Patents by Inventor Yoshiyuki Goto

Yoshiyuki Goto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11421301
    Abstract: This free-cutting copper alloy casting contains: 76.0-79.0% Cu, 3.1-3.6% Si, 0.36-0.85% Sn, 0.06-0.14% P, 0.022-0.10% Pb, with the remainder being made up of Zn and unavoidable impurities. This composition satisfies the following relations: 75.5?f1=Cu+0.8×Si?7.5×Sn+P+0.5×Pb?78.7, 60.8?f2=Cu?4.5×Si—0.8×Sn?P+0.5×Pb?62.2, 0.09?f3=P/Sn?0.35. The area ratios (%) of the constituent phases satisfy the following relations, 30???63, 0???2.0, 0???0.3, 0???2.0, 96.5?f4=?+?, 99.3?f5=?+?+?+?, 0?f6=?+??3.0, and 37?f7=1.05×?+6×?1/2+0.5×??72. The ? phase is present within the ? phase, the long side of the ? phase does not exceed 50 ?m, and the long side of the ? phase does not exceed 25 ?m.
    Type: Grant
    Filed: August 15, 2017
    Date of Patent: August 23, 2022
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Shinji Tanaka, Yoshiyuki Goto
  • Publication number: 20220172454
    Abstract: A system is a system including: a cloud server configured to perform a machine learning process; and a client apparatus configured to communicate with the cloud server. The client apparatus includes: a generating unit that generates one or a plurality of reference data from a plurality of data used for the machine learning and that generates a plurality of difference data, wherein the reference data is a reference for at least a part of the plurality of data, and each difference data indicates a difference between each of the plurality of data and corresponding reference data out of the one or the plurality of reference data; and a storage unit that stores the plurality of difference data in a storage apparatus of the cloud server.
    Type: Application
    Filed: February 17, 2020
    Publication date: June 2, 2022
    Applicant: NEC Corporation
    Inventor: Yoshiyuki GOTO
  • Patent number: 11313013
    Abstract: This free-cutting copper alloy contains more than 77.0% but less than 81.0% Cu, more than 3.4% but less than 4.1% Si, 0.07% to 0.28% Sn, 0.06% to 0.14% P, and more than 0.02% but less than 0.25% Pb, with the remainder being made up of Zn and unavoidable impurities. The composition satisfies the following relations: 1.0?f0=100×Sn/(Cu+Si+0.5×Pb+0.5×P?75.5)?3.7, 78.5?f1=Cu+0.8×Si?8.5×Sn+P+0.5×Pb?83.0, 61.8?f2=Cu?4.2×Si?0.5×Sn?2×P?63.7. The area ratios (%) of the constituent phases satisfy the following relations, 36???72, 0???2.0, 0???0.5, 0???2.0, 96.5?f3=?+?, 99.4?f4=?+?+?+?, 0?f5=?+??3.0, 38?f6=?+6×?1/2+0.5×??80. The long side of the ? phase does not exceed 50 ?m, and the long side of the ? phase does not exceed 25 ?m.
    Type: Grant
    Filed: August 15, 2017
    Date of Patent: April 26, 2022
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Shinji Tanaka, Yoshiyuki Goto
  • Patent number: 11136648
    Abstract: This free-cutting copper alloy contains 76.0%-79.0% Cu, 3.1%-3.6% Si, 0.36%-0.84% Sn, 0.06%-0.14% P, 0.022%-0.10% Pb, with the remainder being made up of Zn and unavoidable impurities. The composition satisfies the following relations: 74.4?f1=Cu+0.8×Si?8.5×Sn+P+0.5×Pb?78.2, 61.2?f2=Cu?4.4×Si?0.7×Sn?P+0.5×Pb?62.8, 0.09?f3=P/Sn?0.35. The area ratio (%) of the constituent phases satisfies the following relations: 30???65, 0???2.0, 0???0.3, 0???2.0, 96.5?f4=?+?, 99.4?f5=?+?+?+?, 0?f6=?+??3.0, 36?f7=1.05×?+6×?1/2+0.5×??72. The ? phase is present within the ? phase, the long side of the ? phase does not exceed 50 ?m, and the long side of the ? phase does not exceed 25 ?m.
    Type: Grant
    Filed: August 15, 2017
    Date of Patent: October 5, 2021
    Assignee: Mitsubishi Materials Corporation
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Shinji Tanaka, Yoshiyuki Goto
  • Publication number: 20200234149
    Abstract: An information processing device according to an example embodiment includes: a calculation unit that calculates a feature amount between multiple pieces of attribute information in analysis data including the multiple pieces of attribute information; and a prediction unit that predicts, from the feature amount, processing time when an analysis task for the analysis data is performed by using a predetermined resource.
