Patents by Inventor Yoshiyuki Furuta

Yoshiyuki Furuta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10990798
    Abstract: An analysis device includes: a cell image acquisition unit that acquires a plurality of cell images in which a stimulated cell has been captured; a feature value calculation unit that calculates a feature value for each of first and second constituent elements constituting the cell, from the cell images acquired by the cell image acquisition unit; a correlation calculation unit that calculates correlations between first feature values and between second feature values in the first and second constituent elements calculated by the feature value calculation unit; a correlation extraction unit that extracts the correlation between the first feature values by selecting the first feature values with respect to the correlations between the feature values in the first and second constituent elements calculated by the correlation calculation unit; and a display unit that displays the correlation between the first feature values extracted by the correlation extraction unit.
    Type: Grant
    Filed: November 10, 2016
    Date of Patent: April 27, 2021
    Assignees: THE UNIVERSITY OF TOKYO, NIKON CORPORATION
    Inventors: Masayuki Murata, Fumi Kano, Yoshiyuki Noguchi, Hirotada Watanabe, Nobuhiko Maiya, Shinichi Furuta, Takuro Saigo, Mamiko Masutani, Masafumi Yamashita, Shoko Yamasaki
  • Publication number: 20210017176
    Abstract: The present invention provides the compound, 3-[(1S,2S)-1-[5-[(4S)-2,2-Dimethyloxan-4-yl]-2-(4S)-2-(4-fluoro-3,5-dimethylphenyl)-3-[3-(4-fluoro-1-methylindazol-5-yl)-2-oxoimidazol-1-yl]-4-methyl-6,7-dihydro-4H-pyrazolo[4,3-c]pyridine-5-carbonyl]indol-1-yl]-2-methylcyclopropyl]-4H-1,2,4-oxadiazol-5-one, or a pharmaceutically acceptable salt of the compound, as well as a preventative agent or a therapeutic agent for non-insulin-dependent diabetes mellitus (Type 2 diabetes) or obesity containing such compound.
    Type: Application
    Filed: October 7, 2020
    Publication date: January 21, 2021
    Applicant: Chugai Seiyaku Kabushiki Kaisha
    Inventors: Hitoshi YOSHINO, Satoshi TSUCHIYA, Atsushi MATSUO, Tsutomu SATO, Masahiro NISHIMOTO, Kyoko OGURI, Hiroko OGAWA, Yoshikazu NISHIMURA, Yoshiyuki FURUTA, Hirotaka KASHIWAGI, Nobuyuki HORI, Takuma KAMON, Takuya SHIRAISHI, Shoshin YOSHIDA, Takahiro KAWAI, Satoshi TANIDA, Masahide AOKI
  • Patent number: 10858356
    Abstract: The present invention provides a compound having the basic structure shown by Formula (I) in which the indole ring and the pyrazolopyridine structure is bound through a substituent, a salt thereof or a solvate of either the compound or a salt of the compound, as well as a preventative agent or a therapeutic agent for non-insulin-dependent diabetes mellitus (Type 2 diabetes) or obesity containing such compound, salt or solvate as an active ingredient.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: December 8, 2020
    Assignee: Chugai Seiyaku Kabushiki Kaisha
    Inventors: Hitoshi Yoshino, Satoshi Tsuchiya, Atsushi Matsuo, Tsutomu Sato, Masahiro Nishimoto, Kyoko Oguri, Hiroko Ogawa, Yoshikazu Nishimura, Yoshiyuki Furuta, Hirotaka Kashiwagi, Nobuyuki Hori, Takuma Kamon, Takuya Shiraishi, Shoshin Yoshida, Takahiro Kawai, Satoshi Tanida, Masahide Aoki
  • Patent number: 10759890
    Abstract: Provided are: a curable composition that has excellent flexibility and shows excellent adhesion to both a plastic substrate and a conductor layer; a coating film of the curable composition; and a printed circuit board comprising a pattern-cured coating film obtained from the coating film. The present invention relates to: a curable composition for a printed circuit board, which is characterized by comprising (A) a block copolymer, (B) a hydroxyl group-containing (meth)acrylate compound and (C) a photopolymerization initiator; a coating film obtained by photo-curing the curable composition; and a printed circuit board comprising a resist pattern formed from the coating film.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: September 1, 2020
    Assignee: TAIYO INK MFG. CO., LTD.
