Patents by Inventor Yoshiyuki Michiaki
Yoshiyuki Michiaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12049684Abstract: There are provided an inexpensive copper powder, which has a low content of oxygen even it has a small particle diameter and which has a high shrinkage starting temperature when it is heated, and a method for producing the same. While a molten metal of copper heated to a temperature, which is higher than the melting point of copper by 250 to 700° C. (preferably 350 to 650° C. and more preferably 450 to 600° C.), is allowed to drop, a high-pressure water is sprayed onto the heated molten metal of copper in a non-oxidizing atmosphere (such as an atmosphere of nitrogen, argon, hydrogen or carbon monoxide) to rapidly cool and solidify the heated molten metal of copper to produce a copper powder which has an average particle diameter of 1 to 10 ?m and a crystallite diameter Dx(200) of not less than 40 nm on (200) plane thereof, the content of oxygen in the copper powder being 0.7% by weight or less.Type: GrantFiled: May 12, 2023Date of Patent: July 30, 2024Assignee: Dowa Electronics Materials Co., Ltd.Inventors: Masahiro Yoshida, Kenichi Inoue, Atsushi Ebara, Yoshiyuki Michiaki, Takahiro Yamada
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Publication number: 20230279523Abstract: There are provided an inexpensive copper powder, which has a low content of oxygen even it has a small particle diameter and which has a high shrinkage starting temperature when it is heated, and a method for producing the same. While a molten metal of copper heated to a temperature, which is higher than the melting point of copper by 250 to 700° C. (preferably 350 to 650° C. and more preferably 450 to 600° C.), is allowed to drop, a high-pressure water is sprayed onto the heated molten metal of copper in a non-oxidizing atmosphere (such as an atmosphere of nitrogen, argon, hydrogen or carbon monoxide) to rapidly cool and solidify the heated molten metal of copper to produce a copper powder which has an average particle diameter of 1 to 10 ?m and a crystallite diameter Dx(200) of not less than 40 nm on (200) plane thereof, the content of oxygen in the copper powder being 0.7% by weight or less.Type: ApplicationFiled: May 12, 2023Publication date: September 7, 2023Applicant: Dowa Electronics Materials Co., Ltd.Inventors: Masahiro Yoshida, Kenichi Inoue, Atsushi Ebara, Yoshiyuki Michiaki, Takahiro Yamada
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Patent number: 11692241Abstract: While a molten metal of copper heated to a temperature, which is higher than the melting point of copper by 250 to 700° C. (preferably 350 to 650° C. and more preferably 450 to 600° C.), is allowed to drop, a high-pressure water is sprayed onto the heated molten metal of copper in a non-oxidizing atmosphere (such as an atmosphere of nitrogen, argon, hydrogen or carbon monoxide) to rapidly cool and solidify the heated molten metal of copper to produce a copper powder which has an average particle diameter of 1 to 10 ?m and a crystallite diameter Dx(200) of not less than 40 nm on (200) plane thereof, the content of oxygen in the copper powder being 0.7% by weight or less.Type: GrantFiled: December 21, 2017Date of Patent: July 4, 2023Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Masahiro Yoshida, Kenichi Inoue, Atsushi Ebara, Yoshiyuki Michiaki, Takahiro Yamada
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Patent number: 11420256Abstract: A silver powder which has a small content of carbon and which is difficult to be agglutinated, and a method for producing the same. While a molten metal, which is prepared by melting silver to which 40 ppm or more of copper is added, is allowed to drop, a high-pressure water is sprayed onto the molten metal to rapidly cool and solidify the molten metal to produce a silver powder which contains 40 ppm or more of copper, 0.1% by weight or less of carbon and 0.Type: GrantFiled: September 18, 2018Date of Patent: August 23, 2022Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Yoshiyuki Michiaki, Masahiro Yoshida, Kenichi Inoue
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Patent number: 11407030Abstract: There is provided a silver powder which has a small average particle diameter and a small thermal shrinkage percentage, and a method for producing the same. While a molten metal of silver heated to a temperature (1292 to 1692° C.), which is higher than the melting point (962° C.) of silver by 330 to 730° C., is allowed to drop, a high-pressure water is sprayed onto the molten metal of silver (preferably at a water pressure of 90 to 160 MPa) to rapidly cool and solidify the molten metal of silver to powderize silver to produce a silver powder which has an average particle diameter of 1 to 6 ?m and a shrinkage percentage of not greater than 8% (preferably not greater than 7%) at 500° C., the product of the average particle diameter by the shrinkage percentage at 500° C. being 1 to 11 ?m·% (preferably 1.5 to 10.5 ?m·%).Type: GrantFiled: November 2, 2020Date of Patent: August 9, 2022Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Atsushi Ebara, Kenichi Inoue, Yoshiyuki Michiaki, Takahiro Yamada, Masahiro Yoshida
