Patents by Inventor Yoshiyuki Nakamizo

Yoshiyuki Nakamizo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7122396
    Abstract: The present invention provides a semiconductor acceleration sensor wherein a semiconductor element is prevented from being damaged even when at least part of a weight is disposed in an internal space of a semiconductor sensor element and the mass of a weight is accordingly increased. An inner peripheral surface of a support portion 9 is constituted by four trapezoidal inclined surfaces 13 of a substantially identical shape which are annularly combined so as to define an outer peripheral surface of a frust-pyramidal space. A weight 3 is so constructed as to have an abutting portion including a linear portion 3d which abuts against the inclined surfaces 13 constituting the inner peripheral surface of the support portion 9 when the weight 3 makes a maximum displacement in a direction where a diaphragm portion 11 is located. The abutting portion 3d has a circular outline shape as seen from a side where a weight fixing portion 7 is located.
    Type: Grant
    Filed: October 3, 2003
    Date of Patent: October 17, 2006
    Assignee: Hokuriku Electric Industry Co., Ltd.
    Inventors: Yoshiyuki Nakamizo, Tsutomu Sawai, Masato Ando
  • Publication number: 20060094148
    Abstract: The present invention provides a semiconductor acceleration sensor wherein a semiconductor element is prevented from being damaged even when at least part of a weight is disposed in an internal space of a semiconductor sensor element and the mass of a weight is accordingly increased. An inner peripheral surface of a support portion 9 is constituted by four trapezoidal inclined surfaces 13 of a substantially identical shape which are annularly combined so as to define an outer peripheral surface of a frust-pyramidal space. A weight 3 is so constructed as to have an abutting portion including a linear portion 3d which abuts against the inclined surfaces 13 constituting the inner peripheral surface of the support portion 9 when the weight 3 makes a maximum displacement in a direction where a diaphragm portion 11 is located. The abutting portion 3d has a circular outline shape as seen from a side where a weight fixing portion 7 is located.
    Type: Application
    Filed: October 3, 2003
    Publication date: May 4, 2006
    Applicant: Hokuriku Electric Industry Co., Ltd
    Inventors: Yoshiyuki Nakamizo, Tsutomu Sawai, Masato Ando
  • Patent number: 6321600
    Abstract: An acceleration detecting device capable of permitting a weight, a diaphragm and a base to be precisely positioned on a casing of a measuring equipment or the like. The weight, diaphragm and base are integrally formed of a metal material into a single unit. An insulating casing is integrally formed while incorporating the single unit as an insert therein. The insulating casing has a recess defined by a side wall thereof, which is formed with a window for exposing a part of the base therethrough. The recess of the casing is closed with a metal cover member, which is mounted on the casing. The cover member is integrally provided with a contactor which is elastically forced against the base through the window. The base is electrically connected to ground terminals of terminal fitments.
    Type: Grant
    Filed: July 26, 1999
    Date of Patent: November 27, 2001
    Assignee: Hokuriku Electric Industry Co., Ltd.
    Inventors: Shigeru Hirose, Masato Ando, Yoshiyuki Nakamizo, Takeshi Arikura, Tsutomu Sawai
  • Patent number: 6148671
    Abstract: An acceleration sensor capable of restraining a reduction in output thereof due to an electrostatic capacity between acceleration detecting electrodes and output electrodes. A low-dielectric layer is arranged between a connection line and a piezoelectric ceramic substrate. Another low-dielectric layer is arranged between additional connection lines and output electrodes, and the substrate. The low-dielectric layers are formed of a material substantially reduced in relative dielectric constant as compared with the substrate. The low-dielectric layers reduce an electrostatic capacity generated between wiring patterns and the output electrodes, and a counter electrode pattern, to thereby reduce the amount of spontaneous polarization charges accumulated in the electrostatic capacity.
    Type: Grant
    Filed: September 28, 1998
    Date of Patent: November 21, 2000
    Assignee: Hokuriku Electric Industry Co., Ltd.
    Inventors: Yoshiyuki Nakamizo, Hideki Kobayashi, Megumi Hashizaki