Abstract: A method of making a printed circuit board includes providing a substrate coated with a conductive layer, developing a first photoresist layer on the conductive layer to define a first conductive pattern of the desired circuit configuration having a plurality of discontinuous segments, and a second conductive pattern interconnecting the discontinuous segments of the desired circuit configuration. A second layer of photoresist is positioned across the whole surface of the substrate except at least a selected portion of the first conductive pattern, and the substrate is electrically activated during a coating process for depositing conductive material on the selected portion of the first conductive pattern. The first conductive pattern is subsequently coated with photoresist, and the second conductive pattern, which is now exposed on the substrate, is subject to an etching process to effectively remove all of the second conductive pattern.