Abstract: A coated granular pesticide comprising a granular pesticide for use on plants which comprises at least one hardly water-soluble active ingredient and at least one water-swelling substance, and a thermoplastic resin-based film which covers the surface of the granular pesticide; a method for producing the same; and applications thereof. A surfactant, inorganic powder insoluble or hardly soluble in water, water-absorbing and/or water-soluble polymer fine powder, a thermosetting resin, or a biodegradable polymer insoluble or hardly soluble in water, or a combination thereof may be incorporated into the film.

Abstract: The present invention intends to provide a cured material of a silicon-containing polyimide having high heat resistance, low coefficient of thermal expansion, no brittleness and high hardness.In order to enable liquid coating and impregnation, a silicon-containing soluble polyimide precursor is first prepared. The precursor may be prepared by mixing five compounds of ##STR1## (R.sup.1 is a tetravalent carbon cyclic aromatic group), NH.sub.2 --R.sup.2 --NH.sub.2 (R.sup.2 is an aliphatic group, an alicyclic group, an aromatic aliphatic group or a carbon cyclic aromatic group, a polysiloxane group or 1,3,5-triazine group having a substituent), NH.sub.2 --R.sup.3 --SiR.sup.4.sub.3-k X.sup.1.sub.k and NH.sub.2 --R.sup.3 --SiR.sub.3-m.sup.4 X.sup.1.sub.m (R.sup.3 is --(CH.sub.2).sub.s --, ##STR2## wherein s is an integer of 1 to 4, and R.sup.4 is an alkyl group, a phenyl group or an alkyl-substituted phenyl group and SiX.sub.4.sup.2, X.sup.1 and X.sup.

Abstract: The present invention provides a process for the production of silicon-containing polyimide presursors that have a viscosity most suitable for application, and when baked, can form a coating low in hygroscopicity, heat resistant, and having powerful adhesion, and a process for their cured silicon-containing polyimide.A process for the production of silicon-containing polyimide precursors having a logarithmic viscosity number of 0.05 to 5 dl/g by reacting A.sup.1 mol of fluorine-containing diacid anhydride, A.sup.2 mol of a diacid anhydride, B.sup.1 mol of a fluorine-containing diamine, B.sup.2 mol of a diamine, and C mol of an aminosilane with the mixing ratio of them such that A.sup.1, A.sup.2, B.sup.1, B.sup.2, and C are within ranges having prescribed relationships, and a process for the production of a silicon-containing polyimide by baking a solution of said precursor at 50.degree. to 500.degree. C.

Abstract: A process for producing a silicon-containing polyamic acid affording a silicon-containing polyimide having a low thermal expansion coefficient and a process for producing the silicon-containing polyimide are provided, the former process comprising reacting pyromellitic acid dianhydride (A.sup.1 mols) and 3,3',4,4'-biphenyltetracarboxylic acid dianhydride (A.sup.2 mols) with a diamine of the following formula (I) (B mols) and an aminosilicon compound of the formula (II) so as to satisfy the following expressions (III) and (IV): ##STR1## wherein R.sup.1 is methyl, ethyl, methoxy, ethoxy or halogen; R.sup.2 is alkyl or alkyl-substituted phenyl; X is a hydrolyzable alkoxy, acetoxy or halogen; m is 0, 1 or 2; n is 1 or 2; and k is 1, 2 or 3; andthe latter process comprising baking a solution of the above silicon-containing polyamic acid at 50.degree. to 500.degree. C.

Abstract: A process for producing a silicon-containing polyamic acid of a specified inherent viscosity as a precursor affording polyimide resins having a considerable extent of heat resistance as adhesives or resins for multilayer laminated composite materials, and a good adhesion onto inorganic materials, metals or resins, and a crosslinked silicon-containing polyimide resin prepared from the polyamic acid are provided, which process comprises reacting a tetracarboxylic acid dianhydride of formula (1) (A mols), a diamine of formula (2) (B mols) and an aminosilicon compound of formula (3) (C mols), satisfying the expressions of (4) and (5): ##STR1## wherein R.sup.1 is a tetravalent carboxylic aromatic group; R.sup.2 is an aliphatic, alicyclic, aromatic aliphatic or carboyclic aromatic group each of a specified number of carbon atoms, a specified polysiloxane group, or a formula of ##STR2## wherein R.sup.8 is a specified hydrocarbon group or hydrogen atom; ##STR3## (s: 1 to 4); R.sup.

Abstract: A novel soluble polyimide-siloxane precursor having a good storage stability in solution and forming a superior coating on silicon wafer, glass, etc. under heating conditions of low temperature and short time; a process for producing the same; and a cross-linked polyimidesiloxane obtained by heating the above precursor are provided, which precursor hasan imide-amic acid chain part expressed by the formula (1) ##STR1## bonded by a bonding structure expressed by the formula (5)--SiR.sup.7.sub.3-k Y.sup.1.sub.k-1 --O--SiR.sup.7.sub.3-k Y.sup.1.sub.k-1 -- (5)wherein each I, in a total number of m+n+1, represents independently any one of constituting units expressed by the following formulas (2), (3) and (4): ##STR2## wherein R.sup.1 represents a tetravalent carbocyclic aromatic group; R.sup.2, R.sup.4, R.sup.5, R.sup.6, R.sup.7 and Y.sup.1 each are a specified group; l is 1 to 100; m is 0 or an integer; n is an integer; and 1.ltoreq.k.ltoreq.

Abstract: A novel soluble polyimide-siloxane precursor useful for forming a superior coating on silicon wafer, glass, etc. and a process for producing the same are provided, which precursor has an imide-amic acid chain part expressed by --R.sup.3 --(I)--R.sup.2 --(I)].sub.n R.sup.3 --, bonded by a bonding structure expressed by --SiR.sup.4.sub.3-m Y.sup.1.sub.m-1 --O--SiR.sup.4.sub.3-m Y.sup.1.sub.m-1 --, wherein (I) is either one of formulas (2), (3) or (4) ##STR1## wherein R.sup.1 is a tetravalent carbocyclic aromatic group; R.sup.2, R.sup.3, R.sup.4 and Y.sup.1 each are a specified group; 1.ltoreq.m.ltoreq.3; the precursor further being terminated by Y.sup.2.sub.m R.sup.4.sub.3-m Si-- wherein Y.sup.2 is a specified group and having a percentage imidization as defined relative to the quantities of (2), (3) and (4), of 50-100% and also an inherent viscosity as specifically defined, of 0.05 to 5 dl/g, the above n being an integer defined so as to give the above inherent viscosity value.

Abstract: A silicone-polyimide precursor which affords a coating having a conspicuous adhesion onto silicon wafer, glass, etc. and also an improved strength, hardness, etc. after baking, and a process for producing the same are provided,which precursor is expressed by the formula (1) ##STR1## wherein R.sup.1 represents a tetravalent, carbocyclic aromatic group; R.sup.2, R.sup.3 and R.sup.6 are the same or different groups being 1.about.6 C alkyl, phenyl or alkyl-substituted phenyl of 7.about.12 C; R.sup.4 and R.sup.5 are the same or different groups being ##STR2## wherein s represents an integer of 1 to 4; said group ##STR3## has an average formula weight of 368 to 7,968; X represents alkoxy, acetoxy, halogen atom or hydroxy; ms at both the ends of the formula (1) independently represent an integer of 1 to 3; and l represents an integer of 1 to 30; andwhich process comprises reacting the following compounds (2), (3) and (4): ##STR4## wherein the symbols R.sup.1, etc.