Abstract: In a step of covering a rear face resist, by recognizing position of a positioning mark exposed at a rear face of a conductive foil, position recognition of a conductive pattern of the rear face of every block or every conductive foil is performed indirectly, and a resist layer is formed except an opening portion forming the scheduled rear face electrode on the conductive pattern. Therefore, a method of manufacturing a circuit device shortened in time.

Abstract: An entirely molded semiconductor apparatus in which a flexible sheet having a conductive pattern is employed as a supporting substrate and semiconductor elements are assembled thereon has been developed, wherein such a semiconductor apparatus has various problems by which no multi-layered connection structure is enabled, and warping of insulation resin sheets becomes remarkable in the fabrication process. Since a conductive plated layer 4 is formed after through holes 21 are formed in the insulation resin 2 by using an insulation resin sheet 1 overcoated on a single side of the conductive layer 3 with insulation resin 2, a multi-layer connection structure can be achieved by the second conductive path layer 6 which is connected, in multi layers, to the first conductive path layer 5 formed by etching the conductive plated layer 4.