Patents by Inventor Yosuke Ishihara
Yosuke Ishihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11966248Abstract: An operation device includes an operating portion to receive a push-in operation, a lessening member to lessen tilt movement of the operating portion associated with the push-in operation, a supporting portion to support the lessening member, a base portion on which the supporting portion is provided, and at least one placement portion that is provided on the base portion, includes a placing surface to place an end portion of the lessening member, and holds the lessening member on the base portion by the placing surface and the supporting portion in a preparation stage for assembling the operating portion to the base portion.Type: GrantFiled: March 7, 2023Date of Patent: April 23, 2024Assignee: KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHOInventors: Akito Ishihara, Yuki Sakai, Yosuke Naito, Renya Watanabe, Yutaka Okuda
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Publication number: 20240109985Abstract: A fluoropolymer of a monomer (I) represented by the general formula (I), wherein a content of a polymerization unit (I) derived from the monomer (I) is 50% by mass or more based on all polymerization units constituting the fluoropolymer: CX2?CX—O—Rf—SO3M??General formula (I) wherein X is independently F or CF3; Rf is a fluorine-containing alkylene group having 1 to 40 carbon atoms or a fluorine-containing alkylene group having 2 to 100 carbon atoms and having an ether bond or a keto group; and M is —H, a metal atom, —NR74, imidazolium optionally having a substituent, pyridinium optionally having a substituent, or phosphonium optionally having a substituent, wherein R7 is H or an organic group. Also disclosed are an aqueous solution and coating composition containing the fluoropolymer.Type: ApplicationFiled: November 17, 2023Publication date: April 4, 2024Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Masahiro HIGASHI, Kanako NAKANISHI, Sumi ISHIHARA, Moe HOSOKAWA, Kensuke YAMATO, Kazuki KANEKO, Yosuke KISHIKAWA
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Publication number: 20240094654Abstract: An electrostatic charge image developing toner contains alkylsilane-treated silica particles, cyclic siloxane, and toner particles.Type: ApplicationFiled: March 22, 2023Publication date: March 21, 2024Applicant: FUJIFILM Business Innovation Corp.Inventors: Yukiko KAMIJO, Yosuke TSURUMI, Moegi IGUCHI, Yuka ISHIHARA
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Patent number: 11912489Abstract: A plurality of heat dissipation substrates stacked on each other, intermediate sheets disposed under a lowermost heat dissipation substrate, on an uppermost heat dissipation substrate, and between heat dissipation substrates adjacent to each other, a drying agent disposed over or under the plurality of heat dissipation substrates, and a bag that seals the plurality of heat dissipation substrates, the plurality of intermediate sheets, and the drying agent.Type: GrantFiled: November 6, 2019Date of Patent: February 27, 2024Assignee: DENKA COMPANY LIMITEDInventors: Hiroaki Ota, Yosuke Ishihara, Daisuke Goto
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Patent number: 11903168Abstract: A substantially rectangular flat heat dissipation member includes: a composite portion where silicon carbide having voids is impregnated with metal; and a metal portion that is different from the composite portion. Here, a proportion of a volume of the metal portion to a total volume of the heat dissipation member is 2.9% or higher and 12% or lower. In addition, when a length of a diagonal line of the rectangular flat heat dissipation member is represented by L, in a top view where one main surface of the heat dissipation member is a top surface, 40% or higher of a total volume of the metal portion is present in a region D within a distance of L/6 from an apex of any one of four corners of the heat dissipation member. Further, a hole penetrates the metal portion in the region D.Type: GrantFiled: November 19, 2019Date of Patent: February 13, 2024Assignee: DENKA COMPANY LIMITEDInventors: Yosuke Ishihara, Daisuke Goto
