Patents by Inventor Yoshiyuki Ishikura

Yoshiyuki Ishikura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240068464
    Abstract: Provided is a tube set which is capable of easily determining whether a holder has been mounted when the holder is mounted on a housing. The tube set, which is provided in a tube pump that feeds a liquid, includes a pump tube and a holder. The holder has a flexible flat plate and includes first and second engagement portions located away from each other in a first direction. The first and second engagement portions are configured to be fitted into first and second engagement grooves formed in the housing, respectively, when the holder is pushed into the housing in a state of being bent in a thickness direction. The holder is elastically restored to be attached to the housing when the engagement portions are fitted into the respective engagement grooves. The holder has a flexural modulus of 500 MPa or more and 3500 MPa or less.
    Type: Application
    Filed: November 8, 2023
    Publication date: February 29, 2024
    Inventors: Yoshiyuki SONODA, Kohzo ISHIKURA, Takeshi YAMAGUCHI
  • Patent number: 11137307
    Abstract: A sensor chip (24) is joined to an inner wall surface (20a) of a base body (21-1), with a lower surface (24a) of a first retaining member (24-2) serving as a joint surface, in such a manner as to allow an enclosing chamber (23) (including a pressure receiving chamber (23-1) and a pressure guiding passage (23-2)) between a pressure receiving diaphragm (22) and the joint surface (24a) of the sensor chip (24) to communicate with a pressure guiding hole (24-2b) in the first retaining member (24-2). In this state, a narrow tube (31) made of stainless steel is passed through the pressure guiding passage (23-2) in the base body (21-1) and inserted and secured in the pressure guiding hole (24-2b) in the first retaining member (24-2).
    Type: Grant
    Filed: December 2, 2016
    Date of Patent: October 5, 2021
    Assignee: AZBIL CORPORATION
    Inventors: Ayumi Tushima, Yoshiyuki Ishikura, Tomohisa Tokuda, Nozomi Kida, Yuki Seto
  • Publication number: 20210181051
    Abstract: A chip that constitutes a pressure-sensitive sensor and an enclosure are provided. The enclosure is formed with a sensor placement chamber in which the chip is placed. In the sensor placement chamber in which the chip is housed, a first pipe connecting a first communication channel on the side of the sensor placement chamber to a first pressure introduction portion and a second pipe connecting a second communication channel on the side of the sensor placement chamber to the second pressure introduction portion are provided. A side surface of the first pipe and a side surface of the second pipe are disposed out of contact with an inner wall of the sensor placement chamber.
    Type: Application
    Filed: December 4, 2020
    Publication date: June 17, 2021
    Inventors: Ayumi Tsushima, Tomohisa Tokuda, Yoshiyuki Ishikura, Kenji Yao, Koichi Ochiai
  • Publication number: 20210123826
    Abstract: A sensor chip (24) is joined to an inner wall surface (20a) of a base body (21-1), with a lower surface (24a) of a first retaining member (24-2) serving as a joint surface, in such a manner as to allow an enclosing chamber (23) (including a pressure receiving chamber (23-1) and a pressure guiding passage (23-2)) between a pressure receiving diaphragm (22) and the joint surface (24a) of the sensor chip (24) to communicate with a pressure guiding hole (24-2b) in the first retaining member (24-2). In this state, a narrow tube (31) made of stainless steel is passed through the pressure guiding passage (23-2) in the base body (21-1) and inserted and secured in the pressure guiding hole (24-2b) in the first retaining member (24-2).