    Type: Application
    Filed: September 14, 2018
    Publication date: July 23, 2020
    Applicant: NEC Corporation
    Inventor: Yoshiyuki GOTO
  • Publication number: 20200157658
    Abstract: This free-cutting copper alloy casting contains: 76.0-79.0% Cu, 3.1-3.6% Si, 0.36-0.85% Sn, 0.06-0.14% P, 0.022-0.10% Pb, with the remainder being made up of Zn and unavoidable impurities. This composition satisfies the following relations: 75.5?f1=Cu+0.8×Si?7.5×Sn+P+0.5×Pb?78.7, 60.8?f2=Cu?4.5×Si—0.8×Sn?P+0.5×Pb?62.2, 0.09?f3=P/Sn?0.35. The area ratios (%) of the constituent phases satisfy the following relations, 30???63, 0???2.0, 0???0.3, 0???2.0, 96.5?f4=?+?, 99.3?f5=?+?+?+?, 0?f6=?+??3.0, and 37?f7=1.05×?+6×?1/2+0.5×??72. The ? phase is present within the ? phase, the long side of the ? phase does not exceed 50 ?m, and the long side of the ? phase does not exceed 25 ?m.
    Type: Application
    Filed: August 15, 2017
    Publication date: May 21, 2020
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Shinji Tanaka, Yoshiyuki Goto
  • Publication number: 20200123633
    Abstract: This free-cutting copper alloy contains 76.0%-79.0% Cu, 3.1%-3.6% Si, 0.36%-0.84% Sn, 0.06%-0.14% P, 0.022%-0.10% Pb, with the remainder being made up of Zn and unavoidable impurities. The composition satisfies the following relations: 74.4?f1=Cu+0.8×Si?8.5×Sn+P+0.5×Pb?78.2, 61.2?f2=Cu?4.4×Si?0.7×Sn?P+0.5×Pb?62.8, 0.09?f3=P/Sn?0.35. The area ratio (%) of the constituent phases satisfies the following relations: 30???65, 0???2.0, 0???0.3, 0???2.0, 96.5?f4=?+?, 99.4?f5=?+?+?+?, 0?f6=?+??3.0, 36?f7=1.05×?+6×?1/2+0.5×??72. The ? phase is present within the ? phase, the long side of the ? phase does not exceed 50 ?m, and the long side of the ? phase does not exceed 25 ?m.
    Type: Application
    Filed: August 15, 2017
    Publication date: April 23, 2020
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Shinji Tanaka, Yoshiyuki Goto
  • Patent number: 10538827
    Abstract: This free-cutting copper alloy casting contains 75.0-78.5% Cu, 2.95-3.55% Si, 0.07-0.28% Sn, 0.06-0.14% P, 0.022-0.20% Pb, with the remainder being made up of Zn and unavoidable impurities. The composition satisfies the following relations: 76.2?f1=Cu+0.8×Si?8.5×Sn+P+0.5×Pb?80.3, 61.2?f2=Cu?4.4×Si?0.8×Sn?P+0.5×Pb?62.8. The area ratios (%) of the constituent phases satisfy the following relations: 2.5??65, 0???2.0, 0???0.3, 0???2.0, 96.5?f3=?+?, 99.2?f4=?+?+?+?, 0?f6=?+??3.0, 29?f6=?+6×?1/2+0.5×??66. The long side of the ? phase does not exceed 50 ?m, the long side of the ? phase does not exceed 25 ?m, and the ? phase is present within the ? phase.
    Type: Grant
    Filed: August 15, 2017
    Date of Patent: January 21, 2020
    Assignee: Mitsubishi Shindoh Co., Ltd.
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Shinji Tanaka, Yoshiyuki Goto
  • Patent number: 10400931
    Abstract: A curved portion at an inner circumferential face on a bend direction inside of a bend has a circular arc shape. By configuring the curved portion with a circular arc shape, a recess, serving as an example of a cross-sectional area enlargement portion that enlarges the cross-sectional area of a flow path of a pipe body running along a direction of an axial line 13, is formed in the inner circumferential face on the bend direction inside of the bend.
    Type: Grant
    Filed: February 26, 2015
    Date of Patent: September 3, 2019
    Assignee: Nifco Inc.
