Patents by Inventor Yoshiyuki Hirase

Yoshiyuki Hirase has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9000116
    Abstract: A blow molding ethylene resin composition satisfies the following requirements [a], [b], [c] and [d] at the same time: [a] the melt flow rate (MFR) at a temperature of 190° C. under a load of 21.6 kg is in the range of 1.0 to 15 g/10 min; [b] the density is in the range of 955 to 970 kg/m3; [c] the number of methyl branches per 1000 carbon atoms is less than 0.1 according to 13C-NMR; [d] the tensile impact strength measured at ?40° C. in accordance with JIS K 7160 is not less than 270 kJ/m2.
    Type: Grant
    Filed: April 2, 2012
    Date of Patent: April 7, 2015
    Assignees: Prime Polymer Co., Ltd., Mitsui Chemicals, Inc.
    Inventors: Yoshiyuki Hirase, Kenji Iwamasa
  • Publication number: 20120189792
    Abstract: A blow molding ethylene resin composition satisfies the following requirements [a], [b], [c] and [d] at the same time: [a] the melt flow rate (MFR) at a temperature of 190° C. under a load of 21.6 kg is in the range of 1.0 to 15 g/10 min; [b] the density is in the range of 955 to 970 kg/m3; [c] the number of methyl branches per 1000 carbon atoms is less than 0.1 according to 13C-NMR; [d] the tensile impact strength measured at ?40° C. in accordance with JIS K 7160 is not less than 270 kJ/m2.
    Type: Application
    Filed: April 2, 2012
    Publication date: July 26, 2012
    Inventors: Yoshiyuki HIRASE, Kenji IWAMASA
  • Patent number: 8129489
    Abstract: The present invention provides an ethylene polymer that has excellent fluidity and moldability as well as gives a molded product having excellent mechanical strength. The ethylene polymer of the present invention contains 0.02 to 1.50 mol % of a constitutional unit derived from ?-olefin having 6 to 10 carbon atoms, and has the density of 945 to 975 kg/m3, which satisfies both of the following requirements [1] and [2] simultaneously: [1] in CFC, all the components having a molecular weight of 100,000 or more are eluted at a temperature of 85° C. or higher; and [2] the components eluted at a temperature of 80° C. or lower account for up to 5% of all the components eluted in CFC.
    Type: Grant
    Filed: August 12, 2005
    Date of Patent: March 6, 2012
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Masahiko Okamoto, Tetsuji Kasai, Yasushi Tohi, Koji Endo, Shiro Otsuzuki, Takahiro Akashi, Kenji Iwamasa, Yoshiyuki Hirase, Keiko Fukushi, Shinichi Nagano
  • Publication number: 20100028578
    Abstract: A blow molding ethylene resin composition satisfies the following requirements [a], [b], [c] and [d] at the same time: [a] the melt flow rate (MFR) at a temperature of 190° C. under a load of 21.6 kg is in the range of 1.0 to 15 g/10 min; [b] the density is in the range of 955 to 970 kg/m3; [c] the number of methyl branches per 1000 carbon atoms is less than 0.1 according to 13C-NMR; [d] the tensile impact strength measured at ?40° C. in accordance with JIS K 7160 is not less than 270 kJ/m2.
    Type: Application
    Filed: January 15, 2008
    Publication date: February 4, 2010
    Inventors: Yoshiyuki Hirase, Kenji Iwamasa
  • Publication number: 20070244286
    Abstract: The present invention provides an ethylene polymer that has excellent fluidity and moldability as well as gives a molded product having excellent mechanical strength. The ethylene polymer of the present invention contains 0.02 to 1.50 mol % of a constitutional unit derived from ?-olefin having 6 to 10 carbon atoms, and has the density of 945 to 975 kg/m3, which satisfies both of the following requirements [1] and [2] simultaneously: [1] in CFC, all the components having a molecular weight of 100,000 or more are eluted at a temperature of 85° C. or higher; and [2] the components eluted at a temperature of 80° C. or lower account for up to 5% of all the components eluted in CFC.
    Type: Application
    Filed: August 12, 2005
    Publication date: October 18, 2007
    Inventors: Masahiko Okamoto, Tetsuji Kasai, Yasushi Tohi, Koji Endo, Shiro Otsuzuki, Takahiro Akashi, Kenji Iwamasa, Yoshiyuki Hirase, Keiko Fukushi, Shinichi Nagano