Patents by Inventor Yoshiyuki Ikuma

Yoshiyuki Ikuma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210242553
    Abstract: The present invention relates to a laminated body with electric conductor including a substrate; a functional layer having at least an adhesive layer; an electric conductor; and a protective material, wherein the substrate, the functional layer having at least the adhesive layer, the electric conductor, and the protective material are sequentially laminated in a thickness direction, and wherein a thickness of the functional layer is less than or equal to 0.300 mm.
    Type: Application
    Filed: April 19, 2021
    Publication date: August 5, 2021
    Applicants: AGC Inc., AGC GLASS EUROPE, AGC FLAT GLASS NORTH AMERICA, INC., AGC Vidros do Brasil Ltda.
    Inventors: Tetsuya HIRAMATSU, Ryuta SONODA, Yoshiyuki IKUMA, Masaki HORIE, Ryota OKUDA
  • Publication number: 20210242641
    Abstract: A coaxial connector includes a base surface; a coaxial structure where a dielectric is between a central conductor and an outer conductor; and a protrusion protruding from the base surface. The central conductor includes a contact portion protruding from the base surface. In response to a substrate being inserted toward the base surface between the contact portion and the protrusion, the contact portion comes into contact with a conductor pattern formed on a surface of the substrate. The outer conductor includes a protruding conductor protruding from the base surface and not in contact with the substrate inserted between the contact portion and the protrusion.
    Type: Application
    Filed: April 19, 2021
    Publication date: August 5, 2021
    Applicants: AGC Inc., AGC GLASS EUROPE, AGC FLAT GLASS NORTH AMERICA, INC., AGC Vidros do Brasil Ltda.
    Inventor: Yoshiyuki IKUMA
  • Publication number: 20170179982
    Abstract: A high-frequency module according to an embodiment includes a first board, a first device, a second board, a metal core, and a casing. The first board is formed with an opening, and has a surface at a first side on which a transmission circuit transmitting microwaves is formed. The first device is disposed in the opening of the first board. The second substrate is disposed at a second side of the first board. The second substrate is formed with a control circuit for the first device, and has an opening at a location overlapping the first device. The metal core is disposed between the first board and the second board, and is in contact with the first device. The casing includes a connection connected with the metal core via an opening formed in the second board.
    Type: Application
    Filed: February 28, 2017
    Publication date: June 22, 2017
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Yoshiyuki IKUMA, Masatoshi Suzuki
  • Patent number: 9621196
    Abstract: A high-frequency module according to an embodiment includes a first board, a first device, a second board, a metal core, and a casing. The first board is formed with an opening, and has a surface at a first side on which a transmission circuit transmitting microwaves is formed. The first device is disposed in the opening of the first board. The second substrate is disposed at a second side of the first board. The second substrate is formed with a control circuit for the first device, and has an opening at a location overlapping the first device. The metal core is disposed between the first board and the second board, and is in contact with the first device. The casing includes a connection connected with the metal core via an opening formed in the second board.
    Type: Grant
    Filed: March 1, 2016
    Date of Patent: April 11, 2017
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yoshiyuki Ikuma, Masatoshi Suzuki
  • Publication number: 20160261292
    Abstract: A high-frequency module according to an embodiment includes a first board, a first device, a second board, a metal core, and a casing. The first board is formed with an opening, and has a surface at a first side on which a transmission circuit transmitting microwaves is formed. The first device is disposed in the opening of the first board. The second substrate is disposed at a second side of the first board. The second substrate is formed with a control circuit for the first device, and has an opening at a location overlapping the first device. The metal core is disposed between the first board and the second board, and is in contact with the first device. The casing includes a connection connected with the metal core via an opening formed in the second board.
    Type: Application
    Filed: March 1, 2016
    Publication date: September 8, 2016
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Yoshiyuki IKUMA, Masatoshi SUZUKI
  • Patent number: 9177881
    Abstract: Certain embodiments provide a high-frequency semiconductor package including: a base which is made of metal and is a grounding portion; a multi-layer wiring resin substrate; a first internal conductor film; and a lid. The multi-layer wiring resin substrate is provided on a top surface of the base, and has a frame shape in which a first cavity from which the top surface of the base is exposed is formed. The first internal conductor film covers surfaces which form a top surface of the multi-layer wiring resin substrate and an inner wall surface of the first cavity, and is electrically connected with the base. The lid is attached onto the multi-layer wiring resin substrate, and seals and covers the first cavity.
