Abstract: A multilayer ceramic capacitor includes a ceramic element body including ceramic layers and internal electrode layers, and a pair of external electrodes on both end surfaces of the ceramic element body so as to be electrically connected to the internal electrode layers. Each of the external electrodes includes a base electrode layer and a resin external electrode layer stacked on the base electrode layer. The resin external electrode layer includes a thermosetting resin and a metal powder and amine, isocyanate, epoxy, mercapto, and/or ureido silane coupling agents.

Abstract: A multilayer ceramic capacitor includes a multilayer body including laminated ceramic layers, first and second principal surfaces in a height direction, first and second lateral surfaces in a width direction, and first and second end surfaces in a length direction, first and second internal electrode layers on the ceramic layers and respectively exposed to the first and second end surfaces, first and second external electrodes respectively electrically connected to the first and second internal electrode layers, and portions of the first and second principal surfaces and the first and second lateral surfaces. The first and second external electrodes each include an underlying electrode layer including a metal component, a plating layer on the underlying electrode layer, and a fatty acid on at least a surface of the underlying electrode layer.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers which are stacked and internal electrode layers which are stacked, and external electrodes, each connected to the internal electrode layers. The external electrodes each include a conductive resin layer and a plated layer on the conductive resin layer. The conductive resin layer includes a resin portion, conductive fillers dispersed in the resin portion, and metal particles dispersed unevenly in a distribution differing from that of the conductive fillers in the conductive resin layer. An abundance ratio of the metal particles to the resin portion is higher on a side of the plated layer of the conductive resin layer than on a side of the conductive resin layer close to the multilayer body.

Abstract: A multilayer ceramic capacitor includes a ceramic element body including ceramic layers and internal electrode layers, and a pair of external electrodes on both end surfaces of the ceramic element body so as to be electrically connected to the internal electrode layers. Each of the external electrodes includes a base electrode layer and a resin external electrode layer stacked on the base electrode layer. The resin external electrode layer includes a thermosetting resin and a metal powder and amine, isocyanate, epoxy, mercapto, and/or ureido silane coupling agents.

Abstract: A multilayer ceramic capacitor includes a ceramic element body including ceramic layers and internal electrode layers, and a pair of external electrodes on both end surfaces of the ceramic element body so as to be electrically connected to the internal electrode layers. Each of the external electrodes includes a base electrode layer and a resin external electrode layer stacked on the base electrode layer. The resin external electrode layer includes a thermosetting resin and a metal powder and amine, isocyanate, epoxy, mercapto, and/or ureido silane coupling agents.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers which are stacked and internal electrode layers which are stacked, and external electrodes, each connected to the internal electrode layers. The external electrodes each include a conductive resin layer and a plated layer on the conductive resin layer. The conductive resin layer includes a resin portion, conductive fillers dispersed in the resin portion, and metal particles dispersed unevenly in a distribution differing from that of the conductive fillers in the conductive resin layer. An abundance ratio of the metal particles to the resin portion is higher on a side of the plated layer of the conductive resin layer than on a side of the conductive resin layer close to the multilayer body.

Abstract: An electrolytic capacitor that includes a capacitor element including an anode portion made of a metal layer, a dielectric layer on an outer surface of the metal layer, and a cathode portion on an outer surface of the dielectric layer; an insulating resin body covering the capacitor element; and a gas barrier film on an outer surface of the insulating resin body, the gas barrier film having a water vapor transmittance of 1 g/m2 per day or less.

Abstract: A multilayer ceramic capacitor includes a laminate including dielectric layers and internal electrode layers, and first and second external electrodes on surfaces of the laminate. The laminate includes first and second main surfaces oppose each other in a lamination direction, first and second side surfaces oppose each other in a length direction perpendicular or substantially perpendicular to the lamination direction, and third and fourth side surfaces oppose each other in a width direction perpendicular or substantially perpendicular to the lamination direction and the length direction. A length ratio EB1/EA1 of the first external electrode wrapping around to main surfaces of the laminate is about 0 or more and about 0.5 or less. A length ratio EB2/EA2 of the second external electrode wrapping around to the main surfaces of the laminate is about 0 or more and about 0.5 or less.

Abstract: A mounting structure of a multilayer ceramic capacitor includes a substrate, and a multilayer ceramic capacitor connected to the substrate and including a laminate including dielectric layers and internal electrode layers, and external electrodes on main surfaces of the laminate. The laminate further includes first, second, third, and fourth via conductors connecting the internal electrode layers and the external electrodes. The external electrodes include first, second, third, and fourth external electrodes, each connected to respective end surfaces of the via conductor. Each of the external electrodes does not extend to the side surfaces of the laminate. A ratio W/L of a dimension W in the width direction of the multilayer ceramic capacitor to a dimension L in the length direction of the multilayer ceramic capacitor is about 0.85 or more and about 1 or less.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers which are stacked and internal electrode layers which are stacked, and external electrodes, each connected to the internal electrode layers. The external electrodes each include a conductive resin layer and a plated layer on the conductive resin layer. The conductive resin layer includes a resin portion, conductive fillers dispersed in the resin portion, and metal particles dispersed unevenly in a distribution differing from that of the conductive fillers in the conductive resin layer. An abundance ratio of the metal particles to the resin portion is higher on a side of the plated layer of the conductive resin layer than on a side of the conductive resin layer close to the multilayer body.

