Patents by Inventor Yoshiyasu Saeki

Yoshiyasu Saeki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wiring board with core layer containing inorganic filler
    Patent number: 6869665
    Abstract: A wiring board includes a core layer and a pair of multilayer wiring portions. The core layer, having an upper surface and a lower surface, is formed from a resin composite which contains resin filler and encloses several pieces of carbon fiber cloth. One of the multilayer wiring portions is stacked on the upper surface of the core layer, while the other is stacked on the lower surface of the core layer. Each multilayer wiring portion is composed of a number of insulating layers and wiring patterns stacked alternately with the insulating layers. The wiring patterns of the upper and the lower wiring portions are connected to each other by conductors extending through the entire thickness of the core layer.
    Type: Grant
    Filed: August 20, 2003
    Date of Patent: March 22, 2005
    Assignee: Fujitsu Limited
    Inventors: Motoaki Tani, Nobuyuki Hayashi, Tomoyuki Abe, Yasuhito Takahashi, Yoshiyasu Saeki
  • Wiring board with core layer containing inorganic filler
    Publication number: 20040151882
    Abstract: A wiring board includes a core layer and a pair of multilayer wiring portions. The core layer, having an upper surface and a lower surface, is formed from a resin composite which contains resin filler and encloses several pieces of carbon fiber cloth. One of the multilayer wiring portions is stacked on the upper surface of the core layer, while the other is stacked on the lower surface of the core layer. Each multilayer wiring portion is composed of a number of insulating layers and wiring patterns stacked alternately with the insulating layers. The wiring patterns of the upper and the lower wiring portions are connected to each other by conductors extending through the entire thickness of the core layer.
    Type: Application
    Filed: August 20, 2003
    Publication date: August 5, 2004
    Applicant: FUJITSU LIMITED
    Inventors: Motoaki Tani, Nobuyuki Hayashi, Tomoyuki Abe, Yasuhito Takahashi, Yoshiyasu Saeki