Abstract: According to one embodiment, a semiconductor device includes a substrate, first stacked components, second stacked components, and a coating resin. The first stacked components include first chips and are stacked on a surface of the substrate. The second stacked components include second chips and are stacked on the surface. The coating resin covers the surface, the first stacked components, and the second stacked components. A first top surface of a second farthest one of the first chips away from the surface differs in position in a first direction from a second top surface of second farthest one of the second chips away from the surface.

Abstract: According to one embodiment, a semiconductor device includes a substrate, first stacked components, second stacked components, and a coating resin. The first stacked components include first chips and are stacked on a surface of the substrate. The second stacked components include second chips and are stacked on the surface. The coating resin covers the surface, the first stacked components, and the second stacked components. A first top surface of a second farthest one of the first chips away from the surface differs in position in a first direction from a second top surface of second farthest one of the second chips away from the surface.

Abstract: According to one embodiment, a semiconductor device includes a substrate, first stacked components, second stacked components, and a coating resin. The first stacked components include first chips and are stacked on a surface of the substrate. The second stacked components include second chips and are stacked on the surface. The coating resin covers the surface, the first stacked components, and the second stacked components. A first top surface of a second farthest one of the first chips away from the surface differs in position in a first direction from a second top surface of second farthest one of the second chips away from the surface.

Abstract: According to one embodiment, a semiconductor device includes a substrate, first stacked components, second stacked components, and a coating resin. The first stacked components include first chips and are stacked on a surface of the substrate. The second stacked components include second chips and are stacked on the surface. The coating resin covers the surface, the first stacked components, and the second stacked components. A first top surface of a second farthest one of the first chips away from the surface differs in position in a first direction from a second top surface of second farthest one of the second chips away from the surface.

Abstract: A thermally expandable microcapsule, which shows excellent heat resistance and a high expansion ratio and thereby can be suitably used for molding processes involving high shearing force, such as kneading molding, calender molding, extrusion molding, and injection molding. The thermally expandable microcapsule also provides a foamed product using the thermally expandable microcapsule. The thermally expandable microcapsule contains a shell made of a polymer; and a volatile expansion agent as a core agent encapsulated in the shell, the storage elastic modulus (E?) of the shell at a temperature of 200° C. and a frequency of 10 Hz being 1×105 N/m2 or more, the storage elastic modulus (E?) of the shell at a temperature of 250° C. and a frequency of 10 Hz being 1×105 N/m2 or more, and a maximum displacement amount measured by thermomechanical analysis being 300 ?m or more.

Abstract: The present invention has its object to provide a masterbatch for foam molding, which can be suitably used for molding processes involving high shearing force, such as kneading molding, calender molding, extrusion molding, and injection molding, which shows a high expansion ratio, and which yields a foamed product with a good appearance. The present invention also has its object to provide a foamed product using the masterbatch for foam molding. A masterbatch for foam molding comprises a base resin and a thermally expandable microcapsule, the base resin being a thermoplastic resin having a melting point of 100° C. or higher, the masterbatch containing 10 to 230 parts by weight of the thermally expandable microcapsule to 100 parts by weight of the base resin, and the masterbatch having a true density of 0.80 g/cm3 or more, a bulk density of 0.35 g/cm3 or more, and a masterbatch size of 450 mg/30 pieces or more.

Abstract: A semiconductor device of embodiment includes: a wiring substrate having a first surface, a second surface and a side surface; a semiconductor element mounted on the first surface; a sealing resin layer sealing the semiconductor element and the first surface; a conductive shield layer covering the sealing resin layer and the side surface; and plural vias. At least one via is electrically connected to the conductive shield layer, and the plural vias are each arranged along peripheral part of the wiring substrate. When plural predetermined vias arranged at one side part of the peripheral part of the wiring substrate are seen through thickness direction of the wiring substrate, width of area totally occupied by the plural predetermined vias in direction perpendicular to the side part is larger than width an area occupied by each of the predetermined vias as a single via in direction along the side part.

Abstract: A thermally expandable microcapsule, which shows excellent heat resistance and a high expansion ratio and thereby can be suitably used for molding processes involving high shearing force, such as kneading molding, calender molding, extrusion molding, and injection molding. The thermally expandable microcapsule also provides a foamed product using the thermally expandable microcapsule. The thermally expandable microcapsule contains a shell made of a polymer; and a volatile expansion agent as a core agent encapsulated in the shell, the storage elastic modulus (E?) of the shell at a temperature of 200° C. and a frequency of 10 Hz being 1×105 N/m2 or more, the storage elastic modulus (E?) of the shell at a temperature of 250° C. and a frequency of 10 Hz being 1×105 N/m2 or more, and a maximum displacement amount measured by thermomechanical analysis being 300 ?m or more.

Abstract: The present invention has its object to provide a thermally expandable microcapsule, which shows excellent heat resistance and a high expansion ratio and thereby can be suitably used for molding processes involving high shearing force, such as kneading molding, calender molding, extrusion molding, and injection molding. The present invention also has its object to provide a foamed product using the thermally expandable microcapsule. The present invention relates to a thermally expandable microcapsule, which comprises: a shell made of a polymer; and a volatile expansion agent as a core agent encapsulated in the shell, the storage elastic modulus (E?) of the shell at a temperature of 200° C. and a frequency of 10 Hz being 1×105 N/m2 or more, the storage elastic modulus (E?) of the shell at a temperature of 250° C. and a frequency of 10 Hz being 1×105 N/m2 or more, and a maximum displacement amount measured by thermomechanical analysis being 300 ?m or more.

