Patents by Inventor Yoshiya Endo

Yoshiya Endo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110171725
    Abstract: A mechanism for preventing suction air from leaking uses a capturing carrier cartridge that includes a cartridge main body and a filter fixing ring. The cartridge main body includes a storage portion for storing a capturing carrier solution and a filter mounting portion where a filter for filtering the capturing carrier solution is disposed. The filter fixing ring covers the filter mounting portion, positions the filter, and sucks and filters the capturing carrier solution from a lower surface thereof. The mechanism includes a cartridge holder and a suction head. The cartridge holder includes an opening that includes the filter mounting portion of the capturing carrier cartridge, and a holding portion that holds the storage portion. The suction head sucks the capturing carrier solution through the lower surface of the filter fixing ring while applying pressure to press the filter fixing ring against the filter mounting portion.
    Type: Application
    Filed: January 10, 2011
    Publication date: July 14, 2011
    Inventors: Noe MIYASHITA, Harumasa Yamamoto, Yoshiya Endo, Matsuo Kamitani
  • Patent number: 7547175
    Abstract: A transfer device for a substrate is capable of preventing deformation or breakage of the substrate due to bending stress by reducing the amount of dead weight deflection of the substrate, e.g. a large mother glass board. Supporting members extend in opposite directions from two sides of a storage device such that the substrate can be introduced or removed by raising and lowering the hand of a transfer machine inserted into the storage device between the supporting members. The supporting members are comprised of a plurality of supporting members in parallel, formed with a gap between the supporting members facing each other.
    Type: Grant
    Filed: June 26, 2002
    Date of Patent: June 16, 2009
    Assignees: Hitachi Plant Technologies, Ltd., Sharp Corporation
    Inventors: Hiroshi Chinbe, Yoshiya Endo, Naoki Shimakawa, Ichiro Fukuwatari, Yoshiaki Hayashida, Yoshio Takakura, Akio Matsuyama, Hideto Kohketsu
  • Publication number: 20020197139
    Abstract: The objective of the present invention is to provide a transfer device for substrate capable of preventing deformation or breakage of substrate due to bending stress, by reducing the amount of dead weight deflection of substrate, such as large mother glass boards, etc.
    Type: Application
    Filed: June 26, 2002
    Publication date: December 26, 2002
    Inventors: Hiroshi Chinbe, Yoshiya Endo, Naoki Shimakawa, Ichiro Fukuwatari, Yoshiaki Hayashida, Yoshio Takakura, Akio Matsuyama, Hideto Kohketsu
  • Patent number: D643914
    Type: Grant
    Filed: June 24, 2010
    Date of Patent: August 23, 2011
    Assignee: Hitachi Plant Technologies, Ltd.
    Inventors: Yoshiya Endo, Yuichi Inatomi, Mitsuo Ishizuka
  • Patent number: D643915
    Type: Grant
    Filed: June 24, 2010
    Date of Patent: August 23, 2011
    Assignee: Hitachi Plant Technologies, Ltd.
    Inventors: Yoshiya Endo, Yuichi Inatomi, Mitsuo Ishizuka