Abstract: A multilayer ceramic capacitor includes a laminate including dielectric layers and internal electrode layers, and external electrodes on surfaces of the laminate. A silane coupling agent layer is on at least a mounting surface among surfaces of the laminate. The silane coupling agent layer is made of a fluorine-based silane coupling agent, and a silane coupling agent concentration on the mounting surface is about 0.1 or higher and about 365 or lower and is higher than a silane coupling agent concentration on a counter surface opposing the mounting surface, or the silane coupling agent layer is made of a carbon-based silane coupling agent, and a silane coupling agent concentration on the mounting surface is about 0.91 or higher and about 38.10 or lower and is higher than a silane coupling agent concentration on a counter surface opposing the mounting surface.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers which are stacked and internal electrode layers which are stacked, and external electrodes, each connected to the internal electrode layers. The external electrodes each include a conductive resin layer and a plated layer on the conductive resin layer. The conductive resin layer includes a resin portion, conductive fillers dispersed in the resin portion, and metal particles dispersed unevenly in a distribution differing from that of the conductive fillers in the conductive resin layer. An abundance ratio of the metal particles to the resin portion is higher on a side of the plated layer of the conductive resin layer than on a side of the conductive resin layer close to the multilayer body.

Abstract: A mounting structure of a multilayer ceramic capacitor includes a substrate, and a multilayer ceramic capacitor connected to the substrate and including a laminate including dielectric layers and internal electrode layers, and external electrodes on main surfaces of the laminate. The laminate further includes first, second, third, and fourth via conductors connecting the internal electrode layers and the external electrodes. The external electrodes include first, second, third, and fourth external electrodes, each connected to respective end surfaces of the via conductor. Each of the external electrodes does not extend to the side surfaces of the laminate. A ratio W/L of a dimension W in the width direction of the multilayer ceramic capacitor to a dimension L in the length direction of the multilayer ceramic capacitor is about 0.85 or more and about 1 or less.

Abstract: A multilayer ceramic capacitor includes a multilayer body including ceramic layers and internal electrode layers laminated therein, a pair of external electrodes electrically connected to the internal electrode layers and provided on two end surfaces of the multilayer body. The pair of external electrodes each include a base electrode layer including a metal component, an electrically conductive resin layer on the base electrode layer and including a thermosetting resin and a metal component, and a Ni-plated layer on the electrically conductive layer. A stress of about ?150 MPa or more and about 50 MPa or less is applied to the Ni-plated layer, and an end portion of the Ni-plated layer being in contact with the multilayer body.

Abstract: A multilayer ceramic capacitor includes a multilayer body including laminated ceramic layers, first and second principal surfaces in a height direction, first and second lateral surfaces in a width direction, and first and second end surfaces in a length direction, first and second internal electrode layers on the ceramic layers and respectively exposed to the first and second end surfaces, first and second external electrodes respectively electrically connected to the first and second internal electrode layers, and portions of the first and second principal surfaces and the first and second lateral surfaces. The first and second external electrodes each include an underlying electrode layer including a metal component, a plating layer on the underlying electrode layer, and a fatty acid on at least a surface of the underlying electrode layer.

Abstract: A multilayer ceramic capacitor includes: a laminate including dielectric layers and internal electrode layers; and external electrodes on the main surfaces of the laminate. The laminate further includes a first via conductor, a second via conductor, a third via conductor, and a fourth via conductor that connect the internal electrode layers and the external electrodes. The external electrodes include first external electrodes, second external electrodes, third external electrodes, and fourth external electrodes, each connected to the respective end surfaces of the via conductor. Each of the external electrodes does not extend to the side surfaces of the laminate. A ratio W/L of a dimension W in the width direction of the multilayer ceramic capacitor to a dimension L in the length direction of the multilayer ceramic capacitor is about 0.85 or more and about 1 or less. The dimension L in the length direction of the multilayer ceramic capacitor is about 750 ?m or smaller.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers which are stacked and internal electrode layers which are stacked, and external electrodes, each connected to the internal electrode layers. The external electrodes each include a conductive resin layer and a plated layer on the conductive resin layer. The conductive resin layer includes a resin portion, conductive fillers dispersed in the resin portion, and metal particles dispersed unevenly in a distribution differing from that of the conductive fillers in the conductive resin layer. An abundance ratio of the metal particles to the resin portion is higher on a side of the plated layer of the conductive resin layer than on a side of the conductive resin layer close to the multilayer body.

Abstract: To provide an electronic device and a connecting component which have a shield function and which enable downsizing. The electronic device includes: a substrate having a first substrate portion and a second substrate portion that is arranged at a position facing the first substrate portion; a plurality of potential wirings which are connected to the first substrate portion and to the second substrate portion and which have an arbitrary potential; and a plurality of signal wirings which are connected to the first substrate portion and to the second substrate portion and to which a signal is supplied. The first substrate portion has a mounting region of an electronic component on a side of a surface facing the second substrate portion. The plurality of potential wirings are arranged outside of the mounting region.

Abstract: A multilayer ceramic capacitor includes a ceramic element body including ceramic layers and internal electrode layers, and a pair of external electrodes on both end surfaces of the ceramic element body so as to be electrically connected to the internal electrode layers. Each of the external electrodes includes a base electrode layer and a resin external electrode layer stacked on the base electrode layer. The resin external electrode layer includes a thermosetting resin and a metal powder and amine, isocyanate, epoxy, mercapto, and/or ureido silane coupling agents.

Abstract: A method for producing an electronic component includes a step of preparing a porous base body containing a ceramic and including an inner conductor disposed in the body; and a step of impregnating the base body with a resin emulsion.