Patents by Inventor Yoshiyasu Ando

Yoshiyasu Ando has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230075713
    Abstract: An upper includes an upper main body that covers an instep of a foot. A first region and a second region adjacent to the first region are formed in the upper main body . The upper main body includes: a first linear body provided across the first region and the second region or provided only in the second region; and a second linear body provided in the first region while avoiding the second region and having an end located at a boundary portion between the first region and the second region. The first linear body and the second linear body have mutually different stretchability.
    Type: Application
    Filed: August 25, 2022
    Publication date: March 9, 2023
    Applicant: ASICS CORPORATION
    Inventors: Chihaya SUZUKI, Seiji YANO, Katsunori YAGYU, Yoshiyasu ANDO, Keita OZAWA, Yousuke ATARASHI, Shingo MASUMOTO, Hiroaki NISHIMURA, Kenta TATENO
  • Publication number: 20220408880
    Abstract: A shock absorber includes a shock absorbing portion having a three-dimensional shape formed by a wall in which an outer shape is defined by a pair of parallel curved surfaces. The shock absorbing portion includes at least one three-dimensional structure body obtained by changing a shape of a unit structure body thickened based on a unit structure of a Schwartz P structure. The shape of the three-dimensional structure body in an unloaded state is a shape obtained by changing the shape of the unit structure so as to follow the shape change of the unit structure body, which is the regular hexahedron shaped space occupied by the unit structure body, into the trapezoidal space.
    Type: Application
    Filed: June 23, 2022
    Publication date: December 29, 2022
    Applicant: ASICS CORPORATION
    Inventors: Yutaro IWASA, Yoshiyasu ANDO, Keita OZAWA
  • Patent number: 10548369
    Abstract: A shoe sole which has a landing surface composed of three regions of a middle-sole region, a fore-sole region and a rear-sole region, and has a plurality of groove portions in the landing surface. The groove portions include: a first groove portion located in the fore-sole region, on a first imaginary line extending along the MP joint; a second groove portion located in the fore-sole region, on a second imaginary line extending along a line which connects a medial outer edge of the fore-sole region and a lateral outer edge of the middle-sole region with each other, in an area which is closer to a toe than to the first groove portion; and a third groove portion located in the rear-sole region, on a third imaginary line extending along a line which connects a medial outer edge of the rear-sole region and a lateral outer edge of the middle-sole region with each other.
    Type: Grant
    Filed: April 11, 2014
    Date of Patent: February 4, 2020
    Assignee: ASICS CORPORATION
    Inventors: Seigo Nakaya, Masaru Ichikawa, Yoshiyasu Ando, Satoru Abe
  • Patent number: 10345256
    Abstract: In a gas sensor where an exhaust gas is introduced into a chamber provided in a gas sensor element so that an oxygen concentration is reduced in a pump cell on the upstream side to detect NOx in the exhaust gas in a sensor cell on the downstream side, the surface of at least one of a solid electrolyte sheet and a shielding sheet that constitute wall surfaces of the chamber has a warped shape which is convex inwardly of the chamber at a position where the pump cell is formed. The warp amount is in the range from 0.10% or higher to 1.38% or lower, and the height in the stacking direction of the diffusion layer is lower than the average height Have in the stacking direction of the chamber at the position where the pump cell is formed.
    Type: Grant
    Filed: September 11, 2015
    Date of Patent: July 9, 2019
    Assignee: DENSO CORPORATION
    Inventors: Kei Sugiura, Yoshiyasu Ando
  • Publication number: 20170261463
    Abstract: In a gas sensor where an exhaust gas is introduced into a chamber provided in a gas sensor element so that an oxygen concentration is reduced in a pump cell on the upstream side to detect NOx in the exhaust gas in a sensor cell on the downstream side, the surface of at least one of a solid electrolyte sheet and a shielding sheet that constitute wall surfaces of the chamber has a warped shape which is convex inwardly of the chamber at a position where the pump cell is formed. The warp amount is in the range from 0.10% or higher to 1.38% or lower, and the height in the stacking direction of the diffusion layer is lower than the average height Have in the stacking direction of the chamber at the position where the pump cell is formed.
    Type: Application
    Filed: September 11, 2015
    Publication date: September 14, 2017
    Inventors: Kei SUGIURA, Yoshiyasu ANDO
  • Publication number: 20170042283
    Abstract: A shoe sole which has a landing surface composed of three regions of a middle-sole region, a fore-sole region and a rear-sole region, and has a plurality of groove portions in the landing surface. The groove portions include: a first groove portion located in the fore-sole region, on a first imaginary line extending along the MP joint; a second groove portion located in the fore-sole region, on a second imaginary line extending along a line which connects a medial outer edge of the fore-sole region and a lateral outer edge of the middle-sole region with each other, in an area which is closer to a toe than to the first groove portion; and a third groove portion located in the rear-sole region, on a third imaginary line extending along a line which connects a medial outer edge of the rear-sole region and a lateral outer edge of the middle-sole region with each other.
    Type: Application
    Filed: April 11, 2014
    Publication date: February 16, 2017
    Inventors: Seigo NAKAYA, Masaru ICHIKAWA, Yoshiyasu ANDO, Satoru ABE
  • Publication number: 20150135558
    Abstract: A shoe sole including: an outsole having a tread surface to be in contact with a road surface; and a midsole arranged on the outsole, wherein: the midsole is exposed in a central section of a rear foot section and an arch section; in the central section and a lateral side section of the rear foot section of the shoe sole, a diagonal groove is formed extending in a diagonal front-rear direction in the rear foot section to an outer edge of a lateral side of the rear foot section; an angle ?, formed between a virtual center line of the diagonal groove and a longitudinal axis connecting between a center of a heel and a middle point between a big-toe ball and a little-toe ball, is set in a range of 12° to 35°; and a virtual intersection point between the longitudinal axis and the center line is set within a range of 21% to 43% of a full length of the longitudinal axis of the shoe sole from a posterior end of the shoe sole, the diagonal groove extending to a point anterior and medial to the intersection point.
