Abstract: To satisfactorily apply a protective tape to a bump wafer, an application apparatus (1) for applying a protective tape (PT) to a wafer (W) includes: an application table (60) configured to support the wafer (W); a tape holding body (30) capable of holding the protective tape (PT) and configured to supply the protective tape (PT) held by the tape holding body (30) onto the wafer (W); and a pressing member (62) configured to press the protective tape (PT) from above. The pressing member (62) includes a protective layer outer periphery retainer (620) configured to press a peripheral portion of a protective layer (PL), which is laminated on the protective tape (PT) and has an outer diameter smaller than an outer diameter of the wafer (W), to apply the protective tape (PT) to the wafer (W).

Abstract: To reduce residual stress generated on a protective tape at a time of application of the protective tape to a semiconductor wafer, provided is an application apparatus (1) for applying a protective tape (PT) to a semiconductor wafer (W), including: a tape conveyance mechanism (2) configured to convey the protective tape (PT) temporarily applied to a base material (BM) to a peeling position; a tape holding body (30) capable of holding the protective tape (PT); a holding-body moving mechanism (31) configured to move the tape holding body (30) to the peeling position; and a peeling mechanism (4) configured to peel the base material (BM) from the protective tape (PT) held by the tape holding body (30) at the peeling position.

Abstract: To satisfactorily apply a protective tape to a bump wafer, an application apparatus (1) for applying a protective tape (PT) to a wafer (W) includes: an application table (60) configured to support the wafer (W); a tape holding body (30) capable of holding the protective tape (PT) and configured to supply the protective tape (PT) held by the tape holding body (30) onto the wafer (W); and a pressing member (62) configured to press the protective tape (PT) from above. The pressing member (62) includes a protective layer outer periphery retainer (620) configured to press a peripheral portion of a protective layer (PL), which is laminated on the protective tape (PT) and has an outer diameter smaller than an outer diameter of the wafer (W), to apply the protective tape (PT) to the wafer (W).

Abstract: To reduce residual stress generated on a protective tape at a time of application of the protective tape to a semiconductor wafer, provided is an application apparatus (1) for applying a protective tape (PT) to a semiconductor wafer (W), including: a tape conveyance mechanism (2) configured to convey the protective tape (PT) temporarily applied to a base material (BM) to a peeling position; a tape holding body (30) capable of holding the protective tape (PT); a holding-body moving mechanism (31) configured to move the tape holding body (30) to the peeling position; and a peeling mechanism (4) configured to peel the base material (BM) from the protective tape (PT) held by the tape holding body (30) at the peeling position.

Abstract: To perform alignment of a protective tape having a protective layer with high accuracy, provided is an alignment device (5) to be used for applying a protective tape (PT) to a semiconductor wafer (W), including: a tape holding body (30) configured to hold the protective tape (PT) laminated with a protective layer (PL) having an outer diameter smaller than an outer diameter of the protective tape (PT), and one image pickup means (50) for imaging a plurality of parts of an outer peripheral edge portion of the protective layer (PL), wherein the alignment device is configured to determine a center position of the protective layer (PL) based on positional information on each of the plurality of parts of the outer peripheral edge portion of the protective layer (PL) through determination of the positional information on the each of the plurality of parts based on image data acquired by imaging of the image pickup means (50).

Abstract: A connector for being arranged at an end of a cable includes a paddle card substrate for electrically connecting the cable to a connected device, plural device-side electrodes that are formed at an end portion of the paddle card substrate in plural rows in an insertion direction into the device and are to be electrically connected to the device, and a protective portion formed between the device-side electrodes adjacent in the insertion direction into the device to protect a surface of the paddle card substrate. The protective portion includes plural metal protective pads that are spaced from each other at a predetermined distance in the insertion direction.

Abstract: A connector for being arranged at an end of a cable includes a paddle card substrate for electrically connecting the cable to a connected device, plural device-side electrodes that are formed at an end portion of the paddle card substrate in plural rows in an insertion direction into the device and are to be electrically connected to the device, and a protective portion formed between the device-side electrodes adjacent in the insertion direction into the device to protect a surface of the paddle card substrate. The protective portion includes plural metal protective pads that are spaced from each other at a predetermined distance in the insertion direction.

Abstract: A differential signaling cable includes a pair of signal conductors provided in parallel, longitudinally within the differential signaling cable, an insulator covering a periphery of the pair of signal conductors as a whole, wherein only the insulator is between the pair of signal conductors, and a shield conductor provided on an outer periphery of the insulator. An interval between the pair of signal conductors is set so that an even-mode impedance of the pair of signal conductors having the interval fixed by embedment within the insulator and covered by the shield conductor, is in a range from 1.5 to 1.9 times an odd-mode impedance for improved skew and differential mode insertion loss experienced during a transmission of high-speed signals of at least 10 Gbps.

Abstract: A differential signaling cable includes a pair of signal conductors provided in parallel, longitudinally within the differential signaling cable, an insulator covering a periphery of the pair of signal conductors as a whole, wherein only the insulator is between the pair of signal conductors, and a shield conductor provided on an outer periphery of the insulator. An interval between the pair of signal conductors is set so that an even-mode impedance of the pair of signal conductors having the interval fixed by embedment within the insulator and covered by the shield conductor, is in a range from 1.5 to 1.9 times an odd-mode impedance for improved skew and differential mode insertion loss experienced during a transmission of high-speed signals of at least 10 Gbps.

