Abstract: A dummy wafer includes a planar heater and a pair of plate-shaped members formed of an aluminum alloy, aluminum, or silicon carbide, wherein the planar heater is sandwiched by the plate-shaped members.

Abstract: A method for adjusting a temperature of a substrate support is provided. In an apparatus for inspecting a target device, a substrate placement surface of the substrate support is divided into multiple regions and a heater is disposed in each of the multiple regions. The method comprises controlling the heater in a main region corresponding to the target device such that a temperature of the main region becomes a set temperature, and controlling the heater in a sub-region adjacent to the main region. When overshoot has not occurred in the temperature of the main region, the heater in the sub-region is controlled such that a temperature difference between the main region and the sub-region becomes a predetermined value, and when overshoot has occurred, the heater of the sub-region is controlled such that a difference between the set temperature and the temperature in the sub-region becomes the predetermined value.

Abstract: A dummy wafer includes a planar heater and a pair of plate-shaped members formed of an aluminum alloy, aluminum, or silicon carbide, wherein the planar heater is sandwiched by the plate-shaped members.

Abstract: A probe device includes an electrode plate arranged above a mounting table for mounting thereon a semiconductor wafer and electrically connected to a tester, a contact probe arranged at a side of the mounting table and electrically connected to a mounting table electrode of the mounting table. The contact probe includes a contact portion, having a top surface formed uneven, to be in contact with the electrode plate, and a cable connection portion formed as one unit with the contact portion. The contact portion and the cable connection portion are vertically movable by a biasing member provided below the cable connection portion. When the probes are made contact with electrodes of a semiconductor device of the semiconductor wafer by moving up the mounting table, the contact portion and the electrode plate are made contact with each other and the backside electrode and the tester are electrically connected to each other.

Abstract: A probe device includes an electrode plate arranged above a mounting table for mounting thereon a semiconductor wafer and electrically connected to a tester, a connection conductor arranged at a side of the mounting table and electrically connected to a mounting table electrode formed on a mounting surface of the mounting table, and a cleaning mechanism including a polishing unit for polishing a contact portion of the connection conductor, a brush cleaning unit for performing a brush-cleaning of the contact portion, and a contact resistance measuring unit for measuring a contact resistance of the contact portion. The mounting table electrode is in contact with a backside electrode of a semiconductor device of the semiconductor wafer. When the connection conductor is connected to the electrode plate, a backside electrode formed on a backside of the semiconductor device and the tester are electrically connected to each other.

Abstract: A probe device includes an electrode plate arranged above a mounting table for mounting thereon a semiconductor wafer and electrically connected to a tester, a contact probe arranged at a side of the mounting table and electrically connected to a mounting table electrode of the mounting table. The contact probe includes a contact portion, having a top surface formed uneven, to be in contact with the electrode plate, and a cable connection portion formed as one unit with the contact portion. The contact portion and the cable connection portion are vertically movable by a biasing member provided below the cable connection portion. When the probes are made contact with electrodes of a semiconductor device of the semiconductor wafer by moving up the mounting table, the contact portion and the electrode plate are made contact with each other and the backside electrode and the tester are electrically connected to each other.

Abstract: A probe device includes an electrode plate arranged above a mounting table for mounting thereon a semiconductor wafer and electrically connected to a tester, a connection conductor arranged at a side of the mounting table and electrically connected to a mounting table electrode formed on a mounting surface of the mounting table, and a cleaning mechanism including a polishing unit for polishing a contact portion of the connection conductor, a brush cleaning unit for performing a brush-cleaning of the contact portion, and a contact resistance measuring unit for measuring a contact resistance of the contact portion. The mounting table electrode is in contact with a backside electrode of a semiconductor device of the semiconductor wafer. When the connection conductor is connected to the electrode plate, a backside electrode formed on a backside of the semiconductor device and the tester are electrically connected to each other.

Abstract: A probe apparatus of inspecting electrical characteristics of a power device having electrodes on both sides of a substrate at wafer level can reduce and uniformize a contact resistance between the electrode on a rear surface of the substrate and a mounting surface conductor of a chuck top. In the probe apparatus, an attracting device supports a semiconductor wafer W on the chuck top 12, and has many vertical fine holes in a pattern (diameter ? and pitch p) that satisfies the condition of ?<p?2?. For example, the diameter ? is about 0.25 mm, and the pitch p is about 0.5 mm.

Abstract: A probe apparatus of inspecting electrical characteristics of a power device having electrodes on both sides of a substrate at wafer level can reduce and uniformize a contact resistance between the electrode on a rear surface of the substrate and a mounting surface conductor of a chuck top. In the probe apparatus, an attracting device supports a semiconductor wafer W on the chuck top 12, and has many vertical fine holes in a pattern (diameter ? and pitch p) that satisfies the condition of ?<p?2?. For example, the diameter ? is about 0.25 mm, and the pitch p is about 0.5 mm.

Abstract: A carrier supporting apparatus is configured to support a carrier containing a plurality of plate-like objects to be processed, such that each object to be processed is arranged vertically at an interval in a horizontal attitude. The carrier includes multiple sets of supporting stages each arranged vertically at an interval, wherein each set of the supporting stages are configured to support the periphery of a bottom face of one object to be processed. The carrier supporting apparatus comprises a placing table adapted to place the carrier thereon, a lifting member that can be raised and lowered relative to the placing table, and a drive mechanism adapted to drive the lifting mechanism. When raised, the lifting member raises a bottom face of the object to be processed, which is supported on a set of the lowermost supporting stages in the carrier, and lifts it up from the supporting stages.

Abstract: A carrier supporting apparatus (10) according to the present invention is configured to support a carrier (C) containing, therein, a plurality of substantially plate-like objects (D) to be processed, such that each object to be processed is arranged vertically at an interval in a horizontal attitude. The carrier includes multiple sets of supporting stages (bottom faces of grooves (1A)) each arranged vertically at an interval, wherein each set of the supporting stages are configured to support the periphery of a bottom face of each one object (D) to be processed. The carrier supporting apparatus comprises a placing table (11) adapted to place the carrier (C) thereon, a lifting member (12) provided such that it can be raised and lowered relative to the placing table, and a drive mechanism adapted to drive the lifting mechanism to be raised and lowered.

Abstract: A wafer chuck is provided with a plurality of pins which protrude and retreat in a plurality of through holes formed in a vertical direction on a mounting table, and an ascending/descending mechanism for ascending and descending the pins. The wafer chuck receives a wafer by protruding the pins from the mounting plane of the mounting table. On each upper end surface of the pin, a receiving surface part is provided for substantially not making a gap between the pin and each of the corresponding through holes and a mechanism for aligning the receiving surface part with the mounting surface is provided.

Abstract: A wafer chuck is provided with a plurality of pins which protrude and retreat in a plurality of through holes formed in a vertical direction on a mounting table, and an ascending/descending mechanism for ascending and descending the pins. The wafer chuck receives a wafer by protruding the pins from the mounting plane of the mounting table. On each upper end surface of the pin, a receiving surface part is provided for substantially not making a gap between the pin and each of the corresponding through holes and a mechanism for aligning the receiving surface part with the mounting surface is provided.