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Patent number: 11041229Abstract: An object of the present invention is to provide metal powder that can be used to form an external electrode, which is excellent in solder wettability and solder leach resistance while having a layer structure with fewer layers than in the related art and, furthermore, is excellent in electrical conductivity. This silver-coated alloy powder comprises a coating layer on a surface of an alloy core particle containing copper, nickel, zinc, and inevitable impurities, the coating layer containing silver.Type: GrantFiled: August 31, 2017Date of Patent: June 22, 2021Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Kyoso Masuda, Kenichi Inoue, Yuki Kaneshiro, Atsushi Ebara, Yoshiyuki Michiaki, Kozo Ogi, Takahiro Yamada, Masahiro Yoshida
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Publication number: 20210078081Abstract: There is provided a silver powder which has a small average particle diameter and a small thermal shrinkage percentage, and a method for producing the same. While a molten metal of silver heated to a temperature (1292 to 1692° C.), which is higher than the melting point (962° C.) of silver by 330 to 730° C., is allowed to drop, a high-pressure water is sprayed onto the molten metal of silver (preferably at a water pressure of 90 to 160 MPa) to rapidly cool and solidify the molten metal of silver to powderize silver to produce a silver powder which has an average particle diameter of 1 to 6 ?m and a shrinkage percentage of not greater than 8% (preferably not greater than 7%) at 500° C., the product of the average particle diameter by the shrinkage percentage at 500° C. being 1 to 11 ?m·% (preferably 1.5 to 10.5 ?m·%).Type: ApplicationFiled: November 2, 2020Publication date: March 18, 2021Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Atsushi Ebara, Kenichi Inoue, Yoshiyuki Michiaki, Takahiro Yamada, Masahiro Yoshida
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Publication number: 20210046549Abstract: Provided is a soft magnetic powder capable of forming a powder magnetic core having a high magnetic permeability with a decreased oxygen content even when the particle size is small. There is provided a soft magnetic powder including Fe alloy containing Si which is a soft magnetic powder containing 0.1% to 15 mass % of Si, and having a product of D50 multiplied by [O] (D50×[O]) being 3.0 [?m·mass %] or less, wherein D50 represents a volume-based cumulative 50% particle size [?m] of the soft magnetic powder as measured by a laser diffraction particle size distribution analyzer, and [O] represents an oxygen content [mass %].Type: ApplicationFiled: September 3, 2018Publication date: February 18, 2021Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Masahiro YOSHIDA, Yoshiyuki MICHIAKI, Kenichi INOUE
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Patent number: 10828702Abstract: There is provided a silver powder which has a small average particle diameter and a small thermal shrinkage percentage, and a method for producing the same. While a molten metal of silver heated to a temperature (1292 to 1692° C.), which is higher than the melting point (962° C.) of silver by 330 to 730° C., is allowed to drop, a high-pressure water is sprayed onto the molten metal of silver (preferably at a water pressure of 90 to 160 MPa) to rapidly cool and solidify the molten metal of silver to powderize silver to produce a silver powder which has an average particle diameter of 1 to 6 ?m and a shrinkage percentage of not greater than 8% (preferably not greater than 7%) at 500° C., the product of the average particle diameter by the shrinkage percentage at 500° C. being 1 to 11 ?m·% (preferably 1.5 to 10.5 ?m·%).Type: GrantFiled: October 26, 2016Date of Patent: November 10, 2020Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Atsushi Ebara, Kenichi Inoue, Yoshiyuki Michiaki, Takahiro Yamada, Masahiro Yoshida
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Publication number: 20200238388Abstract: A silver powder which has a small content of carbon and which is difficult to be agglutinated, and a method for producing the same. While a molten metal, which is prepared by melting silver to which 40 ppm or more of copper is added, is allowed to drop, a high-pressure water is sprayed onto the molten metal to rapidly cool and solidify the molten metal to produce a silver powder which contains 40 ppm or more of copper, 0.1% by weight or less of carbon and 0.Type: ApplicationFiled: September 18, 2018Publication date: July 30, 2020Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Yoshiyuki Michiaki, Masahiro Yoshida, Kenichi Inoue