Abstract: A differential signaling cable according to the present invention comprises: a pair of signal conductors provided in parallel; an insulator which covers the periphery of the pair of signal conductors in a batch; and a shield conductor provided on the outer periphery of the insulator, in which an interval between the pair of signal conductors is specified so that even-mode impedance becomes 1.5 to 1.9 times odd-mode impedance.

Abstract: Provided is a cable connector, a cable assembly, and a method of manufacturing the cable assembly, in which electric characteristics are stabilized by suppressing elastic deformation of a cable for differential signal transmission, and besides, which is easily connectable by reducing the number of parts. In a ground contact, an outer-conductor adhering portion which is protruded from a side wall portion of a connector main body and which is adhered with an outer conductor by a conductive adhesive is provided. In this manner, elastic deformation of a cable for differential signal transmission is suppressed, so that electric characteristics can be stabilized. Also, connecting work between the outer conductor and the ground contact can be simplified as reducing the number of parts. Further, the cable for differential signal transmission is not exposed to a high temperature of soldering or others, and therefore, thermal deformation thereof does not occur, either.

Abstract: A cable connector and a cable assembly in which electrical characteristics are stabilized by suppressing elastic deformation of a cable for differential signal transmission, and besides, which are easily connectable by reducing the number of parts, and a method of manufacturing the cable assembly are provided. Respective ground contacts and respective signal line contacts positioned between the respective ground contacts through a space are provided in a connector main body. Front-side arm portions and rear-side arm portions mutually extending toward the respective signal line contacts are integrally provided with end portions of the respective ground contacts protruded from a side wall portion of the connector main body. And, under a state that respective signal line conductors are arranged in the respective signal line contacts, an outer conductor is held by the front-side arm portions and the rear-side arm portions.

Abstract: A differential signal transmission cable includes two core wires arranged in parallel, each of the two core wires having an insulation layer on an outer periphery of a conductor; and an outer conductor provided so as to cover the two core wires all together. The insulation layer includes sequentially an inner skin layer of a non-foamed resin, a foam layer of a foamed resin, and an outer skin layer of a non-foamed resin on the outer periphery of the conductor. The outer skin layer has a higher relative permittivity than the inner skin layer. The multipair differential signal transmission includes a plurality of differential signal transmission cables and a protective jacket provided around the plurality of differential signal transmission cables.

Abstract: A cable connector and a cable assembly in which electrical characteristics are stabilized by suppressing elastic deformation of a cable for differential signal transmission, and besides, which are easily connectable by reducing the number of parts, and a method of manufacturing the cable assembly are provided. Respective ground contacts and respective signal line contacts positioned between the respective ground contacts through a space are provided in a connector main body. Front-side arm portions and rear-side arm portions mutually extending toward the respective signal line contacts are integrally provided with end portions of the respective ground contacts protruded from a side wall portion of the connector main body. And, under a state that respective signal line conductors are arranged in the respective signal line contacts, an outer conductor is held by the front-side arm portions and the rear-side arm portions.

Abstract: Provided is a cable connector, a cable assembly, and a method of manufacturing the cable assembly, in which electric characteristics are stabilized by suppressing elastic deformation of a cable for differential signal transmission, and besides, which is easily connectable by reducing the number of parts. In a ground contact, an outer-conductor adhering portion which is protruded from a side wall portion of a connector main body and which is adhered with an outer conductor by a conductive adhesive is provided. In this manner, elastic deformation of a cable for differential signal transmission is suppressed, so that electric characteristics can be stabilized. Also, connecting work between the outer conductor and the ground contact can be simplified as reducing the number of parts. Further, the cable for differential signal transmission is not exposed to a high temperature of soldering or others, and therefore, thermal deformation thereof does not occur, either.

Abstract: A high-speed signal transmission apparatus comprises: a housing; a plurality of daughter boards juxtaposed to one another in the housing; board-side connectors each provided on corresponding each of the juxtaposed daughter boards; and cable-side connectors fixed in the housing; wherein each of the board-side connectors is insertable/removable into/from corresponding each of the cable-side connectors, and wherein a cable group whose impedance matching can be achieved makes connection between the predetermined cable-side connectors.

Abstract: A differential signaling cable according to the present invention comprises: a pair of signal conductors provided in parallel; an insulator which covers the periphery of the pair of signal conductors in a batch; and a shield conductor provided on the outer periphery of the insulator, in which an interval between the pair of signal conductors is specified so that even-mode impedance becomes 1.5 to 1.9 times odd-mode impedance.

Abstract: A high-speed signal transmission apparatus comprises: a housing; a plurality of daughter boards juxtaposed to one another in the housing; board-side connectors each provided on corresponding each of the juxtaposed daughter boards; and cable-side connectors fixed in the housing; wherein each of the board-side connectors is insertable/removable into/from corresponding each of the cable-side connectors, and wherein a cable group whose impedance matching can be achieved makes connection between the predetermined cable-side connectors.