Abstract: Obtained is a dicing and die bonding tape that makes it possible to pick up a semiconductor chip easily and reliably in dicing a semiconductor wafer to pickup the semiconductor chip together with the whole die bonding film. A dicing and die bonding tape used in dicing of a wafer, in obtaining a semiconductor chip, and in die bonding of the semiconductor chip, the dicing and die bonding tape having a die bonding film 3, and a non pressure sensitive adhesive film 4 bonded on one surface of the die bonding film 3, the separation strength between the die bonding film 3 and the non pressure sensitive adhesive film 4 being within a range of 1 to 6 N/m, the shear strength between the die bonding film 3 and the non pressure sensitive adhesive film 4 being 0.3 to 2 N/mm2.

Abstract: It is an object of the invention to provide a curable resin composition excellent in mechanical strength, heat resistance, moisture resistance, flexibility, resistance to thermal cycles, resistance to solder reflow, dimensional stability, and the like after curing and providing high adhesion reliability and conduction reliability and an adhesive epoxy resin paste, an adhesive epoxy resin sheet, a conductive connection paste, and a conductive connection sheet using the curable resin composition, and an electronic component joined body. The invention relates to a curable resin composition, which contains an epoxy resin, a solid polymer having a functional group to react with the epoxy group and a curing agent for an epoxy resin, no phase separation structure being observed in a matrix of a resin when a cured product is dyed with a heavy metal and observed with a transmission electron microscope.

Abstract: It is an object of the invention to provide a curable resin composition excellent in mechanical strength, heat resistance, moisture resistance, flexibility, resistance to thermal cycles, resistance to solder reflow, dimensional stability, and the like after curing and providing high adhesion reliability and conduction reliability and an adhesive epoxy resin paste, an adhesive epoxy resin sheet, a conductive connection paste, and a conductive connection sheet using the curable resin composition, and an electronic component joined body. The invention relates to a curable resin composition, which contains an epoxy resin, a solid polymer having a functional group to react with the epoxy group and a curing agent for an epoxy resin, no phase separation structure being observed in a matrix of a resin when a cured product is dyed with a heavy metal and observed with a transmission electron microscope.

Abstract: The present invention provides a false twist crimped yarn having an improved coherent structure which is produced by the specific mode of processing realized by defining the processing conditions of false twist crimping system. Here the unitary effect generally takes the form of a structure in which several of the yarn composing filaments fasciate the rest of the filaments and accordingly the false twist crimped yarn can be submitted to the weaving process without undergoing the sizing, twisting and interlacing required conventionally.