    Type: Grant
    Filed: December 2, 2013
    Date of Patent: November 3, 2015
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yoshiyuki Ikuma, Masatoshi Suzuki
  • Publication number: 20140252569
    Abstract: Certain embodiments provide a high-frequency semiconductor package including: a base which is made of metal and is a grounding portion; a multi-layer wiring resin substrate; a first internal conductor film; and a lid. The multi-layer wiring resin substrate is provided on a top surface of the base, and has a frame shape in which a first cavity from which the top surface of the base is exposed is formed. The first internal conductor film covers surfaces which form a top surface of the multi-layer wiring resin substrate and an inner wall surface of the first cavity, and is electrically connected with the base. The lid is attached onto the multi-layer wiring resin substrate, and seals and covers the first cavity.
    Type: Application
    Filed: December 2, 2013
    Publication date: September 11, 2014
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Yoshiyuki Ikuma, Masatoshi Suzuki
  • Patent number: 8604892
    Abstract: Provided are a high frequency attenuator to attenuate high frequency energy by a minute amount and a high frequency device using the high frequency attenuator. The attenuator includes a dielectric base, a ground conductor provided on a back surface of the base, a first and second strip conductors provided on a front surface of the base, and a resistor. The first and second strip conductors constitute first and second high frequency transmission lines respectively in conjunction with the ground conductor and the base. The first strip conductor has a first end portion, and the second strip conductor has a second end portion which forms a gap with the first end portion. The resistor is provided in the gap. The first end portion is inclined with respect to the first high frequency transmission line, and the second end portion is inclined with respect to the second high frequency transmission line.
    Type: Grant
    Filed: August 26, 2010
    Date of Patent: December 10, 2013
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Yoshiyuki Ikuma
  • Publication number: 20110115583
    Abstract: Provided are a high frequency attenuator to attenuate high frequency energy by a minute amount and a high frequency device using the high frequency attenuator. The attenuator includes a dielectric base, a ground conductor provided on a back surface of the base, a first and second strip conductors provided on a front surface of the base, and a resistor. The first and second strip conductors constitute first and second high frequency transmission lines respectively in conjunction with the ground conductor and the base. The first strip conductor has a first end portion, and the second strip conductor has a second end portion which forms a gap with the first end portion. The resistor is provided in the gap. The first end portion is inclined with respect to the first high frequency transmission line, and the second end portion is inclined with respect to the second high frequency transmission line.
    Type: Application
    Filed: August 26, 2010
    Publication date: May 19, 2011
    Applicant: Kabushiki Kaisha Toshiba
    Inventor: Yoshiyuki Ikuma
  • Patent number: 7151918
    Abstract: A transmitting/receiving module includes a first amplifier for amplifying a transmission signal, a second amplifier for amplifying a receiving signal, and a low reflection limiter provided on an input side of said second amplifier. There may be further provided a radiator from which the transmitting signal is to be radiated into an air and to which the receiving signal is to be received, and a circulator having a first terminal, a second terminal and a third terminal, in which the transmitting signal is inputted to the first terminal, the receiving signal is received by the radiator connected to the second terminal, the third terminal is connected to the second amplifier, and the low reflection limiter is provided between the circulator and the second amplifier.
    Type: Grant
    Filed: October 30, 2003
    Date of Patent: December 19, 2006
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Yoshiyuki Ikuma
  • Publication number: 20040242166
    Abstract: A transmitting/receiving module includes a first amplifier for amplifying a transmission signal, a second amplifier for amplifying a receiving signal, and a low reflection limiter provided on an input side of said second amplifier. There may be further provided a radiator from which the transmitting signal is to be radiated into an air and to which the receiving signal is to be received, and a circulator having a first terminal, a second terminal and a third terminal, in which the transmitting signal is inputted to the first terminal, the receiving signal is received by the radiator connected to the second terminal, the third terminal is connected to the second amplifier, and the low reflection limiter is provided between the circulator and the second amplifier.
    Type: Application
    Filed: October 30, 2003
    Publication date: December 2, 2004
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventor: Yoshiyuki Ikuma
  • Patent number: 6664928
    Abstract: An antenna for linearly polarized wave is accommodated in a case in which a heat sink is provided. By rotating the case depending on the vertically polarized wave or the horizontally polarized wave, wireless communication or broadcasting using the vertically polarized wave or the horizontally polarized wave can be selectively realized with high precision.
    Type: Grant
    Filed: March 22, 2002
    Date of Patent: December 16, 2003
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Takaya Ogawa, Satoru Inagaki, Yoshiyuki Ikuma
  • Publication number: 20030052830
    Abstract: An antenna for linearly polarized wave is accommodated in a case in which a heat sink is provided. By rotating the case depending on the vertically polarized wave or the horizontally polarized wave, wireless communication or broadcasting using the vertically polarized wave or the horizontally polarized wave can be selectively realized with high precision.
    Type: Application
    Filed: March 22, 2002
    Publication date: March 20, 2003
    Inventors: Takaya Ogawa, Satoru Inagaki, Yoshiyuki Ikuma