Abstract: A wireless communication system includes first and second communication apparatuses transmitting/receiving encrypted communication data by radio. The first includes: a first encrypting/decrypting unit encrypting communication data and decrypting encrypted communication data; a first interface unit electrically connectable with a portable nonvolatile memory (NVRAM), to which the NVRAM can be physically removably inserted; and a first cryptography key processing unit generating a temporary cryptography key used for encrypting/decrypting the communication data and a master cryptography key for generating the temporary cryptography key.

Abstract: A wireless communication system according to an embodiment of the present invention includes a first communication apparatus and a second communication apparatus transmitting/receiving encrypted communication data by radio. The first communication apparatus includes: a first encrypting/decrypting unit encrypting the communication data and decrypting the encrypted communication data; a first interface unit electrically connectable with a portable nonvolatile memory, to which the nonvolatile memory can be physically removably inserted; and a first cryptography key processing unit generating a temporary cryptography key used for encrypting/decrypting the communication data and a master cryptography key for generating the temporary cryptography key.

Abstract: A method for designing an ASIC has a first step of generating circuit data that includes a large-scale hardware macro made up of primitive macros; a second step of extracting, from the circuit data generated in the first step, wiring data of an external terminal of the large-scale hardware macro, an output of which is in an open state or an input of which is clamped; a third step of performing circuit tracing using the wiring data of the external terminal extracted in the second step; a fourth step of removing wiring data of a redundant primitive macro and redundant wiring data connected to said redundant primitive macros using the wiring data of the external terminal extracted in the second step; a fifth step of generating a temporary library in which a delay time within the macro is adjusted, based on removal results obtained in the fourth step; and a sixth step of performing layout and wiring, and of performing a delay simulation, using the temporary library generated in the fifth step.

Abstract: A semiconductor device with a semiconductor pellet or pellets mounted on a lead frame and a plastic-molded package, which enables a larger scale integration of circuits than the conventional ones to realize down-sizing. A die pad of the leadframe has a first insulator film formed thereon, a patterned interconnection film formed on the first insulator film, and a second insulator film formed on the first insulator film to cover the interconnection film. Bonding pads of the semiconductor pellet are directly bonded through first windows of the second insulator film to the interconnection film, respectively so that the pellet is electrically connected to the interconnection film. Inner leads of the leadframe are electrically connected through second windows of the second insulator film to the interconnection film, respectively. thus, the bonding pads of the semiconductor pellet are electrically connected through the interconnection film to the inner leads, respectively.