Abstract: A substrate cooling device is provided and includes a device body and a conduit block. The device body has a housing space, and a discharge portion for receiving and discharging a substrate into and out of the housing space. The conduit block includes an outlet port arranged in the device body across the housing space from the discharge portion, and a gas flow passage which is connected to the outlet port and receives a cooling gas. The conduit block outputs the cooling gas from the outlet port across the housing space in one direction such that the cooling gas flows across an upper surface of the substrate in the one direction and across a lower surface of the substrate in the one direction.

Abstract: A hot-deformed magnet is obtained by quenching and solidifying a melt of an alloy containing a rare earth element (RE), Fe, and B as main components by a super quenching method using a rotating roll; preparing an alloy powder in an amorphous structure state or an amorphous-microcrystalline mixed structure state; subjecting the alloy powder to a rapid heat treatment in a falling-type heating furnace so as to obtain a raw material powder; hot-forming the raw material powder so as to densify the raw material powder to near true density and form a hot-formed compact; and subjecting the hot-formed compact to uniaxial hot plastic working to orient crystals.

Abstract: A drawing device draws a pattern on a substrate by radiating light from an optical head part on a target object (for example, substrate) which relatively moves with respect to the optical head part. Here, the optical head part has a spatial modulating unit which spatially modulates light from a light source, based on pattern data, and an optical path corrector which shifts the route of light spatially modulated in the spatial modulating unit at precision subdivided more than units of spatial modulation in the spatial modulating unit (more specifically, for example, units of pixels of spatial light modulator).

Abstract: A method for applying a water-based coating (53) to a painted workpiece (49) is provided. The method includes spraying water (51) from an application nozzle unit (10) to the workpiece (49), feeding the water-based coating (53) to the workpiece (49), and finally applying streams of compressed air onto the water-based coating (53) to spread uniformly the water-based coating (53).

Abstract: An ultrashort pulsed laser beam, the fluence of which on an interface BF is set to be larger than a substrate processing threshold and smaller than a film processing threshold, is irradiated to the interface BF via a thin film F. Thus, in a laser irradiated portion of the interface BF, the substrate W is selectively processed, bonding between the substrate and the thin film F is reduced and the thin film F is peeled.

Abstract: A drawing device draws a pattern on a substrate by radiating light from an optical head part on a target object (for example, substrate) which relatively moves with respect to the optical head part. Here, the optical head part has a spatial modulating unit which spatially modulates light from a light source, based on pattern data, and an optical path corrector which shifts the route of light spatially modulated in the spatial modulating unit at precision subdivided more than units of spatial modulation in the spatial modulating unit (more specifically, for example, units of pixels of spatial light modulator).

Abstract: HfC particles having an average particle size of 5 to 100 nm are dispersed in an R—Fe—B type alloy in an amount of 0.2 to 3.0 atom %. Crystal grains are refined avoiding decreasing an amount of magnet components by containing carbide and coercive force can be improved, avoiding degradation of saturated magnetization by refining the crystal grains.

Abstract: In a substrate supporting apparatus of a surface potential measuring apparatus, a first fluid is ejected around a target region on an upper surface of a substrate from a circular-shaped first porous member of a first fluid ejection part and a second fluid is ejected onto a lower surface of the substrate from a circular-shaped second porous member of a second fluid ejection part which is opposite to the first fluid ejection part. The substrate can be supported and flattened between the first fluid ejection part and the second fluid ejection part. Also, it is possible to keep the distance between the substrate and the first porous member, with a simple construction. As a result, a probe can be positioned above a flatted target region with leaving a predetermined spacing, to perform measurement of a surface potential of the target region on the substrate with high accuracy.

Abstract: In a surface voltmeter (1), a surface voltage on a measurement area on a semiconductor substrate (9) on which an insulating film is formed is measured while applying light to the measurement area. With this operation, a voltage induced on a main body of the substrate (9) by charge which is charged on a surface of the insulating film is balanced out. Consequently, it is possible to measure a surface voltage on the measurement area with high accuracy. Since an electrode wiring (164) used for application of an electrode voltage to an electrode (12) extends from the electrode (12) in a direction away from the substrate (9) along a vibration direction, it is possible to prevent influences of noises caused by vibration of the electrode wiring (164) in vibrating the electrode (12) and to measure the surface voltage on the measurement area more accurately.

Abstract: A method for applying a protective coating to a painted workpiece uses an application apparatus which discharges the protective coating as well as streams of compressed air for spreading the discharged protective coating on a surface of the workpiece. The protective coating is fed from an application nozzle unit to the workpiece. The protective coating is uniformly spread over the workpiece by streams of compressed air radiated thereat.

Abstract: A surface voltmeter has a stage having a conductive surface, a vibrating electrode, a vibration part, and an elevation mechanism. While vibrating the vibrating electrode, displacement current from the conductive surface is acquired. A control part controls electrode voltage so that the displacement current becomes a value specified by a computer, and acquires a relationship between the displacement current and the electrode voltage while changing the displacement current. Acquisition of the relationship is performed a plurality of times while changing distance between the vibrating electrode and an object, the electrode voltage which is independent from the distance between the vibrating electrode and the object is obtained as reference voltage, and surface voltage on the object is obtained on the basis of the reference voltage.

Abstract: A method for applying a water-based coating (53) to a painted workpiece (49) is provided. The method includes spraying water (51) from an application nozzle unit (10) to the workpiece (49), feeding the water-based coating (53) to the workpiece (49), and finally applying streams of compressed air onto the water-based coating (53) to spread uniformly the water-based coating (53).

