatable relative to the valve stem and fitted with the elastic seal members on outer parts thereof.
    Type: Grant
    Filed: December 3, 1980
    Date of Patent: October 13, 1981
    Assignee: Kubota, Ltd.
    Inventors: Yoshitsugu Okada, Osamu Nakai
  • Patent number: 4266753
    Abstract: In a butterfly valve comprising a valve housing including a cylindrical fluid passage and a disc-shaped valve body rotatable within the housing, a hard annular seat provided in the housing and a hard annular rim defined on the periphery of the valve body are adapted to contact one another over the entire circumference when the valve is closed. The valve of the above construction is very easy to manufacture and yet has a good sealing performance.
    Type: Grant
    Filed: July 20, 1978
    Date of Patent: May 12, 1981
    Assignee: Kubota, Ltd.
    Inventor: Yoshitsugu Okada
  • Patent number: 4221360
    Abstract: A butterfly valve comprising a valve body provided with a hard body seat having a cylindrical sealing surface, and a valve disc rotatable within the body and provided with a hard disc seat on the periphery thereof. The body seat and the disc seat are adapted to contact each other substantially over the entire circumference. The valve of this invention is capable of good sealing and is opened with a small driving force.
    Type: Grant
    Filed: December 19, 1978
    Date of Patent: September 9, 1980
    Assignee: Kubota, Ltd.
    Inventors: Masahiro Yasuoka, Yoshitsugu Okada
  • Patent number: 4040443
    Abstract: A sleeve valve comprises a cylindrical valve body formed with a multiplicity of discharge ports in the peripheral wall and having an upper end secured to the upper wall of a reducing chamber, and a valve cylinder gate having open upper and lower ends and slidably fitted in the valve body, the gate communicating at its upper end with an inlet elbow for pressurized water. A drain tube extending through the bottom cover of the valve body and the bottom wall of the reducing chamber connects the lower end of the sleeve valve to the bottom wall to prevent the vibration of the valve.
    Type: Grant
    Filed: February 13, 1976
    Date of Patent: August 9, 1977
    Assignee: Kubota, Ltd.
    Inventors: Yoshitsugu Okada, Teruaki Nanao, Toshio Sugino
  • Patent number: 4008877
    Abstract: A butterfly valve apparatus comprising a rotating shaft, a valve stem movable by the rotating shaft through a coupling member and a valve plate fixed within a valve housing to the valve stem.
    Type: Grant
    Filed: August 6, 1975
    Date of Patent: February 22, 1977
    Assignee: Kubota, Ltd.
    Inventors: Masahiro Yasuoka, Yoshitsugu Okada
  • Patent number: 4007910
    Abstract: A butterfly valve apparatus comprising a rotating shaft, a valve stem movable by the rotating shaft through a coupling member and a valve plate fixed within a valve housing to the valve stem.
    Type: Grant
    Filed: August 6, 1975
    Date of Patent: February 15, 1977
    Assignee: Kubota, Ltd.
    Inventors: Masahiro Yasuoka, Yoshitsugu Okada