Patents by Inventor Yoshiyuki Ishikura
Yoshiyuki Ishikura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240068464Abstract: Provided is a tube set which is capable of easily determining whether a holder has been mounted when the holder is mounted on a housing. The tube set, which is provided in a tube pump that feeds a liquid, includes a pump tube and a holder. The holder has a flexible flat plate and includes first and second engagement portions located away from each other in a first direction. The first and second engagement portions are configured to be fitted into first and second engagement grooves formed in the housing, respectively, when the holder is pushed into the housing in a state of being bent in a thickness direction. The holder is elastically restored to be attached to the housing when the engagement portions are fitted into the respective engagement grooves. The holder has a flexural modulus of 500 MPa or more and 3500 MPa or less.Type: ApplicationFiled: November 8, 2023Publication date: February 29, 2024Inventors: Yoshiyuki SONODA, Kohzo ISHIKURA, Takeshi YAMAGUCHI
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Patent number: 11137307Abstract: A sensor chip (24) is joined to an inner wall surface (20a) of a base body (21-1), with a lower surface (24a) of a first retaining member (24-2) serving as a joint surface, in such a manner as to allow an enclosing chamber (23) (including a pressure receiving chamber (23-1) and a pressure guiding passage (23-2)) between a pressure receiving diaphragm (22) and the joint surface (24a) of the sensor chip (24) to communicate with a pressure guiding hole (24-2b) in the first retaining member (24-2). In this state, a narrow tube (31) made of stainless steel is passed through the pressure guiding passage (23-2) in the base body (21-1) and inserted and secured in the pressure guiding hole (24-2b) in the first retaining member (24-2).Type: GrantFiled: December 2, 2016Date of Patent: October 5, 2021Assignee: AZBIL CORPORATIONInventors: Ayumi Tushima, Yoshiyuki Ishikura, Tomohisa Tokuda, Nozomi Kida, Yuki Seto
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Publication number: 20210181051Abstract: A chip that constitutes a pressure-sensitive sensor and an enclosure are provided. The enclosure is formed with a sensor placement chamber in which the chip is placed. In the sensor placement chamber in which the chip is housed, a first pipe connecting a first communication channel on the side of the sensor placement chamber to a first pressure introduction portion and a second pipe connecting a second communication channel on the side of the sensor placement chamber to the second pressure introduction portion are provided. A side surface of the first pipe and a side surface of the second pipe are disposed out of contact with an inner wall of the sensor placement chamber.Type: ApplicationFiled: December 4, 2020Publication date: June 17, 2021Inventors: Ayumi Tsushima, Tomohisa Tokuda, Yoshiyuki Ishikura, Kenji Yao, Koichi Ochiai
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Publication number: 20210123826Abstract: A sensor chip (24) is joined to an inner wall surface (20a) of a base body (21-1), with a lower surface (24a) of a first retaining member (24-2) serving as a joint surface, in such a manner as to allow an enclosing chamber (23) (including a pressure receiving chamber (23-1) and a pressure guiding passage (23-2)) between a pressure receiving diaphragm (22) and the joint surface (24a) of the sensor chip (24) to communicate with a pressure guiding hole (24-2b) in the first retaining member (24-2). In this state, a narrow tube (31) made of stainless steel is passed through the pressure guiding passage (23-2) in the base body (21-1) and inserted and secured in the pressure guiding hole (24-2b) in the first retaining member (24-2).Type: ApplicationFiled: December 2, 2016Publication date: April 29, 2021Applicant: AZBIL CORPORATIONInventors: Ayumi TUSHIMA, Yoshiyuki ISHIKURA, Tomoshisa TOKUDA, Nozomi KIDA, Yuki SETO
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Patent number: 10704976Abstract: A pressure sensor according to the present invention includes a diaphragm (3) including a first principal surface (3A) and a second principal surface (3B) that is opposite thereto, the first principal surface receiving a pressure of a fluid; a semiconductor chip (1) provided with resistors that constitute a strain gauge; and at least three support members (2a, 2b, 2c) made of an insulating material, each support member being fixed to the second principal surface at one end thereof and to the semiconductor chip at the other end thereof and extending perpendicularly to the second principal surface so as to support the semiconductor chip. One of the support members (2a) is provided at a center (30) of the diaphragm in plan view.Type: GrantFiled: December 15, 2016Date of Patent: July 7, 2020Assignee: AZBIL CORPORATIONInventors: Yuki Seto, Masayuki Yoneda, Yoshiyuki Ishikura, Tomohisa Tokuda, Rina Ogasawara