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Publication number: 20200122236Abstract: There are provided an inexpensive copper powder, which has a low content of oxygen even it has a small particle diameter and which has a high shrinkage starting temperature when it is heated, and a method for producing the same. While a molten metal of copper heated to a temperature, which is higher than the melting point of copper by 250 to 700° C. (preferably 350 to 650° C. and more preferably 450 to 600° C.), is allowed to drop, a high-pressure water is sprayed onto the heated molten metal of copper in a non-oxidizing atmosphere (such as an atmosphere of nitrogen, argon, hydrogen or carbon monoxide) to rapidly cool and solidify the heated molten metal of copper to produce a copper powder which has an average particle diameter of 1 to 10 ?m and a crystallite diameter Dx(200) of not less than 40 nm on (200) plane thereof, the content of oxygen in the copper powder being 0.7% by weight or less.Type: ApplicationFiled: December 21, 2017Publication date: April 23, 2020Applicant: Dowa Electronics Materials Co., Ltd.Inventors: Masahiro Yoshida, Kenichi Inoue, Atsushi Ebara, Yoshiyuki Michiaki, Takahiro Yamada
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Publication number: 20190194778Abstract: An object of the present invention is to provide metal powder that can be used to form an external electrode, which is excellent in solder wettability and solder leach resistance while having a layer structure with fewer layers than in the related art and, furthermore, is excellent in electrical conductivity. This silver-coated alloy powder comprises a coating layer on a surface of an alloy core particle containing copper, nickel, zinc, and inevitable impurities, the coating layer containing silver.Type: ApplicationFiled: August 31, 2017Publication date: June 27, 2019Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Kyoso MASUDA, Kenichi INOUE, Yuki KANESHIRO, Atsushi EBARA, Yoshiyuki MICHIAKI, Kozo OGI, Takahiro YAMADA, Masahiro YOSHIDA
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Publication number: 20190009341Abstract: While a molten metal obtained by melting silver and a metal, which is selected from the group consisting of tin, zinc, lead and indium, in an atmosphere of nitrogen is allowed to drop, a high-pressure water (preferably pure water or alkaline water) is sprayed onto the molten metal in the atmosphere or an atmosphere of nitrogen to rapidly cool and solidify the molten metal to produce a silver alloy powder which comprises silver and the metal which is selected from the group consisting of tin, zinc, lead and indium and which has an average particle diameter of 0.5 to 20 ?m, the silver alloy powder having a temperature of not higher than 300° C. at a shrinking percentage of 0.5%, a temperature of not higher than 400° C. at a shrinking percentage of 1.0% and a temperature of not higher than 450° C. at a shrinking percentage of 1.5% in a thermomechanical analysis.Type: ApplicationFiled: December 26, 2016Publication date: January 10, 2019Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Masahiro YOSHIDA, Yoshiyuki MICHIAKI, Kenichi INOUE
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Patent number: 10170213Abstract: There is provided a silver powder, which is able to obtain a conductive paste having a high thixotropic ratio and a high Casson yield value and which is able to form a conductive pattern having a low resistance, and a method for producing the same. An aliphatic amine such as hexadecylamine is added to a silver powder, the surface of which is coated with a fatty acid such as stearic acid, to be stirred and mixed to form the aliphatic amine on the outermost surface of the silver powder while allowing the fatty acid to react with the aliphatic amine to form an aliphatic amide such as hexadecanamide between the fatty acid and the aliphatic amine.Type: GrantFiled: January 2, 2018Date of Patent: January 1, 2019Assignee: Dowa Electronics Materials Co., Ltd.Inventors: Yoshiyuki Michiaki, Hiroshi Kamiga
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Publication number: 20180326497Abstract: There is provided a silver powder which has a small average particle diameter and a small thermal shrinkage percentage, and a method for producing the same. While a molten metal of silver heated to a temperature (1292 to 1692° C.), which is higher than the melting point (962° C.) of silver by 330 to 730° C., is allowed to drop, a high-pressure water is sprayed onto the molten metal of silver (preferably at a water pressure of 90 to 160 MPa) to rapidly cool and solidify the molten metal of silver to powderize silver to produce a silver powder which has an average particle diameter of 1 to 6 ?m and a shrinkage percentage of not greater than 8% (preferably not greater than 7%) at 500° C., the product of the average particle diameter by the shrinkage percentage at 500° C. being 1 to 11 ?m·% (preferably 1.5 to 10.5 ?m·%).Type: ApplicationFiled: October 26, 2016Publication date: November 15, 2018Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Atsushi Ebara, Kenichi Inoue, Yoshiyuki Michiaki, Takahiro Yamada, Masahiro Yoshida
