Patents by Inventor Yoshiyuki Kitazawa

Yoshiyuki Kitazawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device having interconnect layer and method of manufacturing therefor
    Patent number: 6215189
    Abstract: A highly reliable semiconductor device having a contact hole with a sufficient area can be obtained. An interlevel insulating film is formed on a conductive region having a first width. A through hole which exposes the conductive region is formed at the interlevel insulating film. A coating film is formed on the interlevel insulating film. In the coating film, an opening having a second width larger than the first width is formed in a region located on the through hole. An interconnect line is formed in a region located on the opening. A conductor film for electrically connecting the conductive region and the interconnect line is generated within the through hole.
    Type: Grant
    Filed: April 30, 1999
    Date of Patent: April 10, 2001
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yoshihiko Toyoda, Tetsuo Fukada, Takeshi Mori, Yoshiyuki Kitazawa