Abstract: An imprint apparatus for forming a pattern on an imprinting material includes an alignment unit that detects a mold-side mark formed on a mold and a substrate-side mark formed on the substrate, forming a mark pair, and aligns the mold and the substrate on the basis of a detection result. The alignment unit obtains, by using the detection result of a first mark pair and the detection result of a second mark pair, which is different from the first mark pair, positional deviation information of the first mark pair and positional deviation information of the second mark pair in the same direction; obtains a determination value by using the positional deviation information of the first mark pair and the positional deviation information of second mark pair; and determines that mark detection is abnormal when the determination value is not in an allowable range.

Abstract: An imprint method includes: before contacting a mold with an imprint material on a target shot region, obtaining relative position of the target shot region with respect to the mold, and performing first alignment between the target shot region and the mold by driving a correction unit configured to correct the relative position of the target shot region; after contacting the mold with the imprint material on the target shot region, performing second alignment between the target shot region and the mold by driving the correction unit; and performing the imprint process on the target shot region after the second alignment. The first alignment includes alignment performed based on a driving amount of the correction unit in the second alignment for another shot region where the imprint process has been performed earlier than in the target shot region.

Abstract: An imprint method includes: before contacting a mold with an imprint material on a target shot region, obtaining relative position of the target shot region with respect to the mold, and performing first alignment between the target shot region and the mold by driving a correction unit configured to correct the relative position of the target shot region; after contacting the mold with the imprint material on the target shot region, performing second alignment between the target shot region and the mold by driving the correction unit; and performing the imprint process on the target shot region after the second alignment. The first alignment includes alignment performed based on a driving amount of the correction unit in the second alignment for another shot region where the imprint process has been performed earlier than in the target shot region.

Abstract: An imprint method includes: before contacting a mold with an imprint material on a target shot region, obtaining relative position of the target shot region with respect to the mold, and performing first alignment between the target shot region and the mold by driving a correction unit configured to correct the relative position of the target shot region; after contacting the mold with the imprint material on the target shot region, performing second alignment between the target shot region and the mold by driving the correction unit; and performing the imprint process on the target shot region after the second alignment. The first alignment includes alignment performed based on a driving amount of the correction unit in the second alignment for another shot region where the imprint process has been performed earlier than in the target shot region.

Abstract: The present invention provides an imprint apparatus which forms a pattern in an imprint material on a substrate using a mold, the apparatus including a stage configured to hold the substrate, a holding mechanism configured to hold the mold, a scope configured to detect a mark provided on the mold, a driving mechanism configured to drive the scope to locate the mark provided on the mold within a field of view of the scope, and a processing unit configured obtain a positional shift amount from a reference position of the mold held by the holding mechanism based on a driving amount of the scope required for positioning the scope, and perform alignment between the mold and the substrate based on the positional shift amount.

Abstract: An imprint apparatus for forming a pattern on an imprinting material includes an alignment unit that detects a mold-side mark formed on a mold and a substrate-side mark formed on the substrate, forming a mark pair, and aligns the mold and the substrate on the basis of a detection result. The alignment unit obtains, by using the detection result of a first mark pair and the detection result of a second mark pair, which is different from the first mark pair, positional deviation information of the first mark pair and positional deviation information of the second mark pair in the same direction; obtains a determination value by using the positional deviation information of the first mark pair and the positional deviation information of second mark pair; and determines that mark detection is abnormal when the determination value is not in an allowable range.

Abstract: An imprint method includes: before contacting a mold with an imprint material on a target shot region, obtaining relative position of the target shot region with respect to the mold, and performing first alignment between the target shot region and the mold by driving a correction unit configured to correct the relative position of the target shot region; after contacting the mold with the imprint material on the target shot region, performing second alignment between the target shot region and the mold by driving the correction unit; and performing the imprint process on the target shot region after the second alignment. The first alignment includes alignment performed based on a driving amount of the correction unit in the second alignment for another shot region where the imprint process has been performed earlier than in the target shot region.

Abstract: The present invention provides an imprint apparatus which forms a pattern in an imprint material on a substrate using a mold, the apparatus including a stage configured to hold the substrate, a holding mechanism configured to hold the mold, a scope configured to detect a mark provided on the mold, a driving mechanism configured to drive the scope, and a processing unit configured to position the scope by the driving mechanism so that the scope detects the mark on the mold held by the holding mechanism, obtain a positional shift amount from a reference position of the mold held by the holding mechanism based on a driving amount of the scope that has been required for positioning the scope, and performs alignment between the mold and the substrate based on the positional shift amount.

Abstract: An apparatus which illuminates an original by an illumination optical system and projects a pattern of the original onto a substrate. The apparatus includes a measuring device configured to measure the light intensity distribution, a detector configured to detect a total light quantity on the pupil plane, and a controller configured to determine a light quantity, to be detected when a target light intensity distribution is formed on the pupil plane, as a target light quantity based on the measured light intensity distribution and the detected total light quantity, and to control the adjusting mechanism so that the detected total light quantity becomes the target light quantity. The illumination optical system includes an adjusting mechanism configured to adjust a light intensity distribution on a pupil plane of the projection optical system.