Abstract: Water is sprayed from a water nozzle of a water-washing device to wash polluted air in a painting booth, and then, a liquid polymer substance having a character to adsorb a VOC is spayed from an adsorbent spraying nozzle to remove the VOC from the air. A baffle is provided in a discharge duct to prevent the VOC-contained mixed liquid mist from moving with the air. Namely, by causing the air to hit the baffle, the VOC-contained mist turns into drops. Through the water-washing by the water-washing device, VOC adsorption by the mixed liquid and mixed liquid mist removal by the baffle, the polluted air can be sufficiently purified.

Abstract: In a body of a film-thickness measuring apparatus (1), an organic contamination remover (3) for removing organic contamination adsorbed onto a substrate (9) is provided. The organic contamination remover (3) includes a chamber body (31), an interior of which is kept clean. In the chamber body (31), a hot plate (32) for heating the substrate, a cooling plate (33) for cooling the substrate, and a transfer arm (34) for moving the substrate (9) from the hot plate (32) to the cooling plate (33) in the chamber body 31, are provided. With this structure, it is possible to keep the substrate (9) in a clean atmosphere within the chamber body (31), to thereby suppress re-adsorption of organic contamination onto the substrate during a time period from a time when organic contamination adsorbed onto the substrate (9) is removed to a time when cooling is completed.

Abstract: In a surface voltmeter (1), a surface voltage on a measurement area on a semiconductor substrate (9) on which an insulating film is formed is measured while applying light to the measurement area. With this operation, a voltage induced on a main body of the substrate (9) by charge which is charged on a surface of the insulating film is balanced out. Consequently, it is possible to measure a surface voltage on the measurement area with high accuracy. Since an electrode wiring (164) used for application of an electrode voltage to an electrode (12) extends from the electrode (12) in a direction away from the substrate (9) along a vibration direction, it is possible to prevent influences of noises caused by vibration of the electrode wiring (164) in vibrating the electrode (12) and to measure the surface voltage on the measurement area more accurately.

Abstract: A memory (43) of a control unit (4) stores correction data (81) indicating a relationship between a decrement in a measurement value of a film thickness by removal of organic contamination adsorbed onto a substrate and an amount of adsorbed organic contamination corresponding to a difference between a true film thickness and the measurement. The difference is caused by organic contamination adsorbed onto the substrate before removal of organic contamination. In a film-thickness measuring apparatus (1), a calculating/measuring part 41 obtains a first measurement value of a film thickness on a substrate (9) using an ellipsometer (23), and further obtains a second measurement value which is affected by remaining organic contamination after organic contamination adsorbed onto the substrate (9) is removed by an organic contamination remover (3).

Abstract: In a substrate supporting apparatus of a surface potential measuring apparatus, a first fluid is ejected around a target region on an upper surface of a substrate from a circular-shaped first porous member of a first fluid ejection part and a second fluid is ejected onto a lower surface of the substrate from a circular-shaped second porous member of a second fluid ejection part which is opposite to the first fluid ejection part. The substrate can be supported and flattened between the first fluid ejection part and the second fluid ejection part. Also, it is possible to keep the distance between the substrate and the first porous member, with a simple construction. As a result, a probe can be positioned above a flatted target region with leaving a predetermined spacing, to perform measurement of a surface potential of the target region on the substrate with high accuracy.

Abstract: A surface voltmeter comprises a stage having a conductive surface, a vibrating electrode, a vibration part, and an elevation mechanism. While vibrating the vibrating electrode, displacement current from the conductive surface is acquired. A control part controls electrode voltage so that the displacement current becomes a value specified by a computer, and acquires a relationship between the displacement current and the electrode voltage while changing the displacement current. Acquisition of the relationship is performed a plurality of times while changing distance between the vibrating electrode and an object, the electrode voltage which is independent from the distance between the vibrating electrode and the object is obtained as reference voltage, and surface voltage on the object is obtained on the basis of the reference voltage.

Abstract: In a substrate processing apparatus (1), a ring-shaped cover part (61) opposed to an annular surface (51a) of a rotating part (51) is provided and the rotating part (51) rotates the substrate (9) while holding the substrate (9). An exhaust flow space (64) connecting with a gap space (62) between the cover part (61) and the annular surface (51a) along an outer edge of the cover part (61) is formed by a duct main body (63) connected to the cover part (61) along the outer edge of the cover part (61). Since a cross-sectional area of the exhaust flow space (64) increases gradually along a rotation direction of the rotating part (51), it is possible to reduce variation of inlet flow speed of air around the gap space (62) and to suppress nonuniformity of processing of the substrate (9).

Abstract: A memory (43) of a control unit (4) stores correction data (81) indicating a relationship between a decrement in a measurement value of a film thickness by removal of organic contamination adsorbed onto a substrate and an amount of adsorbed organic contamination corresponding to a difference between a true film thickness and the measurement. The difference is caused by organic contamination adsorbed onto the substrate before removal of organic contamination. In a film-thickness measuring apparatus (1), a calculating/measuring part 41 obtains a first measurement value of a film thickness on a substrate (9) using an ellipsometer (23), and further obtains a second measurement value which is affected by remaining organic contamination after organic contamination adsorbed onto the substrate (9) is removed by an organic contamination remover (3).