    Type: Application
    Filed: December 2, 2016
    Publication date: April 29, 2021
    Applicant: AZBIL CORPORATION
    Inventors: Ayumi TUSHIMA, Yoshiyuki ISHIKURA, Tomoshisa TOKUDA, Nozomi KIDA, Yuki SETO
  • Patent number: 10704976
    Abstract: A pressure sensor according to the present invention includes a diaphragm (3) including a first principal surface (3A) and a second principal surface (3B) that is opposite thereto, the first principal surface receiving a pressure of a fluid; a semiconductor chip (1) provided with resistors that constitute a strain gauge; and at least three support members (2a, 2b, 2c) made of an insulating material, each support member being fixed to the second principal surface at one end thereof and to the semiconductor chip at the other end thereof and extending perpendicularly to the second principal surface so as to support the semiconductor chip. One of the support members (2a) is provided at a center (30) of the diaphragm in plan view.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: July 7, 2020
    Assignee: AZBIL CORPORATION
    Inventors: Yuki Seto, Masayuki Yoneda, Yoshiyuki Ishikura, Tomohisa Tokuda, Rina Ogasawara
  • Publication number: 20200025638
    Abstract: A differential pressure sensor chip (2) includes: first and second pressure introduction holes (21_1 and 21_2); first and second diaphragms (23_1 and 23_2) formed to cover the first and second pressure introduction holes; first and second depressions (24_1 and 24_2) each in a form of a depression respectively provided to face the first and second pressure introduction holes with the first and second diaphragms interposed therebetween; a first communication channel (25) that makes a chamber between the first depression and the first diaphragm and a chamber between the second depression and the second diaphragm communicate to each other; a pressure-transmission-material introduction passage (26) an end of which is an opening and another end of which is joined to the first communication channel; a pressure transmission material (27) that fills the first communication channel, the two chambers, and the pressure-transmission-material introduction passage; and a sealing member (7) formed of a metal formed to seal a
    Type: Application
    Filed: January 16, 2018
    Publication date: January 23, 2020
    Applicant: AZBIL CORPORATION
    Inventors: Ayumi TSUSHIMA, Yoshiyuki ISHIKURA, Tomohisa TOKUDA
  • Patent number: 10401248
    Abstract: A pressure sensor chip according to the present invention includes a non-bonding region that is provided in a stopper member and connected to a periphery of a pressure introduction hole. A plurality of protrusions are discretely formed on at least one of a first surface and a second surface that face each other in the non-bonding region. Passages between the protrusions serve as channels between the periphery of the pressure introduction hole and a peripheral edge of the non-bonding region. Accordingly, stress concentration does not occur at a diaphragm edge and the expected withstand pressure can be obtained.
    Type: Grant
    Filed: March 9, 2015
    Date of Patent: September 3, 2019
    Assignee: AZBIL CORPORATION
    Inventors: Tomohisa Tokuda, Yoshiyuki Ishikura
  • Patent number: 10359330
    Abstract: A pressure sensor includes a diaphragm having a first principal surface and a second principal surface, a semiconductor chip in which resistors constituting a strain gauge are formed, a first structural body having one end coupled to a center of a second principal surface of the diaphragm and the other end coupled to the other surface of the semiconductor chip, and at least two second structural bodies disposed in two straight lines, orthogonal to each other, that pass through the center of the diaphragm in plan view so as to be disposed separately from the first structural body, and having one ends coupled to the second principal surface and the other ends coupled to the other surface of the semiconductor chip, in which the resistors are formed in regions between the first structural body and the second structural bodies in plan view in the semiconductor chip.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: July 23, 2019
    Assignee: Azbil Corporation
    Inventors: Yuki Seto, Yoshiyuki Ishikura, Rina Ogasawara
  • Patent number: 10254186
    Abstract: A bottom surface of a sensor chip (or a lower surface of a first retaining member) that introduces the pressure of a measured fluid is joined to a bottom surface of a sensor chamber (or to an inner wall surface of a base body) to allow an enclosing chamber (formed by a pressure receiving chamber and a pressure guiding passage) between a pressure receiving diaphragm and the bottom surface of the sensor chip to communicate with a pressure guiding hole in the first retaining member. The sensor chamber is made open to the atmosphere. Thus, a wire bonding portion of a sensor diaphragm from which wires extend is positioned outside the enclosing chamber, and electrode pins and an enclosed liquid in the enclosing chamber are separated from each other.
    Type: Grant
    Filed: December 1, 2016
    Date of Patent: April 9, 2019
    Assignee: AZBIL CORPORATION
    Inventors: Ayumi Tsushima, Yoshiyuki Ishikura, Hirofumi Tojo, Tatsuo Tanaka, Rina Ogasawara
  • Publication number: 20190003910
    Abstract: A pressure sensor according to the present invention includes a diaphragm (3) including a first principal surface (3A) and a second principal surface (3B) that is opposite thereto, the first principal surface receiving a pressure of a fluid; a semiconductor chip (1) provided with resistors that constitute a strain gauge; and at least three support members (2a, 2b, 2c) made of an insulating material, each support member being fixed to the second principal surface at one end thereof and to the semiconductor chip at the other end thereof and extending perpendicularly to the second principal surface so as to support the semiconductor chip. One of the support members (2a) is provided at a center (30) of the diaphragm in plan view.