    Inventors: Masayuki Shimura, Yoshiyuki Furuta, Masao Yumoto
  • Publication number: 20190225604
    Abstract: The present invention provides a compound having the basic structure shown by Formula (I) in which the indole ring and the pyrazolopyridine structure is bound through a substituent, a salt thereof or a solvate of either the compound or a salt of the compound, as well as a preventative agent or a therapeutic agent for non-insulin-dependent diabetes mellitus (Type 2 diabetes) or obesity containing such compound, salt or solvate as an active ingredient.
    Type: Application
    Filed: September 26, 2017
    Publication date: July 25, 2019
    Applicant: Chugai Seiyaku Kabushiki Kaisha
    Inventors: Hitoshi YOSHINO, Satoshi TSUCHIYA, Atsushi MATSUO, Tsutomu SATO, Masahiro NISHIMOTO, Kyoko OGURI, Hiroko OGAWA, Yoshikazu NISHIMURA, Yoshiyuki FURUTA, Hirotaka KASHIWAGI, Nobuyuki HORI, Takuma KAMON, Takuya SHIRAISHI, Shoshin YOSHIDA, Takahiro KAWAI, Satoshi TANIDA, Masahide AOKI
  • Patent number: 10113066
    Abstract: Provided are: a curable composition that shows good adhesion on a printed wiring board, particularly a flexible substrate or the like, and has a high hardness; a resist coating film of the curable composition; and a printed wiring board having a resist pattern of the resist coating film. The curable composition comprises: (A) a photobase generator; (B-1) an epoxy group-containing (meth)acrylate compound or (B-2) a carboxyl group-containing (meth)acrylate compound; (C) a photopolymerization initiator; and (D-1) a thermosetting component (excluding the (B-1) epoxy group-containing (meth)acrylate compound) or (D-2) a thermosetting component (excluding the (B-2) carboxyl group-containing (meth)acrylate compound).
    Type: Grant
    Filed: November 4, 2014
    Date of Patent: October 30, 2018
    Assignee: TAIYO INK MFG. CO., LTD.
    Inventors: Masayuki Shimura, Yoshiyuki Furuta, Masao Yumoto
  • Patent number: 10005911
    Abstract: Provided is a curable composition for a printed wiring board, which composition exhibits high physical strength as a coating film in terms of solder heat resistance, pencil hardness and the like and in which the components contained therein are not likely to precipitate in long-term storage even when the composition is configured to have a low viscosity and thereby made applicable to ink-jet printing, spin-coating and the like. The curable composition for a printed wiring board is characterized by comprising (A) a filler having a specific gravity of 3 or less, (B) a hydroxyl group-containing (meth)acrylate compound and (C) a photopolymerization initiator. The (A) filler having a specific gravity of 3 or less is preferably an inorganic filler.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: June 26, 2018
    Assignee: TAIYO INK MFG. CO., LTD.
    Inventors: Masayuki Shimura, Yoshiyuki Furuta, Masao Yumoto
  • Patent number: 9487517
    Abstract: The present invention relates to a compound represented by the following formula (1): wherein W, X, Y, R1, R2, R33, R34, m and n are as defined in the claims, or a pharmacologically acceptable salt thereof.
    Type: Grant
    Filed: September 17, 2015
    Date of Patent: November 8, 2016
    Assignee: Chugai Seiyaku Kabushiki Kaisha
    Inventors: Toru Esaki, Yoshikazu Nishimura, Yoshiaki Isshiki, Naoki Okamoto, Yoshiyuki Furuta, Akemi Mizutani, Masateru Ohta, Wayne Wen Lai, Tomoya Kotake
  • Publication number: 20160251520
    Abstract: Provided is a curable composition for a printed wiring board, which composition exhibits high physical strength as a coating film in terms of solder heat resistance, pencil hardness and the like and in which the components contained therein are not likely to precipitate in long-term storage even when the composition is configured to have a low viscosity and thereby made applicable to ink-jet printing, spin-coating and the like. The curable composition for a printed wiring board is characterized by comprising (A) a filler having a specific gravity of 3 or less, (B) a hydroxyl group-containing (meth)acrylate compound and (C) a photopolymerization initiator. The (A) filler having a specific gravity of 3 or less is preferably an inorganic filler.