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Publication number: 20200025638Abstract: A differential pressure sensor chip (2) includes: first and second pressure introduction holes (21_1 and 21_2); first and second diaphragms (23_1 and 23_2) formed to cover the first and second pressure introduction holes; first and second depressions (24_1 and 24_2) each in a form of a depression respectively provided to face the first and second pressure introduction holes with the first and second diaphragms interposed therebetween; a first communication channel (25) that makes a chamber between the first depression and the first diaphragm and a chamber between the second depression and the second diaphragm communicate to each other; a pressure-transmission-material introduction passage (26) an end of which is an opening and another end of which is joined to the first communication channel; a pressure transmission material (27) that fills the first communication channel, the two chambers, and the pressure-transmission-material introduction passage; and a sealing member (7) formed of a metal formed to seal aType: ApplicationFiled: January 16, 2018Publication date: January 23, 2020Applicant: AZBIL CORPORATIONInventors: Ayumi TSUSHIMA, Yoshiyuki ISHIKURA, Tomohisa TOKUDA
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Patent number: 10401248Abstract: A pressure sensor chip according to the present invention includes a non-bonding region that is provided in a stopper member and connected to a periphery of a pressure introduction hole. A plurality of protrusions are discretely formed on at least one of a first surface and a second surface that face each other in the non-bonding region. Passages between the protrusions serve as channels between the periphery of the pressure introduction hole and a peripheral edge of the non-bonding region. Accordingly, stress concentration does not occur at a diaphragm edge and the expected withstand pressure can be obtained.Type: GrantFiled: March 9, 2015Date of Patent: September 3, 2019Assignee: AZBIL CORPORATIONInventors: Tomohisa Tokuda, Yoshiyuki Ishikura
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Patent number: 10359330Abstract: A pressure sensor includes a diaphragm having a first principal surface and a second principal surface, a semiconductor chip in which resistors constituting a strain gauge are formed, a first structural body having one end coupled to a center of a second principal surface of the diaphragm and the other end coupled to the other surface of the semiconductor chip, and at least two second structural bodies disposed in two straight lines, orthogonal to each other, that pass through the center of the diaphragm in plan view so as to be disposed separately from the first structural body, and having one ends coupled to the second principal surface and the other ends coupled to the other surface of the semiconductor chip, in which the resistors are formed in regions between the first structural body and the second structural bodies in plan view in the semiconductor chip.Type: GrantFiled: June 30, 2017Date of Patent: July 23, 2019Assignee: Azbil CorporationInventors: Yuki Seto, Yoshiyuki Ishikura, Rina Ogasawara
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Patent number: 10254186Abstract: A bottom surface of a sensor chip (or a lower surface of a first retaining member) that introduces the pressure of a measured fluid is joined to a bottom surface of a sensor chamber (or to an inner wall surface of a base body) to allow an enclosing chamber (formed by a pressure receiving chamber and a pressure guiding passage) between a pressure receiving diaphragm and the bottom surface of the sensor chip to communicate with a pressure guiding hole in the first retaining member. The sensor chamber is made open to the atmosphere. Thus, a wire bonding portion of a sensor diaphragm from which wires extend is positioned outside the enclosing chamber, and electrode pins and an enclosed liquid in the enclosing chamber are separated from each other.Type: GrantFiled: December 1, 2016Date of Patent: April 9, 2019Assignee: AZBIL CORPORATIONInventors: Ayumi Tsushima, Yoshiyuki Ishikura, Hirofumi Tojo, Tatsuo Tanaka, Rina Ogasawara
