Abstract: A comparison system is provided with a defect inspection unit, a reference pattern storage unit, a pattern comparison unit, a comparison result processing unit and an output unit. The inspection unit inspects an object processed by a processing system, such as a semiconductor wafer, and obtains the distribution pattern of defects occurring on the surface of the object. The storage unit previously stores a reference pattern indicating a characteristic configuration of a specific portion of the processing system, which comes into contact with or approaches the object. The comparison unit compares the defect distribution pattern obtained by the defect inspection unit with the reference pattern stored in the storage unit. The comparison result processing unit obtains the degree of coincidence between the two patterns based on the comparison performed by the pattern comparison unit. The output unit outputs the obtained degree of coincidence to a display or the like.

Abstract: A film deposition device includes a substrate transporting device arranged in a vacuum chamber to include a circulatory transport path in which substrate mounting parts arranged in a row are transported in a circulatory manner, the circulatory transport path including a linear transport path in which the substrate mounting parts are transported linearly. A first reactive gas supplying part is arranged along a transporting direction in which the substrate mounting parts are transported in the linear transport path, to supply a first reactive gas to the substrate mounting parts. A second reactive gas supplying part is arranged alternately with the first reactive gas supplying part along the transporting direction, to supply a second reactive gas to the substrate mounting parts. A separation gas supplying part is arranged to supply a separation gas to a space between the first reactive gas supplying part and the second reactive gas supplying part.

Abstract: A comparison system is provided with a defect inspection unit, a reference pattern storage unit, a pattern comparison unit, a comparison result processing unit and an output unit. The inspection unit inspects an object processed by a processing system, such as a semiconductor wafer, and obtains the distribution pattern of defects occurring on the surface of the object. The storage unit previously stores a reference pattern indicating a characteristic configuration of a specific portion of the processing system, which comes into contact with or approaches the object. The comparison unit compares the defect distribution pattern obtained by the defect inspection unit with the reference pattern stored in the storage unit. The comparison result processing unit obtains the degree of coincidence between the two patterns based on the comparison performed by the pattern comparison unit. The output unit outputs the obtained degree of coincidence to a display or the like.

Abstract: The present invention provides a gas introducing apparatus, which can perform start and stop of supplying a gas at respective gas injection holes, rapidly and simultaneously. A gas introducing apparatus 24 installed in a gas-dischargeable processing vessel 22 includes a gas introducing head 110 configured to face the processing vessel. Gas supply passages 12 each configured to flow a supply gas through the gas introducing vessel, exhaust passages 114, control gas passages 116 each configured to flow a control gas, and a plurality of gas injection holes 28 provided in a face of the gas introducing head facing the processing vessel, are provided in the gas introducing head 110. Pure fluid logic elements 118 are provided in the gas introducing head 110, each being in communication with the gas supply passage, exhaust passage and control gas passage, and corresponding to each gas injection hole.

Abstract: A wafer mounting table constituted as a ceramic heater has a power feeding terminal section for a heating element and a bonding section to a supporting member as portions which are likely to be crack starting points. The wafer mounting table is constituted to permit compressive stress to be generated in the power feeding terminal section and/or the bonding section which are likely to be the crack starting points.

Abstract: A gas shower head installed opposedly to the surface of a substrate, having a large number of holes in the surface thereof opposed to the substrate, and feeding multiple types of film forming gases fed from a gas feed passage simultaneously to the substrate through the holes, comprising a shower head body having a plurality of metal members with contact faces locally joined to each other by metal diffusion by heating the plurality of the metal members under specified temperature conditions in the stacked state in vertical direction and a plurality of gas flow passages passing through the inside of the shower head body so as to cross the contact faces and formed independently of each other for each type of the film forming gases so that these film forming gases are not mixed with each other, wherein the temperature conditions are such that the locally joined portions by metal diffusion can be separated from each other by a reheating performed later.

Abstract: A cathode-ray tube having a face plate which includes a phosphor layer provided at the inner surface side of a glass plate and an optical interference filter provided between the phosphor layer and the inner surface of the plate. The optical interference filter is constituted by high- and low-refractive index layers. The outermost layer of the optical interference filter in contact with the phosphor layer is an Al.sub.2 O.sub.3 layer or a ZrO.sub.2 layer having a physical thickness of 10 nm or more. The high-refractive index layer of the optical interference filter preferably consists of TiO.sub.2, and its low-refractive index layer preferably consists of Al.sub.2 O.sub.3.

Abstract: In a demultiplexing and/or multiplexing optical circuit of the invention, a groove for arranging a filter in an optical waveguide is arranged to be perpendicular to a pair of parallel opposing sides of a substrate for constituting the optical circuit. A plurality of demultiplexer and/or multiplexer can be formed simultaneously, and a high machining precision can be obtained relatively easily.