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Patent number: 11682604Abstract: To provide a method for manufacturing a heat dissipation component having excellent heat dissipation properties, in which there is minimal return of warping after the bonding of a circuit board, and to provide a heat dissipation component manufactured using the method. Provided is a method for manufacturing a warped flat-plate-shaped heat dissipation component containing a composite part that comprises silicon carbide and an aluminum alloy, wherein the method for manufacturing the heat dissipation component is characterized in that the heat dissipation component is sandwiched in a concave-convex mold having a surface temperature of at least 450° C. and having a pair of opposing spherical surfaces measuring 7000-30,000 mm in curvature radius, and pressure is applied for 30 seconds or more at a stress of 10 kPa or more such that the temperature of the heat dissipation component reaches at least 450° C.Type: GrantFiled: March 18, 2020Date of Patent: June 20, 2023Assignee: DENKA COMPANY LIMITEDInventors: Daisuke Goto, Takeshi Miyakawa, Yosuke Ishihara
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Publication number: 20220124936Abstract: A substantially rectangular flat heat dissipation member includes: a composite portion where silicon carbide having voids is impregnated with metal; and a metal portion that is different from the composite portion. Here, a proportion of a volume of the metal portion to a total volume of the heat dissipation member is 2.9% or higher and 12% or lower. In addition, when a length of a diagonal line of the rectangular flat heat dissipation member is represented by L, in a top view where one main surface of the heat dissipation member is a top surface, 40% or higher of a total volume of the metal portion is present in a region D within a distance of L/6 from an apex of any one of four corners of the heat dissipation member. Further, a hole penetrates the metal portion in the region D.Type: ApplicationFiled: November 19, 2019Publication date: April 21, 2022Applicant: DENKA COMPANY LIMITEDInventors: Yosuke ISHIHARA, Daisuke GOTO
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Publication number: 20220017282Abstract: A plurality of heat dissipation substrates stacked on each other, intermediate sheets disposed under a lowermost heat dissipation substrate, on an uppermost heat dissipation substrate, and between heat dissipation substrates adjacent to each other, a drying agent disposed over or under the plurality of heat dissipation substrates, and a bag that seals the plurality of heat dissipation substrates, the plurality of intermediate sheets, and the drying agent.Type: ApplicationFiled: November 6, 2019Publication date: January 20, 2022Applicant: DENKA COMPANY LIMITEDInventors: Hiroaki OTA, Yosuke ISHIHARA, Daisuke GOTO
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Publication number: 20200335415Abstract: To provide a method for manufacturing a heat dissipation component having excellent heat dissipation properties, in which there is minimal return of warping after the bonding of a circuit board, and to provide a heat dissipation component manufactured using the method. Provided is a method for manufacturing a warped flat-plate-shaped heat dissipation component containing a composite part that comprises silicon carbide and an aluminum alloy, wherein the method for manufacturing the heat dissipation component is characterized in that the heat dissipation component is sandwiched in a concave-convex mold having a surface temperature of at least 450° C. and having a pair of opposing spherical surfaces measuring 7000-30,000 mm in curvature radius, and pressure is applied for 30 seconds or more at a stress of 10 kPa or more such that the temperature of the heat dissipation component reaches at least 450° C.Type: ApplicationFiled: March 18, 2020Publication date: October 22, 2020Applicant: DENKA COMPANY LIMITEDInventors: Daisuke GOTO, Takeshi MIYAKAWA, Yosuke ISHIHARA
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Patent number: 10751912Abstract: The present invention provides an aluminum-diamond composite which combines high thermal conductivity and a coefficient of thermal expansion close to a semiconductor element, and in which the difference between the thicknesses of both surfaces is reduced so as to be suitable for use as a heat sink etc. for a semiconductor element.Type: GrantFiled: October 11, 2016Date of Patent: August 25, 2020Assignee: DENKA COMPANY LIMITEDInventors: Hiroaki Ota, Takeshi Miyakawa, Yosuke Ishihara