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Publication number: 20190003910Abstract: A pressure sensor according to the present invention includes a diaphragm (3) including a first principal surface (3A) and a second principal surface (3B) that is opposite thereto, the first principal surface receiving a pressure of a fluid; a semiconductor chip (1) provided with resistors that constitute a strain gauge; and at least three support members (2a, 2b, 2c) made of an insulating material, each support member being fixed to the second principal surface at one end thereof and to the semiconductor chip at the other end thereof and extending perpendicularly to the second principal surface so as to support the semiconductor chip. One of the support members (2a) is provided at a center (30) of the diaphragm in plan view.Type: ApplicationFiled: December 15, 2016Publication date: January 3, 2019Applicant: AZBIL CORPORATIONInventors: Yuki SETO, Masayuki YONEDA, Yoshiyuki ISHIKURA, Tomohisa TOKUDA, Rina OGASAWARA
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Publication number: 20180010976Abstract: A pressure sensor includes a diaphragm having a first principal surface and a second principal surface, a semiconductor chip in which resistors constituting a strain gauge are formed, a first structural body having one end coupled to a center of a second principal surface of the diaphragm and the other end coupled to the other surface of the semiconductor chip, and at least two second structural bodies disposed in two straight lines, orthogonal to each other, that pass through the center of the diaphragm in plan view so as to be disposed separately from the first structural body, and having one ends coupled to the second principal surface and the other ends coupled to the other surface of the semiconductor chip, in which the resistors are formed in regions between the first structural body and the second structural bodies in plan view in the semiconductor chip.Type: ApplicationFiled: June 30, 2017Publication date: January 11, 2018Applicant: Azbil CorporationInventors: Yuki Seto, Yoshiyuki Ishikura, Rina Ogasawara
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Publication number: 20170176279Abstract: A pressure sensor chip according to the present invention includes a non-bonding region (SA) that is provided in a stopper member (11-2) and connected to a periphery of a pressure introduction hole (11-2b). A plurality of protrusions (12) are discretely formed on at least one of a first surface (PL1) and a second surface (PL2) that face each other in the non-bonding region (SA). Passages (13) between the protrusions (12) serve as channels between the periphery of the pressure introduction hole (11-2b) and a peripheral edge (14) of the non-bonding region (SA). Accordingly, stress concentration does not occur at a diaphragm edge and the expected withstand pressure can be obtained.Type: ApplicationFiled: March 9, 2015Publication date: June 22, 2017Applicant: Azbil CorporationInventors: Tomohisa TOKUDA, Yoshiyuki ISHIKURA
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Publication number: 20170160154Abstract: A bottom surface of a sensor chip (or a lower surface of a first retaining member) that introduces the pressure of a measured fluid is joined to a bottom surface of a sensor chamber (or to an inner wall surface of a base body) to allow an enclosing chamber (formed by a pressure receiving chamber and a pressure guiding passage) between a pressure receiving diaphragm and the bottom surface of the sensor chip to communicate with a pressure guiding hole in the first retaining member. The sensor chamber is made open to the atmosphere. Thus, a wire bonding portion of a sensor diaphragm from which wires extend is positioned outside the enclosing chamber, and electrode pins and an enclosed liquid in the enclosing chamber are separated from each other.Type: ApplicationFiled: December 1, 2016Publication date: June 8, 2017Applicant: AZBIL CORPORATIONInventors: Ayumi TSUSHIMA, Yoshiyuki ISHIKURA, Hirofumi TOJO, Tatsuo TANAKA, Rina OGASAWARA
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Patent number: 9267858Abstract: A differential pressure sensor includes a sensor chip provided with a sensor diaphragm, a first retaining member bonded facing a peripheral edge portion of one face of the sensor diaphragm and having a first pressure guiding hole guiding a first fluid pressure to the one face of the sensor diaphragm, and a second retaining member bonded facing a peripheral edge portion of the other face of the sensor diaphragm and having a second pressure guiding hole guiding a second fluid pressure to the other face of the sensor diaphragm. The differential pressure sensor also includes a sensor housing having a sensor chamber containing the sensor chip, a first pressure guiding duct guiding the first fluid pressure to a first inner wall face of the sensor chamber, and a second pressure guiding duct guiding the second fluid pressure to a second inner wall face of the sensor chamber.Type: GrantFiled: November 27, 2013Date of Patent: February 23, 2016Assignee: AZBIL CORPORATIONInventors: Tatsuo Tanaka, Yoshiyuki Ishikura
