Abstract: A method for manufacturing a three-dimensional shaped object, comprising: (i) forming a powder layer on a base plate by a sliding movement of a squeegee blade, followed by forming a solidified layer by irradiating a predetermined portion of the powder layer with a light beam, thereby allowing sintering of the powder of the predetermined portion or melting and subsequent solidification thereof; and (ii) forming another solidified layer by newly forming a powder layer on the resulting solidified layer, and then irradiating another predetermined portion of the new powder layer with the light beam, steps (i) and (ii) being repeatedly performed, wherein machining is performed at least once on an outer surface of a shaped object precursor obtained during manufacturing, and after machining, at least one solidified layer is formed, and followed by upper face machining to remove a raised solidified portion generated at a peripheral edge of the solidified layer.

Abstract: There is provided a hybrid ultraprecision machining device for manufacturing a micro-machined product from a workpiece, the machining device comprising: an electromagnetic-wave-machining means for roughly machining the workpiece; a precision-machining means for precisely machining the roughly machined workpiece, the precision-machining means being equipped with a replaceable cutting tool selected from the group consisting of a planar tool, a shaper tool, a fly-cutting tool, a diamond-turning tool and a micro-milling tool; a shape-measurement means for measuring a shape of the workpiece upon use of the electromagnetic-wave machining means and the precision-machining means; and a control means for controlling the electromagnetic-wave-machining means or the precision-machining means, based on information on the shape of the workpiece, the shape being measured by the shape-measuring means.

Abstract: There is provided a method for manufacturing a three-dimensional shaped object, comprising the steps of: (i) forming a solidified layer by irradiating a predetermined portion of a powder layer with a light beam, thereby allowing sintering of the powder of the predetermined portion or melting and subsequent solidification thereof; and (ii) forming another solidified layer by newly forming a powder layer on the resulting solidified layer, and then irradiating another predetermined portion of the new powder layer with the light beam, the steps (i) and (ii) being repeatedly performed, wherein the three-dimensional shaped object is manufactured such that it has three different solidified portions of high-density, intermediate-density and low-density solidified portions in at least a part of the object, and wherein the intermediate-density solidified portion is formed to be located in a part of a surface of the three-dimensional shaped object.

Abstract: There is provided a method for manufacturing a three-dimensional shaped object, the method comprising the repeated steps of: (i) forming a solidified layer by irradiating a predetermined portion of a powder layer with a light beam, thereby allowing a sintering of the powder in the predetermined portion or a melting and subsequent solidification thereof; and (ii) forming another solidified layer by newly forming a powder layer on the resulting solidified layer, followed by the irradiation of a predetermined portion of the powder layer with the light beam, wherein a heater element is disposed on the solidified layer during the repeated steps (i) and (ii), and thereby the heater element is situated within the three-dimensional shaped object.

Abstract: There is provided a method for manufacturing a three-dimensional shaped object, the method comprising the repeated steps of: (i) forming a solidified layer by irradiating a predetermined portion of a powder layer with a light beam, thereby allowing a sintering of the powder in the predetermined portion or a melting and subsequent solidification thereof; and (ii) forming another solidified layer by newly forming a powder layer on the resulting solidified layer, followed by the irradiation of a predetermined portion of the powder layer with the light beam, wherein a part of a surface portion of the three-dimensional shaped object is formed as a low-density solidified portion whose solidified density ranges from 50% to 90% so that an application of pressure can be performed by a gas flowing through the low-density solidified portion.

Abstract: A circuit board includes: an insulating substrate; and a circuit formed on the insulating substrate. The circuit includes: a undercoat layer with a circuit pattern formed by irradiating a metal thin film covering a surface of the insulating substrate with a laser along an outer shape of the circuit so as to partly remove the metal thin film along the outer shape of the circuit; a Cu plating layer, a Ni plating layer and a Au plating layer formed by metal plating and sequentially provided on a surface of the undercoat layer. A first middle plating layer and a second middle plating layer are provided between the Ni plating layer and the Au plating layer. The first middle plating layer includes metal with a less noble standard electrode potential with respect to Au and is in contact with the Au plating layer. The second middle plating layer includes metal with a noble standard electrode potential with respect to the metal in the first middle plating layer and is in contact with the first middle plating layer.