    Type: Application
    Filed: December 15, 2016
    Publication date: January 3, 2019
    Applicant: AZBIL CORPORATION
    Inventors: Yuki SETO, Masayuki YONEDA, Yoshiyuki ISHIKURA, Tomohisa TOKUDA, Rina OGASAWARA
  • Publication number: 20180010976
    Abstract: A pressure sensor includes a diaphragm having a first principal surface and a second principal surface, a semiconductor chip in which resistors constituting a strain gauge are formed, a first structural body having one end coupled to a center of a second principal surface of the diaphragm and the other end coupled to the other surface of the semiconductor chip, and at least two second structural bodies disposed in two straight lines, orthogonal to each other, that pass through the center of the diaphragm in plan view so as to be disposed separately from the first structural body, and having one ends coupled to the second principal surface and the other ends coupled to the other surface of the semiconductor chip, in which the resistors are formed in regions between the first structural body and the second structural bodies in plan view in the semiconductor chip.
    Type: Application
    Filed: June 30, 2017
    Publication date: January 11, 2018
    Applicant: Azbil Corporation
    Inventors: Yuki Seto, Yoshiyuki Ishikura, Rina Ogasawara
  • Publication number: 20170176279
    Abstract: A pressure sensor chip according to the present invention includes a non-bonding region (SA) that is provided in a stopper member (11-2) and connected to a periphery of a pressure introduction hole (11-2b). A plurality of protrusions (12) are discretely formed on at least one of a first surface (PL1) and a second surface (PL2) that face each other in the non-bonding region (SA). Passages (13) between the protrusions (12) serve as channels between the periphery of the pressure introduction hole (11-2b) and a peripheral edge (14) of the non-bonding region (SA). Accordingly, stress concentration does not occur at a diaphragm edge and the expected withstand pressure can be obtained.
    Type: Application
    Filed: March 9, 2015
    Publication date: June 22, 2017
    Applicant: Azbil Corporation
    Inventors: Tomohisa TOKUDA, Yoshiyuki ISHIKURA
  • Publication number: 20170160154
    Abstract: A bottom surface of a sensor chip (or a lower surface of a first retaining member) that introduces the pressure of a measured fluid is joined to a bottom surface of a sensor chamber (or to an inner wall surface of a base body) to allow an enclosing chamber (formed by a pressure receiving chamber and a pressure guiding passage) between a pressure receiving diaphragm and the bottom surface of the sensor chip to communicate with a pressure guiding hole in the first retaining member. The sensor chamber is made open to the atmosphere. Thus, a wire bonding portion of a sensor diaphragm from which wires extend is positioned outside the enclosing chamber, and electrode pins and an enclosed liquid in the enclosing chamber are separated from each other.
    Type: Application
    Filed: December 1, 2016
    Publication date: June 8, 2017
    Applicant: AZBIL CORPORATION
    Inventors: Ayumi TSUSHIMA, Yoshiyuki ISHIKURA, Hirofumi TOJO, Tatsuo TANAKA, Rina OGASAWARA
  • Patent number: 9267858
    Abstract: A differential pressure sensor includes a sensor chip provided with a sensor diaphragm, a first retaining member bonded facing a peripheral edge portion of one face of the sensor diaphragm and having a first pressure guiding hole guiding a first fluid pressure to the one face of the sensor diaphragm, and a second retaining member bonded facing a peripheral edge portion of the other face of the sensor diaphragm and having a second pressure guiding hole guiding a second fluid pressure to the other face of the sensor diaphragm. The differential pressure sensor also includes a sensor housing having a sensor chamber containing the sensor chip, a first pressure guiding duct guiding the first fluid pressure to a first inner wall face of the sensor chamber, and a second pressure guiding duct guiding the second fluid pressure to a second inner wall face of the sensor chamber.
    Type: Grant
    Filed: November 27, 2013
    Date of Patent: February 23, 2016
    Assignee: AZBIL CORPORATION
    Inventors: Tatsuo Tanaka, Yoshiyuki Ishikura
  • Patent number: 9168241
    Abstract: A composition having an activity of ameliorating the reduced amount of diurnal activity and/or depressive symptoms, comprising arachidonic acid and/or a compound having arachidonic acid as a constituent fatty acid.
