Abstract: An onboard device includes: a communication unit configured to communicate with an onboard device included in an onboard network; a detection unit configured to detect a new onboard device that is an onboard device newly added to the onboard network; and a sleep processing unit configured to, in a detected state where the new onboard device has been detected by the detection unit, transmit a sleep request for transitioning to a sleep state in synchronization with an onboard device included in the onboard network, to the new onboard device via the communication unit.

Abstract: Provided is a relay device mounted to a vehicle including a plurality of function units. The relay device includes: an authentication processing unit configured to acquire authentication information of a function unit from an external device outside the vehicle, and perform an authentication process regarding the function unit by using the acquired authentication information; and a relay processing unit configured to, on the basis of a result of the authentication process performed by the authentication processing unit, relay information between the function unit and another function unit. When a validity time limit of the authentication information has expired, the authentication processing unit acquires, from the external device, the authentication information that is new.

Abstract: An information of a network to which a new function unit has been added is easily acquired. A relay device installed in a vehicle includes: a detection unit configured to detect a new function unit being a function unit that is newly added to a network including an existing function unit being one or a plurality of function units; a relay unit configured to relay a frame between the function units; and an acquisition unit configured to acquire, from the frame, relayed by the relay unit, between the new function unit detected by the detection unit and the existing function unit, function unit information that includes information regarding a network configuration of a layer of a lower order than an application layer, the function unit information being of at least one of the new function unit and the existing function unit.

Abstract: An onboard device includes: a communication unit configured to communicate with an onboard device included in an onboard network; a detection unit configured to detect a new onboard device that is an onboard device newly added to the onboard network; and a sleep processing unit configured to, in a detected state where the new onboard device has been detected by the detection unit, transmit a sleep request for transitioning to a sleep state in synchronization with an onboard device included in the onboard network, to the new onboard device via the communication unit.

Abstract: An information of a network to which a new function unit has been added is easily acquired. A relay device installed in a vehicle includes: a detection unit configured to detect a new function unit being a function unit that is newly added to a network including an existing function unit being one or a plurality of function units; a relay unit configured to relay a frame between the function units; and an acquisition unit configured to acquire, from the frame, relayed by the relay unit, between the new function unit detected by the detection unit and the existing function unit, function unit information that includes information regarding a network configuration of a layer of a lower order than an application layer, the function unit information being of at least one of the new function unit and the existing function unit.

Abstract: A capacitor includes a silicon substrate, a first terminal, a dielectric layer, a conductive portion, and a second terminal. The silicon substrate has a principal surface and a porous part. The principal surface includes an opening region and a non-opening region other than the opening region. The porous part has an opening in the opening region. The first terminal is electrically connected to the silicon substrate. The dielectric layer is formed on an inner surface of the porous part. The conductive portion is filled, on the dielectric layer, in the porous part. The second terminal is electrically connected to the conductive portion. At least one of the first terminal or the second terminal overlaps at least part of the porous part in the normal direction of the principal surface.

Abstract: A capacitor includes a silicon substrate, a conductor layer, and a dielectric layer. The silicon substrate has a principal surface including a capacitance generation region and a non-capacitance generation region. The silicon substrate includes a porous part provided in a thickness direction in the capacitance generation region. The conductor layer includes a surface layer part at least covering part of a surface of the capacitance generation region and a filling part filled in at least part of the porous part. The dielectric layer is provided between an inner surface of the porous part and the filling part. The porous part includes a macroporous part having macro pores and a nanoporous part formed in at least part of inner surfaces of the macro pores and having nano pores smaller than the macro pores.

Abstract: A capacitor includes a silicon substrate, a conductor layer, and a dielectric layer. The silicon substrate has a principal surface including a capacitance generation region and a non-capacitance generation region. The silicon substrate has a porous part provided in a thickness direction in the capacitance generation region. The conductor layer has a surface layer part at least covering part of a surface of the capacitance generation region and a filling part filled in at least part of fine pores of the porous part. The dielectric layer is provided between an inner surface of the fine pores and the filling part.

Abstract: A capacitor includes a silicon substrate, a conductor layer, and a dielectric layer. The silicon substrate has a principal surface including a capacitance generation region and a non-capacitance generation region. The silicon substrate includes a porous part provided in a thickness direction in the capacitance generation region. The conductor layer includes a surface layer part at least covering part of a surface of the capacitance generation region and a filling part filled in at least part of the porous part. The dielectric layer is provided between an inner surface of the porous part and the filling part. The porous part includes a macroporous part having macro pores and a nanoporous part formed in at least part of inner surfaces of the macro pores and having nano pores smaller than the macro pores.

Abstract: A capacitor includes a silicon substrate, a conductor layer, and a dielectric layer. The silicon substrate has a principal surface including a capacitance generation region and a non-capacitance generation region. The silicon substrate has a porous part provided in a thickness direction in the capacitance generation region. The conductor layer has a surface layer part at least covering part of a surface of the capacitance generation region and a filling part filled in at least part of fine pores of the porous part. The dielectric layer is provided between an inner surface of the fine pores and the filling part.

Abstract: The disclosure has a configuration including: a supporting substrate having a cavity; at least one bridge section extending directly above the cavity and having at least one end supported by the supporting substrate and an other end; and a thermopile wiring formed in the bridge section and including hot junctions in the bridge section and cold junctions directly above the supporting substrate, the hot junctions being connected to the cold junctions. The bridge section is provided with: at least one breakage detection wiring for detecting breakage of the bridge section; and at least one heater wiring. The breakage detection wiring is wired along the thermopile wiring. The heater wiring is wired such that part of the heater wiring is in an area between the other end of the bridge section and the hot junctions.

