Abstract: An electronic apparatus includes a heat generating component, a first battery, a second battery, a heat conductive sheet, and a heat insulating layer. The second battery is disposed between the heat generating component and the first battery. The heat conductive sheet thermally couples the heat generating component to the first battery. The heat insulating layer is disposed between the heat conductive sheet and the second battery.

Abstract: A thermal insulation sheet includes a heat storage sheet, an insulation sheet affixed to the heat storage sheet, and a highly-thermoconductive sheet affixed to the insulation sheet. The heat storage sheet contains a resin and powdery microcapsules mixed with the resin. The powdery microcapsules encapsulate latent-heat storage agent. The heat storage sheet has a void ratio not less than 10% and not more than 30%. Or, the heat storage sheet may have surface roughness Ra not less than 2 ?m and not more than 20 ?m. The thermal insulation sheet suppresses or retards transferring of heat generated in a heat-generating component to outside, and suppresses a rapid rising of a temperature of the heat-generating component.

Abstract: A heat-insulating sheet includes a heat storage sheet, a first insulating sheet, and a thermally conductive sheet. The heat storage sheet contains a first resin and a plurality of microcapsules containing latent heat storage material and mixed in the form of aggregates with each other. The first insulating sheet has a first face bonded to the heat storage sheet and a second face opposite to the first face. The thermally conductive sheet is bonded to the second face of the first insulating sheet. The content of the microcapsules in the heat storage sheet is falls within a range from 40 wt % to 90 wt %, inclusive. The heat storage sheet includes a layer free from the microcapsules at a portion in contact with the first insulating sheet.

Abstract: A heat dissipation sheet includes a thermally conductive resin sheet plastically deformable at 25° C., and a thermally conductive film bonded to the thermally conductive resin sheet and having a higher thermal conductivity than the thermally conductive resin sheet. The heat dissipation sheet has excellent heat dissipation characteristics.

Abstract: A manufacturing method for manufacturing ceramic electronic components, includes steps of forming a stack body by stacking ceramic green sheets and conductive layers on top of each other, punching a frame into the stack body and holding the frame in the stack body, locating a pressing force applying member inside the frame and, while the frame is held in the stack body, applying a pressing force to a portion of the stack body located inside the frame by causing the pressing force applying member located inside the frame to press against the portion of the stack body located inside the frame, to thereby form a high-density structure inside the frame while preventing the high-density structure from deforming outwardly beyond the frame. The stack body can be heated to reduce the required pressing force, and an elastic member may be provided to make the pressing force uniform.

Abstract: A method of manufacturing ceramic includes a first step of compressing a ceramic sheet (10a) containing ceramic powder and organic to reduce porosity, a second step of forming a conductor layer (2) of metallic paste on the ceramic sheet (10b), a third step of stacking a plurality of ceramic sheets (10b) into a laminate such that each ceramic sheet (10b) is sandwiched between conductor layers (2), and a fourth step of sintering the laminate. Since the conductor layer (2) is formed on the ceramic sheet (10b) with its porosity reduced, metallic components are hindered from passing into the ceramic sheet (10b). The conductor layer can be formed by transferring onto a ceramic sheet to suppress the diffusion of the metallic components of the conductor layer. This method reduces short circuits of ceramic devices and increases the yield rate.

Abstract: In the step of cladding by applying a pressing force to a ceramic stack body, while a frame being punched into a stack body and kept therein, the stack body is pressed by a pressing force applying member located inside of the frame. According to this method, no deformations are created in the direction parallel to the surface of the stack. Therefore, such a problem as the deformation of a conductive layer due to stress in not caused, resulting in a stack body with an excellent densified structure and, when resulting stack bodies are sintered, ceramic electronic components formed of them are free of defective connections, structural defects and electrical performance failures with an excellent yield rate. In addition, by heating a stack body at applying a pressing force thereto, the densified stack body is formed under a reduced pressure. Furthermore, by having an elastic body provided to the pressing force applying member, a stack body is pressed uniformly.

Abstract: A method of manufacturing a ceramic electronic component including: a first step of providing a plurality of ceramic sheets containing ceramic powder and polyethylene and having a porosity of 30% or more, and a conductor layer containing metal powder, plasticizer and resin on a base film; a second step of laminating and pressurizing the conductor layer together with the base film on one of the ceramic sheets, and peeling off the base film to form a ceramic sheet with the conductor layer; a third step of disposing another ceramic sheet on top of the conductor layer; a fourth step of laminating and pressurizing another conductor layer on top of the another ceramic sheet; a fifth step of repeating the third and the fourth steps to form a laminated body having a desired number of layers; and a sixth step of sintering the laminated body.