    Type: Grant
    Filed: June 29, 2006
    Date of Patent: October 27, 2015
    Assignee: SUNTORY HOLDINGS LIMITED
    Inventors: Yoshiyuki Ishikura, Yoshihiko Koga
  • Publication number: 20150133555
    Abstract: A composition that has an activity of ameliorating reduced higher brain functions resulting from organic brain lesions, said composition comprising arachidonic acid and/or a compound having arachidonic acid as a constituent fatty acid as well as docosahexaenoic acid and/or a compound having docosahexaenoic acid as a constituent fatty acid.
    Type: Application
    Filed: January 21, 2015
    Publication date: May 14, 2015
    Applicants: SUNTORY HOLDINGS LIMITED, NATIONAL UNIVERSITY CORPORATION KANAZAWA UNIVERSITY
    Inventors: Yoshiyuki ISHIKURA, Tetsumori YAMASHIMA
  • Publication number: 20140144243
    Abstract: A differential pressure sensor includes a sensor chip provided with a sensor diaphragm, a first retaining member bonded facing a peripheral edge portion of one face of the sensor diaphragm and having a first pressure guiding hole guiding a first fluid pressure to the one face of the sensor diaphragm, and a second retaining member bonded facing a peripheral edge portion of the other face of the sensor diaphragm and having a second pressure guiding hole guiding a second fluid pressure to the other face of the sensor diaphragm. The differential pressure sensor also includes a sensor housing having a sensor chamber containing the sensor chip, a first pressure guiding duct guiding the first fluid pressure to a first inner wall face of the sensor chamber, and a second pressure guiding duct guiding the second fluid pressure to a second inner wall face of the sensor chamber.
    Type: Application
    Filed: November 27, 2013
    Publication date: May 29, 2014
    Applicant: AZBIL CORPORATION
    Inventors: Tatsuo TANAKA, Yoshiyuki ISHIKURA
  • Publication number: 20140137652
    Abstract: A pressure sensor chip includes a sensor diaphragm and first and second retaining members. In a peripheral edge portion of the first retaining member, of a region facing one face of the sensor diaphragm, a region on an outer peripheral side is a bonded region bonded to the one face of the sensor diaphragm, and a region on an inner peripheral side is a non-bonded region not bonded to the one face of the sensor diaphragm. In the peripheral edge portion of the first retaining member, a ring-shaped groove is formed protruding in a direction of a wall thickness of the first retaining member, continuous with the non-bonded region of the peripheral edge portion. The second retaining member is provided with a recessed portion that prevents excessive dislocation of the sensor diaphragm when an excessively large pressure is applied to the sensor diaphragm.
    Type: Application
    Filed: November 20, 2013
    Publication date: May 22, 2014
    Applicant: AZBIL CORPORATION
    Inventors: Tomohisa TOKUDA, Yoshiyuki ISHIKURA, Yuuki SETO
  • Patent number: 8680301
    Abstract: There are provided foods and beverages that will suppress the absorption of dietary lipids, thereby suppressing the rise of triglyceride in blood. High-molecular weight polyphenol fractions recovered from oolong tea are added to foods or beverages as an active ingredient for inhibiting lipase activity. The foods and beverages of the present invention are safe and their inherent flavor has not been impaired; hence, they may be taken in routinely so that the lipase inhibitory action of the high-molecular weight polyphenol fractions will suppress the rise of triglyceride in blood and prevent obesity.
    Type: Grant
    Filed: February 17, 2005
    Date of Patent: March 25, 2014
    Assignee: Suntory Holdings Limited
    Inventors: Hitoshi Matsubara, Yoshiyuki Ishikura, Hiroaki Sasaki, Keiichi Abe, Sumio Asami, Masaaki Nakai, Aki Kusumoto
  • Patent number: 8436047
    Abstract: To provide a preventive or ameliorating agent for liver diseases associated with hepatopathy comprising an omega-9 unsaturated fatty acid as an active ingredient.
    Type: Grant
    Filed: January 19, 2005
    Date of Patent: May 7, 2013
    Assignee: Suntory Holdings Limited
    Inventors: Yoshiyuki Ishikura, Hiroshi Kawashima, Tomohito Hamazaki, Shiro Watanabe