Abstract: The disclosure has a configuration including: a supporting substrate having a cavity; at least one bridge section extending directly above the cavity and having at least one end supported by the supporting substrate and an other end; and a thermopile wiring formed in the bridge section and including hot junctions in the bridge section and cold junctions directly above the supporting substrate, the hot junctions being connected to the cold junctions. The bridge section is provided with: at least one breakage detection wiring for detecting breakage of the bridge section; and at least one heater wiring. The breakage detection wiring is wired along the thermopile wiring. The heater wiring is wired such that part of the heater wiring is in an area between the other end of the bridge section and the hot junctions.

Abstract: Infrared sensor as an aspect of the present disclosure includes substrate, processor disposed on substrate, infrared sensing element disposed above processor, package that is disposed on substrate and covers infrared sensing element, and heat insulating section disposed between infrared sensing element and processor at an overlapped region of processor and infrared sensing element. Heat insulating section has a thermal conductivity smaller than substrate.

Abstract: An infrared sensor, which achieves a low manufacturing cost, or has high sensitivity, or in which an increase in heat capacity is reduced, is provided. The infrared sensor includes a first infrared absorbing portion, an infrared sensing portion for sensing infrared rays based on infrared rays absorbed by the first infrared absorbing portion, and a plurality of protrusions including metal and disposed apart from each other on a surface of the first infrared absorbing portion. Since an absorption rate of infrared rays is improved, sensitivity can be improved, or an increase in heat capacity can be reduced.

Abstract: A detection device is used with a vehicle including a cabin, a ceiling, pillars, a driver seat, and a passenger seat. The detection device includes a detector disposed on the ceiling or the pillars of the vehicle and detecting an object in the cabin while not contacting the object, and a scanning unit that moves the detector for scan. The detection device can detect a temperature of the object accurately, and control air-conditioning comfortably to the object.

Abstract: An infrared sensor, which achieves a low manufacturing cost, or has high sensitivity, or in which an increase in heat capacity is reduced, is provided. The infrared sensor includes a first infrared absorbing portion, an infrared sensing portion for sensing infrared rays based on infrared rays absorbed by the first infrared absorbing portion, and a plurality of protrusions including metal and disposed apart from each other on a surface of the first infrared absorbing portion. Since an absorption rate of infrared rays is improved, sensitivity can be improved, or an increase in heat capacity can be reduced.

Abstract: The infrared sensor (1) includes a base (10), and an infrared detection element (3) formed over a surface of the base (10). The infrared detection element (3) comprises an infrared absorption member (33) in the form of a thin film configured to absorb infrared, and a temperature detection member (30) configured to measure a temperature difference between the infrared absorption member (33) and the base (10). The temperature detection member (30) includes a p-type polysilicon layer (35) formed over the infrared absorption member (33) and the base (10), an n-type polysilicon layer (34) formed over the infrared absorption member (33) and the base (10) without contact with the p-type polysilicon layer (33), and a connection layer (36) configured to electrically connect the p-type polysilicon layer (35) to the n-type polysilicon layer (34). Each of the p-type polysilicon layer (35) and the n-type polysilicon layer (34) has an impurity concentration in a range of 1018 to 1020 cm?3.

Abstract: The infrared sensor (1) includes a base (10), and an infrared detection element (3) formed over a surface of the base (10). The infrared detection element (3) comprises an infrared absorption member (33) in the form of a thin film configured to absorb infrared, and a temperature detection member (30) configured to measure a temperature difference between the infrared absorption member (33) and the base (10). The temperature detection member (30) includes a p-type polysilicon layer (35) formed over the infrared absorption member (33) and the base (10), an n-type polysilicon layer (34) formed over the infrared absorption member (33) and the base (10) without contact with the p-type polysilicon layer (33), and a connection layer (36) configured to electrically connect the p-type polysilicon layer (35) to the n-type polysilicon layer (34). Each of the p-type polysilicon layer (35) and the n-type polysilicon layer (34) has an impurity concentration in a range of 1018 to 1020 cm?3.

Abstract: The infrared sensor (1) includes a base (10), and an infrared detection element (3) formed over a surface of the base (10). The infrared detection element (3) includes an infrared absorption member (33) in the form of a thin film configured to absorb infrared, a temperature detection member (30) configured to measure a temperature difference between the infrared absorption member (33) and the base (10), and a safeguard film (39). The infrared element (3) is spaced from the surface of the base (10) for thermal insulation. The temperature detection member (30) includes a p-type polysilicon layer (35) formed over the infrared absorption member (33) and the base (10), an n-type polysilicon layer (34) formed over the infrared absorption member (33) and the base (10) without contact with the p-type polysilicon layer (35), and a connection layer (36) configured to electrically connect the p-type polysilicon layer (35) to the n-type polysilicon layer (34).

Abstract: A micro relay includes a magnetic member and a permanent magnet in addition to a main substrate, a stationary contact, an armature and a coil. The magnetic member includes a core located in a first though hole of the main substrate. The permanent magnet is located at an end of the magnetic member or at a place within the magnetic member. The main substrate has a plurality of laminated layers. The coil is formed of a plurality of planer coils connected in series. The plurality of planer coils are formed on the plurality of laminated layers, respectively and are located around the core.