Abstract: In a contact for a connector, a metal material id processed to be bent in a predetermined shape in a manner so that a terminal portion is formed in the vicinity of an end and a contacting portion is formed in the vicinity of the other end. A nickel plating layer as a foundation plating layer and a gold plating layer are formed on substantially entire surface of the contact including the terminal portion and the contacting portion. Laser beams are irradiated at a portion between the terminal portion and the contacting portion, and especially in the vicinity of the terminal portion so that the nickel plating layer as the foundation plating layer is unsheathed by removing the gold plating layer or gold in the gold plating layer and nickel in the foundation layer are alloyed. Nickel and the alloy of nickel and gold respectively have low wetting property with respect to solder, so that diffusion of melted solder stops at the portion.

Abstract: A circuit board includes: an insulating substrate; and a circuit formed on the insulating substrate. The circuit includes: a undercoat layer with a circuit pattern formed by irradiating a metal thin film covering a surface of the insulating substrate with a laser along an outer shape of the circuit so as to partly remove the metal thin film along the outer shape of the circuit; a Cu plating layer, a Ni plating layer and a Au plating layer formed by metal plating and sequentially provided on a surface of the undercoat layer. A first middle plating layer and a second middle plating layer are provided between the Ni plating layer and the Au plating layer. The first middle plating layer includes metal with a less noble standard electrode potential with respect to Au and is in contact with the Au plating layer. The second middle plating layer includes metal with a noble standard electrode potential with respect to the metal in the first middle plating layer and is in contact with the first middle plating layer.

Abstract: An LED package includes: a molded interconnect device that has an LED chip mounted thereon, and is mounted on a mounting board electrically connected to the LED chip; and a plurality of elastic bodies mounted on the mounting board while interposing solder therebetween. The plurality of elastic bodies hold a position of the molded interconnect device with respect to the mounting board by elastic forces given to an inner surface side of the molded interconnect device from a plurality of outer side surfaces thereof opposite to each other.

Abstract: A light-emitting device (200) has a submount (100) and a plate for heat transfer (300) having a metallic plate (30). The submount (100) has a mount base (10), at least one light-emitting diode chip (5) mounted thereon and electrically conducting lines (12-17) formed on the mount base (10) to be connected electrically to the light-emitting diode chip (5). A first plane (11) of the mount base (10) of the submount (100) is bonded thermally to the first plate (300). For example, the plate is a circuit board having a metallic plate (30), and the submount (100) is bonded thermally to the metallic plate (30) of the one of the at least one plate (300). In an example, a second plate for heat transfer is also bonded thermally to a second plane of the mount base (100) for providing a plurality of heat transfer paths.

Abstract: In order to obtain a 3D circuit board manufacturing method capable of improving productivity and accuracy of circuit formation, the metal hoop material 1 provided with the positioning pilot holes 2 is employed. Since the 3D structures 3 are formed on the hoop material 1 with a preset interval maintained therebetween in a lengthwise direction of the hoop material 1, the series of processes can be conducted on a roll 1A (winding of the hoop material 1) basis, which results that handling between the individual processes can be done more easily while increase of troubles and manufacturing costs can be prevented. Further, since the positioning pilot holes 2 serve to facilitate accurate positioning, plating and/or laser processing can be conducted continuously with high precision while a tact time for the positioning work can be reduced.

Abstract: A light-emitting device (200) has a submount (100) and a plate for heat transfer (300) having a metallic plate (30). The submount (100) has a mount base (10), at least one light-emitting diode chip (5) mounted thereon and electrically conducting lines (12-17) formed on the mount base (10) to be connected electrically to the light-emitting diode chip (5). A first plane (11) of the mount base (10) of the submount (100) is bonded thermally to the first plate (300). For example, the plate is a circuit board having a metallic plate (30), and the submount (100) is bonded thermally to the metallic plate (30) of the one of the at least one plate (300). In an example, a second plate for heat transfer is also bonded thermally to a second plane of the mount base (100) for providing a plurality of heat transfer paths.