    Inventors: Youhei Souma, Hiroyuki Nakaya, Yoshio Tomono, Tadahiro Kitamura, Yoshiyuki Goto
  • Publication number: 20190256960
    Abstract: This free-cutting copper alloy casting contains 75.0-78.5% Cu, 2.95-3.55% Si, 0.07-0.28% Sn, 0.06-0.14% P, 0.022-0.20% Pb, with the remainder being made up of Zn and unavoidable impurities. The composition satisfies the following relations: 76.2?f1=Cu+0.8×Si?8.5×Sn+P+0.5×Pb?80.3, 61.2?f2=Cu?4.4×Si?0.8×Sn?P+0.5×Pb?62.8. The area ratios (%) of the constituent phases satisfy the following relations: 2.5??65, 0???2.0, 0???0.3, 0???2.0, 96.5?f3=?+?, 99.2?f4=?+?+?+?, 0?f6=?+??3.0, 29?f6=?+6×?1/2+0.5×??66. The long side of the ? phase does not exceed 50 ?m, the long side of the ? phase does not exceed 25 ?m, and the ? phase is present within the ? phase.
    Type: Application
    Filed: August 15, 2017
    Publication date: August 22, 2019
    Applicant: Mitsubishi Shindoh Co., Ltd.
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Shinji Tanaka, Yoshiyuki Goto
  • Publication number: 20190169711
    Abstract: This free-cutting copper alloy contains more than 77.0% but less than 81.0% Cu, more than 3.4% but less than 4.1% Si, 0.07% to 0.28% Sn, 0.06% to 0.14% P, and more than 0.02% but less than 0.25% Pb, with the remainder being made up of Zn and unavoidable impurities. The composition satisfies the following relations: 1.0?f0=100×Sn/(Cu+Si+0.5×Pb+0.5×P?75.5)?3.7, 78.5?f1=Cu+0.8×Si?8.5×Sn+P+0.5×Pb?83.0, 61.8?f2=Cu?4.2×Si?0.5×Sn?2×P?63.7. The area ratios (%) of the constituent phases satisfy the following relations, 36???72, 0???2.0, 0???0.5, 0???2.0, 96.5?f3=?+?, 99.4?f4=?+?+?+?, 0?f5=?+??3.0, 38?f6=?+6×?1/2+0.5×??80. The long side of the ? phase does not exceed 50 ?m, and the long side of the ? phase does not exceed 25 ?m.
    Type: Application
    Filed: August 15, 2017
    Publication date: June 6, 2019
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Shinji Tanaka, Yoshiyuki Goto
  • Patent number: 10253913
    Abstract: A curved tube structure, including: a tube main body including a bent portion at one portion in an axis line direction; and an enlarged cross-section portion formed along the axis line direction of the tube main body in an inner periphery inside a bending direction of the bent portion for enlarging a cross-section area of the tube main body.
    Type: Grant
    Filed: September 13, 2013
    Date of Patent: April 9, 2019
    Assignee: NIFCO INC.
    Inventors: Youhei Souma, Hiroyuki Nakaya, Yoshio Tomono, Tadahiro Kitamura, Yoshiyuki Goto
  • Publication number: 20180128408
    Abstract: A curved portion at an inner circumferential face on a bend direction inside of a bend has a circular arc shape. By configuring the curved portion with a circular arc shape, a recess, serving as an example of a cross-sectional area enlargement portion that enlarges the cross-sectional area of a flow path of a pipe body running along a direction of an axial line 13, is formed in the inner circumferential face on the bend direction inside of the bend.
    Type: Application
    Filed: February 26, 2015
    Publication date: May 10, 2018
    Inventors: Youhei SOUMA, Hiroyuki NAKAYA, Yoshio TOMONO, Tadahiro KITAMURA, Yoshiyuki GOTO
  • Publication number: 20180089574
    Abstract: A data processing device 100 is intended to provide learning data to a system 200 that generates a prediction model by performing machine learning. The data processing device 100 includes: a data obtaining unit 10 that obtains learning data input from the outside; an encryption unit 20 that encrypts the learning data so that a prediction model generated from the learning data in an unencrypted state and a prediction model generated from the learning data in an encrypted state have a corresponding relationship with each other in terms of parameters, numeric values, and operators; and a data output unit 30 that outputs the encrypted learning data to the system 200.
    Type: Application
    Filed: September 27, 2017
    Publication date: March 29, 2018
    Inventor: Yoshiyuki GOTO
  • Publication number: 20170083818
    Abstract: An information processing apparatus for determining an appropriate processing parameter of a predetermined process and obtaining processing time of the predetermined process, in a shorter period of time is provided. A learning support apparatus 500 includes an input unit 540 and an identifying unit 550. The input unit 540 receives input of new learning data. The identifying unit 550 identifies and outputs at least one of a value of a processing parameter and a value of processing performance of a learning process for the new learning data using history of processing performance of the learning process performed for learning data.