Abstract: An imprint apparatus comprises: a first scope configured to measure a position deviation amount between a shot region and an original; and a controller. The controller brings the original into contact with the resin coated on each of not less than two shot regions of plural shot regions, which is aligned based on preobtained layout data, and measures a position deviation amount between each of the not less than two shot regions and the original using the first scope, calculates a position deviation amount between each of the plural shot regions and the original statistically processing the measured position deviation amounts, and corrects the layout data of the plural shot regions using the calculated position deviation amounts, and executes the imprint process while aligning each shot region other than the not less than two shot regions with the original based on the corrected layout data.

Abstract: An exposure apparatus for exposing a substrate to radiant energy includes: a stage including a chuck, and configured to hold the substrate on the chuck with vacuum and to be moved; a recovery device configured to recover the substrate from the stage; a first detector configured to detect an error of holding of the substrate on the chuck; a measuring device configured to measure an amount of positional deviation of the substrate relative to the chuck; and a controller configured to cause the measuring device to measure the amount of positional deviation in a case where the first detector detects the error, and to control an operation of the stage such that the amount of positional deviation falls within a tolerance based on the measured amount.

Abstract: An apparatus which illuminates an original by an illumination optical system and projects a pattern of the original onto a substrate, the illumination optical system including an adjusting mechanism configured to adjust a light intensity distribution on a pupil plane of the projection optical system, comprises a measuring device configured to measure the light intensity distribution, a detector configured to detect a total light quantity on the pupil plane, and a controller configured to determine a light quantity, to be detected when a target light intensity distribution is formed on the pupil plane, as a target light quantity based on the measured light intensity distribution and the detected total light quantity, and to control the adjusting mechanism so that the detected total light quantity detected becomes the target light quantity.

Abstract: An exposure apparatus for exposing a substrate to radiant energy includes: a stage including a chuck, and configured to hold the substrate on the chuck with vacuum and to be moved; a recovery device configured to recover the substrate from the stage; a first detector configured to detect an error of holding of the substrate on the chuck; a measuring device configured to measure an amount of positional deviation of the substrate relative to the chuck; and a controller configured to cause the measuring device to measure the amount of positional deviation in a case where the first detector detects the error, and to control an operation of the stage such that the amount of positional deviation falls within a tolerance based on the measured amount.

Abstract: In an method of collecting image data in magnetic resonance imaging, a sequential order for collecting image data of the plurality of sliced planes including a most clinically important sliced plane is decided by a sequential order decision unit. Synchronizing information related to at least one sliced plane of the plurality of sliced planes is decided by a synchronizing information decision unit. At least two sliced planes includes the most clinically important sliced plane, and are synchronized with at least one different reference pulse for collecting the image data. The image data of the plurality of sliced planes are collected by an image data collection step at every repetition time by selectively exciting each of the plurality of sliced planes on the basis of the synchronizing information and the sequential order.

Abstract: A method of scanning in magnetic resonance imaging is disclosed. In the method, a desired diagnostic portion of an object is diagnosed, and then two different slicing planes according to the designated diagnostic portion are selected. Then, magnetic resonance signals from the selected two slicing planes are collected, and scanning ranges in the slicing planes individually decided using the collected magnetic resonance signals. Then the diagnostic portion in accordance with the designated scanning ranges is scanned for diagnosis.

Abstract: In an magnetic resonance imaging system of the echo planar imaging method, a gradient field Gx is generated by a linear type transconductance amplifier and gradient fields Gy and Gz are generated by an amplifier which is formed of a resonant type amplifier or a current type inverter for outputting a first current of a given waveform, a linear type transconductance amplifier for outputting a second current of an arbitrary waveform at a lower level than that of the first current, a gradient field coil having first and second windings for respectively running the first and second currents, the first and second windings being wound in a bifilar form, and a cancel coil for canceling a voltage induced by the gradient field coil, the cancel coil having third and fourth windings for respectively connected between the first winding and the resonant type amplifier or a current type inverter and between the second winding and the linear type transconductance amplifier, the third and fourth windings being wound in a bifi

Abstract: An apparatus for nuclear magnetic resonance imaging capable of obtaining images at arbitrary cross sectional planes with an ultra high speed imaging method using a gradient field amplifier of resonant amplification type. The apparatus includes both a linear type amplifier having three channels and a resonant type amplifier having at least two channels. A nuclear magnetic resonance imaging is carried out with both of the linear and resonant type amplifiers supplying currents to the gradient coils.

Abstract: To reduce the running cost of an MRI apparatus, power supplied to a normal conductive coil from a pre-regulator is reduced in an idling mode. This reduction in power also reduces the heat generated in the normal conductive coil and a shunt resistor. A computer controls a cooling unit according to the amount of the heat reduced in order to reduce to flow rate of a cooling medium. In this manner, the temperatures of the normal conductive coil and shunt resistor can be maintained at constant levels. Further, if a current value is set to maintain the temperatures of the normal conductive coil and shunt resistor at the constant levels only by natural heat radiating, circulation of the cooling medium can be stopped.