Abstract: A manufacturing apparatus of a semiconductor device includes: multiple processing heads provided apart from each other in order to perform predetermined processing in different positions on a common lead frame, the processing heads respectively including cameras; and a controller controlling driving of the processing heads, the controller positioning each of the processing heads at a position where at least an optical offset is canceled out. The controller takes an image of a paste of one island by the cameras and acquires optical inspection images respectively corresponding to the processing heads before the positioning, and calculates, as the optical offset, an amount of difference between the processing heads in a relative positional relationship between the island and the paste shown in the optical inspection images.

Abstract: A die bonding method and apparatus that performs bonding position detection and bonding inspection without lowering the productivity, in which after a bonding head has bonded a semiconductor chip to an island, the bonding head is moved to a wafer to pick up a semiconductor chip and is returned to the island; and during this period, an island used for bonding inspection (that is the island on which bonding has just been performed) and an island used for position detection (that is the island on which bonding is to be done next) are imaged by a camera in the same visual field, and inspection of the bonding conditions of the island used for inspection and detection of the position of the island used for position detection are performed based on the acquired image data.

Abstract: This invention transmits emergency information in preference to a handset with high priority, in a security system which used a cordless phone apparatus with multi-handsets, which is connected to a security control device which detects fire and an intruder by a sensor. In a cordless phone apparatus 228 with multi-handsets, a base unit 227 is equipped with an emergency reporting priority table 226 including priority information for determining a communication sequence of emergency information to a plurality of handsets 200, at the time of occurrence of an emergency, and the base unit 227 determines a reporting sequence to each handset on the basis of this table at the time of reporting an emergency. The emergency reporting priority table 226 can be set/changed on a timely basis, in accordance with an allocation site etc. of a handset.

Abstract: A die bonding method and apparatus that performs bonding position detection and bonding inspection without lowering the productivity, in which after a bonding head has bonded a semiconductor chip to an island, the bonding head is moved to a wafer to pick up a semiconductor chip and is returned to the island; and during this period, an island used for bonding inspection (that is the island on which bonding has just been performed) and an island used for position detection (that is the island on which bonding is to be done next) are imaged by a camera in the same visual field, and inspection of the bonding conditions of the island used for inspection and detection of the position of the island used for position detection are performed based on the acquired image data.

Abstract: The invention aims at providing voice recognition apparatus which can perform training without a speaker being conscious thereof by utilizing the fact that the name of a distant party is frequently uttered at the beginning of conversation over telephone and increase the recognition ratio and recognition speed of the speaker dependent system as the speaker uses the voice recognition apparatus. The invention includes a voice recognition processor of the speaker independent system for comparing acoustic data obtained by splitting an input sound signal with a plurality of word acoustic data and detecting word acoustic data matching the split acoustic data, wherein the voice recognition processor sequentially compares word acoustic data generated from a phoneme model with acoustic data generated from a name uttered by the speaker, and stores the acoustic data identifier corresponding to the generated acoustic data, which match the word acoustic data, as a training signal.

Abstract: A high-frequency radio signal receiving apparatus for digital communication includes a receiving antenna for receiving a high-frequency radio wave, a frequency converter for converting a signal supplied from the receiving antenna through a wide-band bandpass filter into a signal of an intermediate frequency band, an impulsive noise detecting unit for detecting impulsive noise on the basis of a signal outputted from the frequency converter. The apparatus further includes an impulsive noise correcting unit for correcting the signal outputted from the frequency converter in dependence on a signal outputted from the impulsive noise detecting unit, and a demodulating unit for demodulating a signal outputted from the impulsive noise correcting unit and supplied by way of a narrow-band bandpass filter.

Abstract: A method and apparatus for determining the position, size and/or shape of a ball formed on a pad of a semiconductor chip when a wire is bonded between the pad and a lead of a lead frame. The ball is detected in at least three directions from the center of the ball towards the edge of the ball.

Abstract: Workpieces in which, for example, wire bonding has been performed are inspected to determine if they are defective or not by an inspection device. Workpieces which have been found to be defective are conveyed to one workpiece magazine and workpieces which have been found to be defect-free are conveyed to another workpiece magazine, thus defective and non-defective workpieces are separated immediately after inspection.