Patents by Inventor Yoshiyuki SAWAMURA

Yoshiyuki SAWAMURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device with leads having step surfaces
    Patent number: 11929342
    Abstract: A semiconductor device includes: a lead frame that is formed of metal; a wiring substrate that is opposed to the lead frame; an electronic component that is disposed between the lead frame and the wiring substrate; a connection member that connects lead frame and the wiring substrate; and encapsulating resin that is filled between the lead frame and the wiring substrate and covers the electronic component and the connection member. The lead frame includes: a first surface opposed to the wiring substrate and covered by the encapsulating resin; a second surface located on a back side of the first surface and exposed from the encapsulating resin; and a side surface neighboring first surface or the second surface, at least a portion of the side surface exposed from the encapsulating resin.
    Type: Grant
    Filed: October 28, 2020
    Date of Patent: March 12, 2024
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Futoshi Tsukada, Yukinori Hatori, Yoshiyuki Sawamura
  • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20210134754
    Abstract: A semiconductor device includes: a lead frame that is formed of metal; a wiring substrate that is opposed to the lead frame; an electronic component that is disposed between the lead frame and the wiring substrate; a connection member that connects lead frame and the wiring substrate; and encapsulating resin that is filled between the lead frame and the wiring substrate and covers the electronic component and the connection member. The lead frame includes: a first surface opposed to the wiring substrate and covered by the encapsulating resin; a second surface located on a back side of the first surface and exposed from the encapsulating resin; and a side surface neighboring first surface or the second surface, at least a portion of the side surface exposed from the encapsulating resin.
    Type: Application
    Filed: October 28, 2020
    Publication date: May 6, 2021
    Inventors: Futoshi Tsukada, Yukinori Hatori, Yoshiyuki Sawamura
  • Method for producing parvovirus having high infectivity titer and high purity
    Patent number: 10808227
    Abstract: Provided are a parvovirus derived from an unconcentrated cell culture supernatant, having a infectivity titer of 109 TCID50/mL or more and an {infectivity titer (TCID50/mL)}:{impurity protein concentration (ng/mL)} ratio more than 5000:1; and a method of producing such a high-infectivity titer and high-purity parvovirus.
    Type: Grant
    Filed: October 5, 2016
    Date of Patent: October 20, 2020
    Assignee: ASAHI KASEI MEDICAL CO., LTD.
    Inventors: Yoshiyuki Sawamura, Koichiro Yanagida
  • METHOD FOR PRODUCING PARVOVIRUS HAVING HIGH INFECTIVITY TITER AND HIGH PURITY
    Publication number: 20180346883
    Abstract: Provided are a parvovirus derived from an unconcentrated cell culture supernatant, having a infectivity titer of 109 TCID50/mL or more and an {infectivity titer (TCID50/mL)}:{impurity protein concentration (ng/mL)} ratio more than 5000:1; and a method of producing such a high-infectivity titer and high-purity parvovirus.
    Type: Application
    Filed: October 5, 2016
    Publication date: December 6, 2018
    Applicant: ASAHI KASEI MEDICAL CO., LTD.
    Inventors: Yoshiyuki SAWAMURA, Koichiro YANAGIDA