    Type: Application
    Filed: September 16, 2016
    Publication date: March 23, 2017
    Applicant: NEC Corporation
    Inventor: Yoshiyuki GOTO
  • Publication number: 20150226360
    Abstract: A curved tube structure, including: a tube main body including a bent portion at one portion in an axis line direction; and an enlarged cross-section portion formed along the axis line direction of the tube main body in an inner periphery inside a bending direction of the bent portion for enlarging a cross-section area of the tube main body.
    Type: Application
    Filed: September 13, 2013
    Publication date: August 13, 2015
    Inventors: Youhei Souma, Hiroyuki Nakaya, Yoshio Tomono, Tadahiro Kitamura, Yoshiyuki Goto
  • Publication number: 20090232930
    Abstract: An object is to prevent a disk substrate from warping to thereby improve the quality of the disk substrate. A disk molding mold includes a first support plate; a first mirror surface disk attached to the first support plate; a second support plate; and a second mirror surface disk attached to the second support plate and facing the first mirror surface disk. At least one of the first and second mirror surface disks comprises a first plate, and a second plate disposed to surround at least a front surface of the first plate. The first plate comprises a temperature control flow passage (93, 94) formed on a surface thereof facing the first support plate. The second plate comprises a heat insulation section formed on a surface thereof facing the first plate such that the heat insulation section corresponds to the temperature control flow passage (93, 94). Since the distribution of heat in the first and second plates is made uniform, a molding material within a cavity can be cooled uniformly.
    Type: Application
    Filed: March 12, 2007
    Publication date: September 17, 2009
    Applicant: SUMITOMO HEAVY INDUSTRIES, LTD
    Inventors: Yasuo Suzuki, Yoshiyuki Goto, Shouji Yokota
  • Publication number: 20090074904
    Abstract: An object is to improve the wear resistance of a mold part and improve accuracy of disc substrates. A disc-molding mold comprises a first mold including a first support plate and a first mirror-surface disc attached to the first support plate; and a second mold including a second support plate and a second mirror-surface disc attached to the second support plate. A sliding surface of a mold part disposed on one of the first and second molds is treated by means of low-temperature nitriding. In this case, since the mold part is treated by means of low-temperature nitriding, the wear resistance of the mold part can be improved. In addition, since the treatment temperature is low, even when low-temperature nitriding is performed on a mold part which is complicated in shape, the mold part does not deform, and its dimensional variation can be decreased.
    Type: Application
    Filed: May 17, 2006
    Publication date: March 19, 2009
    Inventors: Yoshiyuki Goto, Yuji Shibutani, Yuichi Inada
  • Publication number: 20070275115
    Abstract: The invention provides a mold for molding a disk which can uniformly cool a molded product and prevent generation of printing unevenness in a printing region of the molded product, and a molded product molded by use of the mold. The mold includes a first mold plate; a first mirror-surface disk; a second mold plate disposed to advance and retreat in relation to the first mold plate; a second mirror-surface disk forming a cavity in cooperation with the first mirror-surface disk in a mold-clamped condition; a stamper (32) attached to one of the first and second mirror-surface disks and having a fine pattern formed on a front end surface thereof; and a bush (55) extending through the other of the first and second mirror-surface disks. On a front end surface of the other mirror-surface disk, the bush (55) is disposed radially inward of a region for forming a clamp area.
    Type: Application
    Filed: March 30, 2005
    Publication date: November 29, 2007
    Inventors: Yuichi Inada, Hiroyuki Sawaishi, Yuji Shibutani, Yoshiyuki Goto
  • Publication number: 20070176311
    Abstract: A mold for molding a disk and a method of molding a disk substrate which can enhance flatness and thus quality of a molded product are provided. The mold for molding a disk includes a first mirror-surface disk; a stamper (29) attached to the first mirror-surface disk; a second mirror-surface disk disposed in opposition to the first mirror-surface disk and forming a cavity therebetween at the time of mold clamping; and an adjustment member having a surface allowing the stamper (29) to slide thereon, formed near an outer circumference of the first mirror-surface disk, extending radially outward, and projecting toward the cavity. Even when, during the entire disk substrate being cooled, shrinkage of the disk substrate near the outer circumference thereof is small, whereas shrinkage of the remaining portion thereof is large, an increase in thickness of the disk substrate near the outer circumference thereof can be prevented.
    Type: Application
    Filed: March 7, 2005
    Publication date: August 2, 2007
    Inventors: Hiroyuki Sawaishi, Yoshiyuki Goto