Abstract: A method of selectively transferring devices arrayed on a first substrate to a second substrate on which an adhesive resin layer is previously formed is disclosed. The method includes steps of selectively heating the adhesive resin layer on the second substrate by laser irradiation from the back surface side of the second substrate, and curing the selectively heated portions of the adhesive resin layer, thereby adhesively bonding those to be transferred of the devices to the second substrate. At this time, portions, corresponding to the devices, of the adhesive layer is heated directly or indirectly via the devices or wiring portions by laser irradiation from the back surface side of the substrate. The heated portions of the adhesive resin layer selectively exhibit the adhesive forces. The heated portions of the adhesive layer are then cured, so that only the devices to be transferred are selectively transferred to the second substrate.

Abstract: An inexpensive display unit having a sufficient luminance and a method of fabricating the display unit are disposed, wherein micro-sized semiconductor light emitting devices are fixedly arrayed on a plane of a base body of the display unit at intervals. Micro-sized GaN based semiconductor light emitting devices (11) formed by selective growth are each buried in a first insulating layer (21) made from an epoxy resin except an upper end portion and a lower end surface thereof, and electrodes (18) and (19) of each of the light emitting devices (11) are extracted. These light emitting devices (11) are fixedly arrayed on the upper plane of the base body (31) at intervals.

Abstract: The invention provides a structure to attach a liquid crystal panel to a prism, which enables further enhancements in cooling capabilities. The structure includes a storing member fixed on a base and holding a holding frame, where a liquid crystal panel is held. Erected pieces to form a space to receive the holding frame are formed protruding on both left and right sides at the light incident side. Protrusions to form an air path with a cross-dichroic prism are formed on both left and right sides on the light emitting side. The liquid crystal panel is attached to the cross-dichroic prism through a holding member having an opening at a portion corresponding to the panel face of the liquid crystal panel.

Abstract: A device transferring method and a device arraying method are provided for readily transferring a number of devices from a first substrate to a second substrate such that the devices are enlargedly spaced from each other with a pitch larger than an array pitch of the devices arrayed on the first substrate.

Abstract: A display device is formed by burying at least part of a light emitting device in an insulating material, wherein a drive electrode for the light emitting device is formed so as to be extracted on a surface of the insulating material. A display unit is produced by two-dimensionally arraying such light emitting devices on a base body. Since the display device is modularized by burying a light emitting device finely formed in an insulating material, to re-shape the light emitting device into a size easy to handle, it is possible to suppress the production cost of the display unit using such display devices, and to ensure a desirable handling performance of the light emitting device; for example, facilitate the carrying of the light emitting device or the mounting thereof on a base body.

Abstract: A device transfer method includes the steps of: covering a plurality of devices, which have been formed on a substrate, with a resin layer; forming electrodes in the resin layer in such a manner that the electrodes are connected to the devices; cutting the resin layer, to obtain resin buried devices each containing at least one of the devices; and peeling the resin buried devices from the substrate and transferring them to a device transfer body. This device transfer method is advantageous in easily, smoothly separating devices from each other, and facilitating handling of the devices in a transfer step and ensuring good electric connection between the devices and external wiring, even if the devices are fine devices.

Abstract: An electronic circuit device of a three-dimensional mounting mode capable of being produced by a simple method while suppressing the production costs and of a structure resistant to external stress, including first-mounting-board wiring portions formed on a first mounting board, first mounting parts mounted on the first mounting board, bumps formed on the first mounting board connecting to the first-mounting-board wiring portion, a protective layer formed covering the first mounting parts so that at least the portions near the tops of the bumps are exposed, a second mounting board stacked as an upper layer of the protective layer, second-mounting-board wiring portions formed on the second mounting board in order to connect to the bumps, and second mounting parts mounted connecting to the second-mounting-board wiring portions on the second mounting board at the surface of the second mounting board opposite to the protective layer side, and a method of production of the same.

Abstract: The interface between a first substrate and light-emitting diodes formed on the first substrate is selectively irradiated with an energy beam and transmits the energy beam through the first substrate, thereby selectively releasing the light-emitting diodes. The light-emitting diodes are then transferred onto a device holding layer included on a device holding substrate. Subsequently, the light-emitting diodes are transferred onto a second substrate. The irradiation of the interface with the energy beam enables the devices to be easily released from the first substrate.

Abstract: There are provided a base member 14, a position restriction mechanism 15, a height restriction mechanism 17, an evenness holding mechanism, and an alignment mechanism 20, 22. A plurality of semiconductor modules is serially layered on the base member. Each semiconductor module comprises a semiconductor chip 7 mounted on a printed-wiring board 6 and a bump 13 formed on an interlayer connection land 8. The position restriction mechanism 15 restricts respective positions of the semiconductor modules 2 to be layered on the base member 14. The height restriction mechanism 17 restricts the height of the entire layered semiconductor module unit 4 layered on the base member 14. The evenness holding mechanism maintains evenness of the semiconductor module 2. The alignment mechanism 20, 22 aligns a mother substrate 5 on which a multilayer semiconductor module unit 4 is mounted.

Abstract: There are provided a printing apparatus and a method of making a mask pattern for exposure by the use of the printing apparatus. A temperature of a thermal head is detected, and a plurality of split pulses formed by dividing a strobe pulse applied to the thermal head are sequentially applied with quiescent periods interposed therebetween. There is stored in advance pulse-applying data of settings of a cumulative period of pulse-applying periods over which the plurality of split pulses are respectively applied, a number of the split pulses, the split pulse-applying periods, and the quiescent periods, defined in a manner corresponding to values of the temperature of the thermal head. Appropriate pulse-applying data is read out according to the temperature detected, and application of the split pulses is controlled according to the appropriate pulse-applying data.

Abstract: A plate-making sheet in the form of a strip having two longer-sides and two shorter-sides includes a base sheet and an adhesive sheet laminated on the base sheet. The adhesive sheet has a label portion formed in the middle thereof for being printed with an image. The label portion is defined by a cutting line formed in the adhesive sheet. A plate-making sheet group includes a plurality of types of plate-making sheets having respective label portions different from each other, which are distinguished from each other in respect of color of at least one of the base sheet and the adhesive sheet. A printing apparatus for printing a stamp image on the label portion of the plate-making sheet comprises a printing mechanism for printing a stamp image on the label portion, a feed mechanism for feeding the plate-making sheet through the printing mechanism, and a sensor for detecting feeding of the plate-making sheet into the printing mechanism.

Abstract: There are provided a printing apparatus and a method of making a mask pattern for exposure by the use of the printing apparatus. A temperature of a thermal head is detected, and a plurality of split pulses formed by dividing a strobe pulse applied to the thermal head are sequentially applied with quiescent periods interposed therebetween. There is stored in advance pulse-applying data of settings of a cumulative period of pulse-applying periods over which the plurality of split pulses are respectively applied, a number of the split pulses, the split pulse-applying periods, and the quiescent periods, defined in a manner corresponding to values of the temperature of the thermal head. Appropriate pulse-applying data is read out according to the temperature detected, and application of the split pulses is controlled according to the appropriate pulse-applying data.

Abstract: An electronic part mounting apparatus wherein an original orientation position of a nozzle can be restored accurately at a high speed with a simplified structure includes an index table supported for rotation around a first axis, and a nozzle mechanism carried on the index table and having a nozzle. The nozzle mechanism includes an original orientation returning gear mounted for rotation around a second axis on the index table for returning the nozzle to a predetermined original orientation position.