Abstract: To obtain a semiconductor device with reduced substrate cost and facilitated substrate design, there are provided, in a semiconductor chip, a segment driver for outputting segment signals for a display device and a common driver for outputting scanning signals for the display device, and a group of segment terminals continuously arranged on opposite sides of the semiconductor chip at predetermined intervals. Further, common terminals are arranged adjacent to the segment terminals in two groups, one group including common terminals electrically connected to the common driver and another group including the other common terminals.

Abstract: A semiconductor integrated circuit device comprises a reference voltage generating circuit for transforming a power-supply voltage at multiple levels on the basis of a voltage specifying signal outputted from a CPU, a driving voltage generating circuit to which a reference voltage generated from the reference voltage generating circuit is given, and a liquid-crystal display control circuit for outputting a driving signal for driving a liquid-crystal display panel when the voltage generated from the driving voltage generating circuit is given. Since the device of the present invention can perform the contrast control based on the above voltage specifying signal, it becomes unnecessary to provide an additional contrast control circuit outside the device, unlike the conventional device.

Abstract: A semiconductor device having a rectangular COB substrate body, a die pad on the surface of the substrate body, a plurality of outer leads at the periphery of the substrate body, a plurality of wiring patterns on the surface of the substrate body connected to corresponding outer leads, a plurality of inner leads on the surface of the substrate body surrounding the die pad, connected to corresponding outer leads by the corresponding wiring patterns, and arranged in a substantially rectangular shape having sides, each respectively forming a predetermined acute angle with respect to a corresponding side of the substrate body whereby intervals between adjacent wiring patterns are longer than a predetermined length, a semiconductor chip having a plurality of electrode pads and mounted on the die pad, and a plurality of wires establishing electrical connections between the plurality of electrode pads of the semiconductor chip and corresponding inner leads.

Abstract: When the reset input changes 0 V to Vcc, predetermined operational mode control information is set in an operational mode register (11) to establish a user operational mode. When the reset input changes from 0 V to 2 Vcc, the operational mode control information inputted to a predetermined terminal of the input/output port (25, 58) is set in the operational mode control unit (10a, 10b) to establish a test or other mode.

Abstract: The voltage of a CPU operation power source is stepped down by a regulator to a voltage for causing oscillation of an oscillator. The output voltage of the oscillator is stepped up by a level shifter.