Patents by Inventor Yosuke Hirumuta

Yosuke Hirumuta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device with leads engaged with notches
    Patent number: 6111312
    Abstract: A semiconductor device is provided. This semiconductor device includes a resin package, a semiconductor chip, and leads consisting of inner leads and outer leads. The rear surface of the semiconductor chip and the inner leads are situated substantially on the same plane. The resin package is provided with notches on its mounting surface. The outer leads are bent inward along the exterior of the resin package and pulled around to the mounting surface, so that the edges of the outer leads are engaged with the notches.
    Type: Grant
    Filed: June 2, 1999
    Date of Patent: August 29, 2000
    Assignee: Fujitsu Limited
    Inventors: Yosuke Hirumuta, Yuji Akashi, Susumu Kida