Abstract: The present invention has its object to provide a masterbatch for foam molding, which can be suitably used for molding processes involving high shearing force, such as kneading molding, calender molding, extrusion molding, and injection molding, which shows a high expansion ratio, and which yields a foamed product with a good appearance. The present invention also has its object to provide a foamed product using the masterbatch for foam molding. A masterbatch for foam molding comprises a base resin and a thermally expandable microcapsule, the base resin being a thermoplastic resin having a melting point of 100° C. or higher, the masterbatch containing 10 to 230 parts by weight of the thermally expandable microcapsule to 100 parts by weight of the base resin, and the masterbatch having a true density of 0.80 g/cm3 or more, a bulk density of 0.35 g/cm3 or more, and a masterbatch size of 450 mg/30 pieces or more.

Abstract: A multilayer printed circuit board is provided in which microcracks or metallic migration is mitigated when a Resin Fill Plated Through Hole (RFP) is arranged near the edge thereof. The multilayer printed circuit board includes an inner layer having an RFP, outer layers, RFP lands, and conductor layers. The conductor layers are positioned over the RFP lands and the outer edges of the conductor layers extends outward further than the outer edges of the RFP lands. When the multilayer printed circuit board is heated, a stress is generated in and near the RFP. The conductor layers positioned so as to cover the RFP lands, exert a reaction against the stress to suppress generation of microcracks in the multilayer printed circuit board and thereby mitigate metallic migration in the board.

Abstract: A multilayer printed circuit board is provided in which microcracks or metallic migration is mitigated when a Resin Fill Plated Through Hole (RFP) is arranged near the edge thereof. The multilayer printed circuit board includes an inner layer having an RFP, outer layers, RFP lands, and conductor layers. The conductor layers are positioned over the RFP lands and the outer edges of the conductor layers extends outward further than the outer edges of the RFP lands. When the multilayer printed circuit board is heated, a stress is generated in and near the RFP. The conductor layers positioned so as to cover the RFP lands, exert a reaction against the stress to suppress generation of microcracks in the multilayer printed circuit board and thereby mitigate metallic migration in the board.

Abstract: A toner resin composition and toner is provided, wherein said toner resin composition comprises a high molecular weight resin having a peak molecular weight of about 100,000-4,000,000, or a gel content of about 20% or more is blended with another resin comprising at least a low molecular weight component (having a peak molecular weight of about 3,000-50,000, making up about 60-95 wt % of the resin weight) and a high molecular weight component (having a peak molecular weight of about 100,000-4,000,000, making up about 5-40 wt % of another resin weight).

Abstract: A toner resin composition and toner is provided, wherein said toner resin composition comprises a high molecular weight resin having a peak molecular weight of about 100,000-4,000,000, or a gel content of about 20% or more is blended with another resin comprising at least a low molecular weight component (having a peak molecular weight of about 3,000-50,000, making up about 60-95 wt % of the resin weight) and a high molecular weight component (having a peak molecular weight of about 100,000-4,000,000, making up about 5-40 wt % of another resin weight).

Abstract: A resin composition for toners with excellent characteristics is provided. The composition comprises, as principal components, a resin (A) containing carboxyl groups and a resin (B) containing glycidyl or .beta.-methylglycidyl groups, wherein the resin (A) is obtained by a reaction between a multivalent metal compound (m) and copolymer .alpha., said copolymer .alpha. being obtained from a styrene type monomer (a), a (meth)acrylic ester monomer (b), and a vinyl type monomer (c) containing carboxyl groups, and the resin (B) is copolymer .beta. obtained from a vinyl type monomer (d) containing glycidyl or .beta.-methylglycidyl groups and another vinyl type monomer (e).

Abstract: Disclosed herein is a resin composition for toner mainly composed of a graft polymer which is formed by (a) 90 to 99.9 percent by weight of a copolymer formed by copolymerizing a styrene monomer and (meth)acrylic ester to contain at least 50 percent by weight of the styrene monomer and (b) 0.1 to 10 percent by weight of an ethylene-vinyl acetate copolymer having a saponification value of 10 to 30 and a softening point of 70.degree. to 200.degree. C. This resin composition is prepared by graft-polymerizing the copolymer (a) and the ethylene-vinyl acetate copolymer (b) under presence of a peroxide polymerization initiator. When a polyvalent metal compound (c) is employed, 85 to 99.9 percent by weight of the copolymer (a) and 0.1 to 10 percent by weight of the ethylene-vinyl acetate copolymer (b) are graft-polymerized under presence of 0.01 to 5 percent by weight of the polyvalent metal compound (c) and a peroxide polymerization initiator.

Abstract: A resin composition for toners with excellent characteristics is provided. The composition comprises, as principal components, a resin (A) containing carboxyl groups and a resin (B) containing glycidyl or .beta.-methylglycidyl groups, wherein the resin (A) is obtained by a reaction between a multivalent metal compound (m) and copolymer .alpha., said copolymer .alpha. being obtained from a styrene type monomer (a), a (meth)acrylic ester monomer (b), and a vinyl type monomer (c) containing carboxyl groups, and the resin (B) is copolymer .beta. obtained from a vinyl type monomer (d) containing glycidyl or .beta.-methylglycidyl groups and another vinyl type monomer (e).