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Patent number: 9168241Abstract: A composition having an activity of ameliorating the reduced amount of diurnal activity and/or depressive symptoms, comprising arachidonic acid and/or a compound having arachidonic acid as a constituent fatty acid.Type: GrantFiled: June 29, 2006Date of Patent: October 27, 2015Assignee: SUNTORY HOLDINGS LIMITEDInventors: Yoshiyuki Ishikura, Yoshihiko Koga
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Publication number: 20150133555Abstract: A composition that has an activity of ameliorating reduced higher brain functions resulting from organic brain lesions, said composition comprising arachidonic acid and/or a compound having arachidonic acid as a constituent fatty acid as well as docosahexaenoic acid and/or a compound having docosahexaenoic acid as a constituent fatty acid.Type: ApplicationFiled: January 21, 2015Publication date: May 14, 2015Applicants: SUNTORY HOLDINGS LIMITED, NATIONAL UNIVERSITY CORPORATION KANAZAWA UNIVERSITYInventors: Yoshiyuki ISHIKURA, Tetsumori YAMASHIMA
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Publication number: 20140144243Abstract: A differential pressure sensor includes a sensor chip provided with a sensor diaphragm, a first retaining member bonded facing a peripheral edge portion of one face of the sensor diaphragm and having a first pressure guiding hole guiding a first fluid pressure to the one face of the sensor diaphragm, and a second retaining member bonded facing a peripheral edge portion of the other face of the sensor diaphragm and having a second pressure guiding hole guiding a second fluid pressure to the other face of the sensor diaphragm. The differential pressure sensor also includes a sensor housing having a sensor chamber containing the sensor chip, a first pressure guiding duct guiding the first fluid pressure to a first inner wall face of the sensor chamber, and a second pressure guiding duct guiding the second fluid pressure to a second inner wall face of the sensor chamber.Type: ApplicationFiled: November 27, 2013Publication date: May 29, 2014Applicant: AZBIL CORPORATIONInventors: Tatsuo TANAKA, Yoshiyuki ISHIKURA
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Publication number: 20140137652Abstract: A pressure sensor chip includes a sensor diaphragm and first and second retaining members. In a peripheral edge portion of the first retaining member, of a region facing one face of the sensor diaphragm, a region on an outer peripheral side is a bonded region bonded to the one face of the sensor diaphragm, and a region on an inner peripheral side is a non-bonded region not bonded to the one face of the sensor diaphragm. In the peripheral edge portion of the first retaining member, a ring-shaped groove is formed protruding in a direction of a wall thickness of the first retaining member, continuous with the non-bonded region of the peripheral edge portion. The second retaining member is provided with a recessed portion that prevents excessive dislocation of the sensor diaphragm when an excessively large pressure is applied to the sensor diaphragm.Type: ApplicationFiled: November 20, 2013Publication date: May 22, 2014Applicant: AZBIL CORPORATIONInventors: Tomohisa TOKUDA, Yoshiyuki ISHIKURA, Yuuki SETO
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Patent number: 8680301Abstract: There are provided foods and beverages that will suppress the absorption of dietary lipids, thereby suppressing the rise of triglyceride in blood. High-molecular weight polyphenol fractions recovered from oolong tea are added to foods or beverages as an active ingredient for inhibiting lipase activity. The foods and beverages of the present invention are safe and their inherent flavor has not been impaired; hence, they may be taken in routinely so that the lipase inhibitory action of the high-molecular weight polyphenol fractions will suppress the rise of triglyceride in blood and prevent obesity.Type: GrantFiled: February 17, 2005Date of Patent: March 25, 2014Assignee: Suntory Holdings LimitedInventors: Hitoshi Matsubara, Yoshiyuki Ishikura, Hiroaki Sasaki, Keiichi Abe, Sumio Asami, Masaaki Nakai, Aki Kusumoto
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Patent number: 8436047Abstract: To provide a preventive or ameliorating agent for liver diseases associated with hepatopathy comprising an omega-9 unsaturated fatty acid as an active ingredient.Type: GrantFiled: January 19, 2005Date of Patent: May 7, 2013Assignee: Suntory Holdings LimitedInventors: Yoshiyuki Ishikura, Hiroshi Kawashima, Tomohito Hamazaki, Shiro Watanabe