Patents by Inventor Yoshiyasu Morishima

Yoshiyasu Morishima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and semiconductor chip
    Patent number: 6404061
    Abstract: A semiconductor device having a solid device, and a semiconductor chip bonded to the solid device with a back face thereof being opposed to a front face of the solid device. The semiconductor chip has a back electrode provided on the back face thereof and electrically connected to an electrode provided on a front face thereof through a through-hole. The solid device may be a wiring board or another semiconductor chip. Further another semiconductor chip may be stacked and bonded onto the front face of the semiconductor chip.
    Type: Grant
    Filed: February 24, 2000
    Date of Patent: June 11, 2002
    Assignee: Rohm Co., Ltd.
    Inventors: Junichi Hikita, Isamu Nishimura, Nobuhisa Kumamoto, Yoshiyasu Morishima