    Type: Application
    Filed: September 30, 2014
    Publication date: September 1, 2016
    Applicant: TAIYO INK MFG. CO. LTD.
    Inventors: Masayuki SHIMURA, Yoshiyuki FURUTA, Masao YUMOTO
  • Publication number: 20160237282
    Abstract: Provided are: a curable composition that shows good adhesion on a printed wiring board, particularly a flexible substrate or the like, and has a high hardness; a resist coating film of the curable composition; and a printed wiring board having a resist pattern of the resist coating film. The curable composition comprises: (A) a photobase generator; (B-1) an epoxy group-containing (meth)acrylate compound or (B-2) a carboxyl group-containing (meth)acrylate compound; (C) a photopolymerization initiator; and (D-1) a thermosetting component (excluding the (B-1) epoxy group-containing (meth)acrylate compound) or (D-2) a thermosetting component (excluding the (B-2) carboxyl group-containing (meth)acrylate compound).
    Type: Application
    Filed: November 4, 2014
    Publication date: August 18, 2016
    Applicant: TAIYO INK MFG. CO., LTD.
    Inventors: Masayuki SHIMURA, Yoshiyuki FURUTA, Masao YUMOTO
  • Publication number: 20160215084
    Abstract: Provided are: a curable composition that has excellent flexibility and shows excellent adhesion to both a plastic substrate and a conductor layer; a coating film of the curable composition; and a printed circuit board comprising a pattern-cured coating film obtained from the coating film. The present invention relates to: a curable composition for a printed circuit board, which is characterized by comprising (A) a block copolymer, (B) a hydroxyl group-containing (meth)acrylate compound and (C) a photopolymerization initiator; a coating film obtained by photo-curing the curable composition; and a printed circuit board comprising a resist pattern formed from the coating film.
    Type: Application
    Filed: September 30, 2014
    Publication date: July 28, 2016
    Applicant: TAIYO INK MFG CO., LTD.
    Inventors: Masayuki SHIMURA, Yoshiyuki FURUTA, Masao YUMOTO
  • Patent number: 9265156
    Abstract: A curable composition to be used for a printed wiring board is disclosed, which has an excellent flexibility and an excellent adhesive property with respect to both a plastic substrate and a conductive layer in the printed wiring board. The curable composition includes (A) a (meth)acrylate compound having a polyene structure, (B) a (meth)acrylate compound having a hydroxyl group; and (C) a photopolymerization initiator. From the curable composition, a cured coating film, and a printed wiring board including the cured coating film in the form of a predetermined pattern are obtained.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: February 16, 2016
    Assignee: Taiyo Ink Mfg. Co., Ltd.
    Inventors: Masayuki Shimura, Yoshiyuki Furuta, Masao Yumoto, Shoji Minegishi
  • Publication number: 20160016956
    Abstract: The present invention relates to a compound represented by the following formula (1): wherein W, X, Y, R1, R2, R33, R34, m and n are as defined in the claims, or a pharmacologically acceptable salt thereof.
    Type: Application
    Filed: September 17, 2015
    Publication date: January 21, 2016
    Applicant: Chugai Seiyaku Kabushiki Kaisha
    Inventors: Toru Esaki, Yoshikazu NISHIMURA, Yoshiaki ISSHIKI, Naoki OKAMOTO, Yoshiyuki FURUTA, Akemi MIZUTANI, Masateru OHTA, Wayne Wen LAI, Tomoya KOTAKE
  • Patent number: 9182665
    Abstract: An object of the present invention is to obtain a white curable composition that can yield a highly reflective cured coating film without requiring a complicated step and show good dispersion even without being subjected to an extended dispersion treatment. Provided is a white curable composition for a printed circuit board comprising: (A) a white pigment; (B) a (meth)acrylate compound having a hydroxyl group; (C) a photopolymerization initiator; and (D) a wetting dispersant. The above-described (A) white pigment is preferably titanium oxide. Further, it is also preferred that the above-described titanium oxide be a rutile-type titanium oxide and have a maximum particle size of 1 ?m or smaller.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: November 10, 2015
    Assignee: TAIYO INK MFG. CO., LTD.