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Patent number: 10640853Abstract: Provided is an aluminum-diamond-based composite which can be processed with high dimensional accuracy. The flat-plate-shaped aluminum-diamond-based composite is coated with a surface layer of which the entire surface has an average film thickness of 0.01-0.2 mm and which contains not less than 80 volume % of a metal containing an aluminum.Type: GrantFiled: December 27, 2016Date of Patent: May 5, 2020Assignee: DENKA COMPANY LIMITEDInventors: Yosuke Ishihara, Takeshi Miyakawa, Hideo Tsukamoto, Kazunori Koyanagi
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Patent number: 10636723Abstract: To provide a method for manufacturing a heat dissipation component having excellent heat dissipation properties, in which there is minimal return of warping after the bonding of a circuit board, and to provide a heat dissipation component manufactured using the method. Provided is a method for manufacturing a warped flat-plate-shaped heat dissipation component containing a composite part that comprises silicon carbide and an aluminum alloy, wherein the method for manufacturing the heat dissipation component is characterized in that the heat dissipation component is sandwiched in a concave-convex mold having a surface temperature of at least 450° C. and having a pair of opposing spherical surfaces measuring 7000-30,000 mm in curvature radius, and pressure is applied for 30 seconds or more at a stress of 10 kPa or more such that the temperature of the heat dissipation component reaches at least 450° C.Type: GrantFiled: August 5, 2015Date of Patent: April 28, 2020Assignee: DENKA COMPANY LIMITEDInventors: Daisuke Goto, Takeshi Miyakawa, Yosuke Ishihara
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Patent number: 10541189Abstract: A sheet-shaped aluminum-diamond composite containing a prescribed amount of a diamond powder wherein a first and second peak in a volumetric distribution of particle sizes occurs at 5-25 ?m and 55-195 ?m, and a ratio between an area of a volumetric distribution of particle sizes of 1-35 ?m and 45-205 ?m is from 1:9 to 4:6, the composite including an aluminum-containing metal as the balance, wherein the composite is covered, on both main surfaces, with a surface layer having prescribed film thicknesses and containing 80 vol % or more of an aluminum-containing metal, two or more Ni-containing layers are formed on at least the surface layer, the Ni-containing layers being such that a first and second layer from the surface layer side are amorphous Ni alloy layers having prescribed thicknesses, and an Au layer having a prescribed thickness is formed as an outermost layer.Type: GrantFiled: November 24, 2017Date of Patent: January 21, 2020Assignee: DENKA COMPANY LIMITEDInventors: Yosuke Ishihara, Takeshi Miyakawa, Hiroaki Ota, Hideo Tsukamoto
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Patent number: 10539379Abstract: A heat dissipation component for a semiconductor element includes: a composite part containing 50-80 vol % diamond powder with the remainder having metal including aluminum, the diamond powder having a particle diameter volume distribution first peak at 5-25 ?m and a second peak at 55-195 ?m. A ratio between a volume distribution area at particle diameters of 1-35 ?m and a volume distribution area at particle diameters of 45-205 ?m is 1:9 to 4:6; surface layers on both composite part principal surfaces, each of the surface layers containing 80 vol % or more metal including aluminum and having a film thickness of 0.03-0.2 mm; and a crystalline Ni layer and an Au layer on at least one of the surface layers, the crystalline Ni layer having a film thickness of 0.5-6.5 ?m, and the Au layer having a film thickness of 0.05 ?m or larger.Type: GrantFiled: September 1, 2015Date of Patent: January 21, 2020Assignee: DENKA COMPANY LIMITEDInventors: Yosuke Ishihara, Takeshi Miyakawa, Kazunori Koyanagi
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Publication number: 20190341330Abstract: A sheet-shaped aluminum-diamond composite containing a prescribed amount of a diamond powder wherein a first and second peak in a volumetric distribution of particle sizes occurs at 5-25 ?m and 55-195 ?m, and a ratio between an area of a volumetric distribution of particle sizes of 1-35 ?m and 45-205 ?m is from 1:9 to 4:6, the composite including an aluminum-containing metal as the balance, wherein the composite is covered, on both main surfaces, with a surface layer having prescribed film thicknesses and containing 80 vol % or more of an aluminum-containing metal, two or more Ni-containing layers are formed on at least the surface layer, the Ni-containing layers being such that a first and second layer from the surface layer side are amorphous Ni alloy layers having prescribed thicknesses, and an Au layer having a prescribed thickness is formed as an outermost layer.Type: ApplicationFiled: November 24, 2017Publication date: November 7, 2019Applicant: DENKA COMPANY LIMITEDInventors: Yosuke ISHIHARA, Takeshi MIYAKAWA, Hiroaki OTA, Hideo TSUKAMOTO
