Abstract: A system and a method for inspection aided printing, the method may include printing, by a printing unit of a system, a pattern on an area of a substrate, during a printing process; inspecting, by an inspection unit of the system, the area to provide inspection results; searching, by a processor of the system, for a defect, based upon the inspection results; and wherein if a defect is found—determining whether to (a) repair the substrate, (b) perform a corrective measure for improving the printing process, or (c) perform no corrective measure in response to the defect.

Abstract: A system, that includes a hybrid sensor that comprises: a monochromatic portion that is arranged to obtain a monochromatic image of a first area of an object; a multiple-color portion that is arranged to obtain a multi-colored image of a second area of the object; wherein the monochromatic portion comprises monochromatic sensing elements that sense radiation of a same frequency band; wherein the multiple-color portion comprises color sensing elements of different types, wherein different types of color sensing elements are associated with different frequency bands.

Abstract: A system, that includes a hybrid sensor that comprises: a monochromatic portion that is arranged to obtain a monochromatic image of a first area of an object; a multiple-color portion that is arranged to obtain a multi-colored image of a second area of the object; wherein the monochromatic portion comprises monochromatic sensing elements that sense radiation of a same frequency band; wherein the multiple-color portion comprises color sensing elements of different types, wherein different types of color sensing elements are associated with different frequency bands.

Abstract: A method and an inspection system may be provided. The inspection system may include (a) a hybrid sensor that may include a monochromatic portion that is arranged to obtain a monochromatic image of a first area of an object; a multiple-color portion that is arranged to obtain a multi-colored image of a second area of the object; wherein the monochromatic portion comprises monochromatic sensing elements that sense radiation of a same frequency band; wherein the multiple-color portion comprises color sensing elements of different types, wherein different types of color sensing elements are associated with different frequency bands; (b) a storage element arranged to store the monochromatic image and the multiple-color image; and (c) a defect detection module arranged to detect defects by processing at least one of the monochromatic image and the multiple-color image.

Abstract: A system and a method for inspection aided printing, the method may include printing, by a printing unit of a system, a pattern on an area of a substrate, during a printing process; inspecting, by an inspection unit of the system, the area to provide inspection results; searching, by a processor of the system, for a defect, based upon the inspection results; and wherein if a defect is found—determining whether to (a) repair the substrate, (b) perform a corrective measure for improving the printing process, or (c) perform no corrective measure in response to the defect.

Abstract: A method and an inspection system may be provided. The inspection system may include (a) a hybrid sensor that may include a monochromatic portion that is arranged to obtain a monochromatic image of a first area of an object; a multiple-color portion that is arranged to obtain a multi-colored image of a second area of the object; wherein the monochromatic portion comprises monochromatic sensing elements that sense radiation of a same frequency band; wherein the multiple-color portion comprises color sensing elements of different types, wherein different types of color sensing elements are associated with different frequency bands; (b) a storage element arranged to store the monochromatic image and the multiple-color image; and (c) a defect detection module arranged to detect defects by processing at least one of the monochromatic image and the multiple-color image.

Abstract: An inspection method and an inspection system, the inspection system includes: (i) a first group of sensors, for sensing light components of a first light band of an image of an area of an inspected object, and for generating first detection signals reflecting sensed light components of the first light band; (ii) a second group of sensors, for sensing light components of a second light band of the image of the area of the inspected object, wherein the second light band differs from the first light band, and for generating second detection signals reflecting sensed light components of the second light band; (iii) optics, for projecting the image of the area of the inspected object towards the first group of sensors and towards the second array of sensors; and (iv) a processing unit, coupled to the first and second group of sensors, for detecting defects based on the first or second detection signals.

Abstract: A method for printing a pattern on a electrical circuit, the method includes jetting on the electrical circuit an ultraviolet curable ink to form a pattern; and at least partially curing the ultraviolet curable ink by exposing the pattern to ultraviolet radiation generated from at least one ultraviolet light emitting diode (LED).

Abstract: An inspection method and an inspection system, the inspection system includes: (i) a first group of sensors, for sensing light components of a first light band of an image of an area of an inspected object, and for generating first detection signals reflecting sensed light components of the first light band; (ii) a second group of sensors, for sensing light components of a second light band of the image of the area of the inspected object, wherein the second light band differs from the first light band, and for generating second detection signals reflecting sensed light components of the second light band; (iii) optics, for projecting the image of the area of the inspected object towards the first group of sensors and towards the second array of sensors; and (iv) a processing unit, coupled to the first and second group of sensors, for detecting defects based on the first or second detection signals.