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Publication number: 20180158564Abstract: There is provided a silver powder, which is able to obtain a conductive paste having a high thixotropic ratio and a high Casson yield value and which is able to form a conductive pattern having a low resistance, and a method for producing the same. An aliphatic amine such as hexadecylamine is added to a silver powder, the surface of which is coated with a fatty acid such as stearic acid, to be stirred and mixed to form the aliphatic amine on the outermost surface of the silver powder while allowing the fatty acid to react with the aliphatic amine to form an aliphatic amide such as hexadecanamide between the fatty acid and the aliphatic amine.Type: ApplicationFiled: January 2, 2018Publication date: June 7, 2018Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Yoshiyuki Michiaki, Hiroshi Kamiga
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Patent number: 9984788Abstract: There is provided a silver powder, which is able to obtain a conductive paste having a high thixotropic ratio and a high Casson yield value and which is able to form a conductive pattern having a low resistance, and a method for producing the same. An aliphatic amine such as hexadecylamine is added to a silver powder, the surface of which is coated with a fatty acid such as stearic acid, to be stirred and mixed to form the aliphatic amine on the outermost surface of the silver powder while allowing the fatty acid to react with the aliphatic amine to form an aliphatic amide such as hexadecanamide between the fatty acid and the aliphatic amine.Type: GrantFiled: July 24, 2015Date of Patent: May 29, 2018Assignee: Dowa Electronics Materials Co., Ltd.Inventors: Yoshiyuki Michiaki, Hiroshi Kamiga
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Publication number: 20170206998Abstract: There is provided a silver powder, which is able to obtain a conductive paste having a high thixotropic ratio and a high Casson yield value and which is able to form a conductive pattern having a low resistance, and a method for producing the same. An aliphatic amine such as hexadecylamine is added to a silver powder, the surface of which is coated with a fatty acid such as stearic acid, to be stirred and mixed to form the aliphatic amine on the outermost surface of the silver powder while allowing the fatty acid to react with the aliphatic amine to form an aliphatic amide such as hexadecanamide between the fatty acid and the aliphatic amine.Type: ApplicationFiled: July 24, 2015Publication date: July 20, 2017Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Yoshiyuki Michiaki, Hiroshi Kamiga
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Patent number: 9114389Abstract: Provided is a catalyst having the ability to combust PM at relatively low temperatures and having high HC and CO removal (conversion) efficiency even at the above operating temperature. In the catalyst composition, at least one kind of platinum group element selected from Pt, Rh, and Pd is dispersed in and supported by a platinum group-supporting carrier containing at least one kind of element selected from Zr, Al, Y, Si, Bi, Pr, and Tb, and the platinum group-supporting carrier is supported on the surface of a Ce oxide containing Ce as an essential component. The catalyst composition has both PM combustion activity and gas purification activity.Type: GrantFiled: May 10, 2011Date of Patent: August 25, 2015Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Yoshiyuki Michiaki, Takuma Honda, Shin Hamada
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Patent number: 9006131Abstract: A composite oxide for an exhaust gas purification catalyst is provided which can burn PM in diesel engine exhaust gas at low temperatures and has a good S desorption property. The composite oxide for an exhaust gas purification catalyst is composed of Ce, Bi, Pr, R, and oxygen in a molar ratio of Ce:Bi:Pr:R=(1?x?y?z):x:y:z. The ratios of Ce, Bi, Pr, and R satisfy 0<x+y+z?0.5 and preferably 0<x?0.1, 0<y?0.25, and 0<z?0.3. Particularly, when R is Zr, the composite oxide exhibits a good S desorption property at a temperature of about 600° C. and can recover its catalytic activity at low temperatures. Therefore, the exhaust gas purification catalyst is suitable as a PM combustion catalyst.Type: GrantFiled: September 28, 2009Date of Patent: April 14, 2015Assignee: Dowa Electronics Materials Co., Ltd.Inventors: Yoshiyuki Michiaki, Yoshichika Horikawa