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Patent number: 10358704Abstract: A composite is obtained by press-molding a mixed powder comprising 20-50 vol % of a metal powder and 50-80 vol % of a diamond powder for which a first peak in a volumetric distribution of particle size lies at 5-25 ?m, and a second peak lies at 55-195 ?m, and a ratio between the area of a volumetric distribution of particle sizes of 1-35 ?m and the area of a volumetric distribution of particle sizes of 45-205 ?m is from 1:9 to 4:6, thereby obtaining a composite having a high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, which is easy to mold into a prescribed shape.Type: GrantFiled: July 3, 2015Date of Patent: July 23, 2019Assignee: DENKA COMPANY LIMITEDInventors: Yosuke Ishihara, Takeshi Miyakawa, Shinya Narita
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Patent number: 10302375Abstract: An aluminum-diamond composite that exhibits both high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, and that can suppress the occurrence of swelling, etc., of a surface metal layer portion even in actual use under a high load. An aluminum-diamond composite includes 65-80 vol % of a diamond powder having a roundness of at least 0.94, for which a first peak in a volumetric distribution of grain size lies at 5-25 ?m, and a second peak lies at 55-195 ?m, and a ratio between the area of the volumetric distribution of grain sizes of 1-35 ?m and the area of the volumetric distribution of grain sizes of 45-205 ?m is from 1:9 to 4:6; the balance being composed of a metal containing aluminum.Type: GrantFiled: April 23, 2015Date of Patent: May 28, 2019Assignee: DENKA COMPANY LIMITEDInventors: Yosuke Ishihara, Takeshi Miyakawa, Hideo Tsukamoto, Shinya Narita
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Publication number: 20190093201Abstract: Provided is an aluminum-diamond-based composite which can be processed with high dimensional accuracy. The flat-plate-shaped aluminum-diamond-based composite is coated with a surface layer of which the entire surface has an average film thickness of 0.01-0.2 mm and which contains not less than 80 volume % of a metal containing an aluminum.Type: ApplicationFiled: December 27, 2016Publication date: March 28, 2019Applicant: DENKA COMPANY LIMITEDInventors: Yosuke ISHIHARA, Takeshi MIYAKAWA, Hideo TSUKAMOTO, Kazunori KOYANAGI
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Publication number: 20180281230Abstract: The present invention provides an aluminum-diamond composite which combines high thermal conductivity and a coefficient of thermal expansion close to a semiconductor clement, and in which the difference between the thicknesses of both surfaces is reduced so as to be suitable for use as a heat sink etc. for a semiconductor element.Type: ApplicationFiled: October 11, 2016Publication date: October 4, 2018Inventors: Hiroaki OTA, Takeshi MIYAKAWA, Yosuke ISHIHARA
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Publication number: 20170317007Abstract: To provide a method for manufacturing a heat dissipation component having excellent heat dissipation properties, in which there is minimal return of warping after the bonding of a circuit board, and to provide a heat dissipation component manufactured using the method. Provided is a method for manufacturing a warped flat-plate-shaped heat dissipation component containing a composite part that comprises silicon carbide and an aluminum alloy, wherein the method for manufacturing the heat dissipation component is characterized in that the heat dissipation component is sandwiched in a concave-convex mold having a surface temperature of at least 450° C. and having a pair of opposing spherical surfaces measuring 7000-30,000 mm in curvature radius, and pressure is applied for 30 seconds or more at a stress of 10 kPa or more such that the temperature of the heat dissipation component reaches at least 450° C.Type: ApplicationFiled: August 5, 2015Publication date: November 2, 2017Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHAInventors: Daisuke GOTO, Takeshi MIYAKAWA, Yosuke ISHIHARA