    Type: Application
    Filed: May 10, 2012
    Publication date: May 21, 2015
    Applicant: ASICS CORPORATION
    Inventors: Takashi Inomata, Tsuyoshi Nishiwaki, Masahiro Fujiwara, Yoshiyasu Ando
  • Patent number: 7504146
    Abstract: A hexagonal cell honeycomb structure body has a plurality of hexagonal cells. Each hexagonal cell is surrounded by six cell walls in a hexagonal lattice shape. A R-shaped corner part of an approximate circular-arc shape is alternately formed at interior angle parts of the six cell walls forming each hexagonal cell. The three R-shaped corner parts are at the alternate internal corners of each hexagonal cell observed from a cross section of the axis direction of the hexagonal cell honeycomb structure body. A radius of curvature of each R-shaped corner part is larger than that of the interior corner part having no R-shaped corner part. The minimum radius of curvature of the R-shaped corner part is 2.8 to 5 times of a thickness of each hexagonal cell wall, namely within a range of 0.25 mm to 0.45 mm.
    Type: Grant
    Filed: December 20, 2006
    Date of Patent: March 17, 2009
    Assignees: Denso Corporation, Toyota Jidosha Kabushiki Kaisha
    Inventors: Yoshiyasu Ando, Toshiharu Kondo, Tatsuji Mizuno
  • Publication number: 20070148406
    Abstract: A hexagonal cell honeycomb structure body has a plurality of hexagonal cells. Each hexagonal cell is surrounded by six cell walls in a hexagonal lattice shape. A R-shaped corner part of an approximate circular-arc shape is alternately formed at interior angle parts of the six cell walls forming each hexagonal cell. The three R-shaped corner parts are at the alternate internal corners of each hexagonal cell observed from a cross section of the axis direction of the hexagonal cell honeycomb structure body. A radius of curvature of each R-shaped corner part is larger than that of the interior corner part having no R-shaped corner part. The minimum radius of curvature of the R-shaped corner part is 2.8 to 5 times of a thickness of each hexagonal cell wall, namely within a range of 0.25 mm to 0.45 mm.
    Type: Application
    Filed: December 20, 2006
    Publication date: June 28, 2007
    Applicants: DENSO CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Yoshiyasu Ando, Toshiharu Kondo, Tatsuji Mizuno
  • Patent number: 4986861
    Abstract: A semiconductor pressure sensor having a cylindrical housing with an opening formed at its tip end which is exposed to a pressure atmosphere and a metal diaphragm for receiving pressure, which is formed in a wall of the cylindrical housing defining the opening. A metal oxide layer is formed in a surface of the metal diaphragm by oxidizing the surface of the metal diaphragm, and a glass layer is formed on the metal oxide layer. A semiconductor chip, on which a strain gauge is formed, is firmly and surely bonded to the metal diaphragm through the glass layer by virtue of the metal oxide layer. This semiconductor pressure sensor can measure high pressure with sufficient sensitivity and high accuracy.
    Type: Grant
    Filed: March 13, 1989
    Date of Patent: January 22, 1991
    Assignee: Nippon Soken, Inc.
    Inventors: Minoru Nishida, Naohito Mizuno, Tadashi Hattori, Seizi Huzino, Yoshiyasu Ando
  • Patent number: 4840067
    Abstract: A semiconductor pressure sensor having a cylindrical housing with an opening formed at its tip end which is exposed to a pressure atmosphere and a metal diaphragm for receiving pressure which is formed in a wall of the cylindrical housing defining the opening. A metal oxide layer is formed in a surface of the metal diaphragm by oxidizing the surface of the metal diaphragm, and a glass layer is formed on the metal oxide layer. A semiconductor chip, on which a strain gauge is formed, is firmly and surely bonded to the metal diaphragm through the glass layer by virtue of the metal oxide layer. This semiconductor pressure sensor can measure high pressure with sufficient sensitivity and high accuracy.
    Type: Grant
    Filed: May 15, 1987
    Date of Patent: June 20, 1989
    Assignee: Nippon Soken, Inc.
    Inventors: Minoru Nishida, Naohito Mizuno, Tadashi Hattori, Seizi Huzino, Yoshiyasu Ando
  • Patent number: D734927
    Type: Grant
    Filed: March 28, 2013
    Date of Patent: July 28, 2015
    Assignee: ASICS CORPORATION
    Inventors: Yoshiyasu Ando, Masahiro Fujiwara, Takashi Inomata, Hiroaki Nishimura, Satoru Abe
  • Patent number: D734928
    Type: Grant
    Filed: March 28, 2013
    Date of Patent: July 28, 2015
    Assignee: ASICS CORPORATION
    Inventors: Yoshiyasu Ando, Takuto Ishii, Hitomi Yamana, Masahiro Fujiwara
  • Patent number: D783255
    Type: Grant
    Filed: October 7, 2015
    Date of Patent: April 11, 2017
    Assignee: ASICS CORPORATION
    Inventors: Yoshiyasu Ando, Masahiro Fujiwara, Mai Nakaya