    Inventors: Masayuki Shimura, Yoshiyuki Furuta, Masao Yumoto
  • Patent number: 9169254
    Abstract: The present invention relates to a compound represented by the following formula (1): wherein W, X, Y, R1, R2, R33, R34, m and n are as defined in the claims, or a pharmacologically acceptable salt thereof.
    Type: Grant
    Filed: April 27, 2010
    Date of Patent: October 27, 2015
    Assignee: Chugai Seiyaku Kabushiki Kaisha
    Inventors: Toru Esaki, Yoshikazu Nishimura, Yoshiaki Isshiki, Naoki Okamoto, Yoshiyuki Furuta, Akemi Mizutani, Masateru Ohta, Wayne Wen Lai, Tomoya Kotake
  • Publication number: 20150090482
    Abstract: Provided are: a curable composition which can attain both good adhesion to a printed circuit board, particularly to a flexible substrate or the like; a resist coating film of the curable composition; and a printed circuit board comprising a resist pattern formed by the curable composition. By the present invention, a curable composition for a printed circuit board comprising (A) a compound having a triazine ring, (B) a (meth)acrylate compound having a hydroxyl group and (C) a photopolymerization initiator; a coating film obtained by photo-curing the curable composition; and a printed circuit board comprising a resist pattern formed by the curable composition, are obtained.
    Type: Application
    Filed: September 30, 2014
    Publication date: April 2, 2015
    Applicant: TAIYO INK MFG. CO., LTD.
    Inventors: Masayuki SHIMURA, Yoshiyuki FURUTA, Masao YUMOTO
  • Publication number: 20150093690
    Abstract: An object of the present invention is to obtain a white curable composition that can yield a highly reflective cured coating film without requiring a complicated step and show good dispersion even without being subjected to an extended dispersion treatment. Provided is a white curable composition for a printed circuit board comprising: (A) a white pigment; (B) a (meth)acrylate compound having a hydroxyl group; (C) a photopolymerization initiator; and (D) a wetting dispersant. The above-described (A) white pigment is preferably titanium oxide. Further, it is also preferred that the above-described titanium oxide be a rutile-type titanium oxide and have a maximum particle size of 1 ?m or smaller.
    Type: Application
    Filed: September 30, 2014
    Publication date: April 2, 2015
    Applicant: TAIYO INK MFG. CO., LTD.
    Inventors: Masayuki SHIMURA, Yoshiyuki FURUTA, Masao YUMOTO
  • Publication number: 20140290990
    Abstract: A curable composition to be used for a printed wiring board is disclosed, which has an excellent flexibility and an excellent adhesive property with respect to both a plastic substrate and a conductive layer in the printed wiring board. The curable composition includes (A) a (meth)acrylate compound having a polyene structure, (B) a (meth)acrylate compound having a hydroxyl group; and (C) a photopolymerization initiator. From the curable composition, a cured coating film, and a printed wiring board including the cured coating film in the form of a predetermined pattern are obtained.
    Type: Application
    Filed: March 27, 2014
    Publication date: October 2, 2014
    Applicant: TAlYO INK MFG. CO., LTD.
    Inventors: Masayuki SHIMURA, Yoshiyuki FURUTA, Masao YUMOTO, Shoji MINEGISHI
  • Publication number: 20120270838
    Abstract: The present invention relates to a compound represented by the following formula (1): wherein W, X, Y, R1, R2, R33, R34, m and n are as defined in the claims, or a pharmacologically acceptable salt thereof.
    Type: Application
    Filed: April 27, 2010
    Publication date: October 25, 2012
    Applicant: CHUGAI SEIYAKU KABUSHIKI KAISHA
    Inventors: Toru Esaki, Yoshikazu Nishimura, Yoshiaki Isshiki, Naoki Okamoto, Yoshiyuki Furuta, Akemi Mizutani, Masateru Ohta, Wayne Wen Lai, Tomoya Kotake