Patents by Inventor Yosuhide Kuroda

Yosuhide Kuroda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HEAT SINK DEVICE AND METHOD OF REPAIRING SEMICONDUCTOR DEVICE
    Publication number: 20120024512
    Abstract: A method of repairing a semiconductor device includes turning a press member to apply pressure on an electronic component which is mounted on a substrate. A heat sink which is provided on the electronic component via a bonding layer is thus displaced with respect to the electronic component in a transverse direction. The heat sink is removed from the electronic component by shearing the bonding layer with the press member.
    Type: Application
    Filed: July 18, 2011
    Publication date: February 2, 2012
    Applicant: FUJITSU LIMITED
    Inventors: Tsuyoshi Yamamoto, Naoaki Nakamura, Rie Takada, Kenichiro Tsubone, Yosuhide Kuroda, Harumi Yagi