Abstract: In a contact for a connector, a metal material id processed to be bent in a predetermined shape in a manner so that a terminal portion is formed in the vicinity of an end and a contacting portion is formed in the vicinity of the other end. A nickel plating layer as a foundation plating layer and a gold plating layer are formed on substantially entire surface of the contact including the terminal portion and the contacting portion. Laser beams are irradiated at a portion between the terminal portion and the contacting portion, and especially in the vicinity of the terminal portion so that the nickel plating layer as the foundation plating layer is unsheathed by removing the gold plating layer or gold in the gold plating layer and nickel in the foundation layer are alloyed. Nickel and the alloy of nickel and gold respectively have low wetting property with respect to solder, so that diffusion of melted solder stops at the portion.

Abstract: A molded interconnect device (MID) having a multilayer circuit of a reduced thickness, in which a layer-to-layer connection(s) is formed with high reliability, is provided as a multilayer circuit board. The multilayer circuit board comprises a substrate having a first surface and a second surface extending from an end of the first surface at a required angle relative to the first surface, and the multilayer circuit formed on the first surface and composed of a plurality of circuit layers. Each of the circuit layers is provided with a conductive layer having a required circuit pattern and an insulation layer formed on the conductive layer by film formation. The layer-to-layer connection of the multilayer circuit is made through a second conductive layer formed on the second surface of the substrate.

Abstract: A three-dimensional object is manufactured by filling and hardening a powder material around a core. A powder material is first filled and layered around the core, and a beam is then selectively irradiated on the layer of powder material to form a hardened layer united with the core. These steps are repeated to form a plurality of hardened layers around the core, thereby manufacturing the three-dimensional object having the core embedded therein.

Abstract: A molded interconnect device (MID) having a multilayer circuit of a reduced thickness, in which a layer-to-layer connection(s) is formed with high reliability, is provided as a multilayer circuit board. The multilayer circuit board comprises a substrate having a first surface and a second surface extending from an end of the first surface at a required angle relative to the first surface, and the multilayer circuit formed on the first surface and composed of a plurality of circuit layers. Each of the circuit layers is provided with a conductive layer having a required circuit pattern and an insulation layer formed on the conductive layer by film formation. The layer-to-layer connection of the multilayer circuit is made through a second conductive layer formed on the second surface of the substrate.

Abstract: A three-dimensional object is fabricated from a light curable liquid resin by repeating the following process to superimpose a plurality of cured resin layers. The process utilizes a vessel containing a volume of the liquid resin and a vertically movable platform. In the process, the platform is immersed in the liquid resin in the vessel to dispose an overlay surface of an immediately previously cured layer sufficiently below the liquid level of the liquid resin. The platform is then raised such that the overlay surface is slightly higher than the liquid level of the liquid resin in the vessel, while keeping the liquid resin on the overlay surface connected with the surrounding liquid resin in the vessel by the effect of surface tension acting on the liquid resin. An excess amount of the liquid resin on the overlay surface is removed to form a liquid resin layer having a desired thickness.

Abstract: A process of fabricating a three-dimensional object from a light curable liquid resin by radiating a light to a surface of the liquid resin to form successive cross-sectional layers of the cured resin superimposed on each other. The process makes it possible to rapidly form on a platform or on a previously cured layer a fresh stratum of a desired thickness to be subsequently cured into the corresponding layer.

Abstract: A process and device for fabricating a three-dimensional object from a light curable liquid resin by irradiating a light to a surface of the liquid resin to form successive cross-sectional layers of the cured resin superimposed on each other. An open top enclosure surrounds the entire circumference of the preceding cured layer and a top upper end face of the enclosure is kept at the same horizontal level as that of the preceding cured layer. The liquid resin is supplied over the preceding layer, over the enclosure and into a space defined therebetween in such a manner as to positively overflow a portion of the liquid resin outwardly over the top end of the enclosure, thereby leaving a continuous coat of the liquid resin extending horizontally over from the preceding cured layer and to the enclosure.