Abstract: A method of manufacturing an oscillator including housing a first resonator and a first integrated circuit device configured to oscillate the first resonator in a first container to manufacture the first oscillator, and housing a second resonator and a second integrated circuit device configured to oscillate the second resonator in a second container to manufacture the second oscillator, wherein the first integrated circuit device includes a first oscillation circuit configured to oscillate the first resonator to output a first oscillation signal, and no PLL circuit, the second integrated circuit device includes a second oscillation circuit configured to oscillate the second resonator to output a second oscillation signal, and a PLL circuit to which the second oscillation signal is input, and which is configured to output a third oscillation signal, and the first container and the second container are containers same in type.

Abstract: An oscillator includes a resonator, an oscillation circuit, and first and temperature compensation circuits. The first temperature compensation circuit performs a first-order first temperature compensation processing in a first mode and performs the first-order first temperature compensation processing and a high-order first temperature compensation processing in a second mode for a frequency of a first clock signal generated by oscillation of the resonator by the oscillation circuit. The second temperature compensation circuit receives the first clock signal and outputs a second clock signal subjected to a high-order second temperature compensation processing based on the first clock signal.

Abstract: A circuit apparatus includes a clock signal generation circuit configured to generate a clock signal by a resonator, an output circuit configured to operate in a first state or a second state in which a consumption current is different from that in the first state and output an output clock signal, and a temperature compensation circuit configured to compensate for a frequency-temperature characteristic of the clock signal based on a temperature detection signal. When the output circuit operates in the first state, the temperature compensation circuit outputs a first temperature compensation signal that compensates for a frequency-temperature characteristic when the output circuit operates in the first state, and the clock signal generation circuit generates a clock signal based on the first temperature compensation signal.

Abstract: A circuit device includes: an oscillation circuit configured to oscillate a resonator; a temperature compensation circuit configured to output a temperature compensation voltage for temperature compensating an oscillation frequency of the oscillation circuit, based on a temperature detection result of a temperature sensor; and a frequency control circuit configured to output a frequency control voltage for the oscillation frequency. The oscillation circuit includes a first variable capacitance circuit having a positive capacitance change characteristic with respect to a capacitance control voltage and a second variable capacitance circuit having a negative capacitance change characteristic with respect to the capacitance control voltage.

Abstract: The integrated circuit device includes: a pad that has a shape having a longitudinal direction and a lateral direction; a circuit that overlaps the pad in a plan view, and that is electrically coupled to the pad; a lead-out wiring that is led out from an outer edge on a longitudinal side of the pad along the lateral direction of the pad; and a via group that electrically couples the lead-out wiring and a wiring of the circuit and that does not overlap the pad in the plan view.

Abstract: A method of manufacturing an oscillator including housing a first resonator and a first integrated circuit device configured to oscillate the first resonator in a first container to manufacture the first oscillator, and housing a second resonator and a second integrated circuit device configured to oscillate the second resonator in a second container to manufacture the second oscillator, wherein the first integrated circuit device includes a first oscillation circuit configured to oscillate the first resonator to output a first oscillation signal, and no PLL circuit, the second integrated circuit device includes a second oscillation circuit configured to oscillate the second resonator to output a second oscillation signal, and a PLL circuit to which the second oscillation signal is input, and which is configured to output a third oscillation signal, and the first container and the second container are containers same in type.

Abstract: An oscillator includes: a resonator; an oscillation circuit configured to oscillate the resonator; a first temperature compensation circuit configured to perform a first temperature compensation processing of temperature-compensating for a frequency of a first clock signal generated by oscillation of the resonator by the oscillation circuit; and a second temperature compensation circuit configured to receive the first clock signal subjected to the first temperature compensation processing, and to output a second clock signal subjected to a second temperature compensation processing based on the first clock signal. The first temperature compensation circuit is configured to perform a first-order first temperature compensation processing as the first temperature compensation processing. The second temperature compensation circuit is configured to perform a high-order second temperature compensation processing as the second temperature compensation processing.

Abstract: A circuit device includes a first terminal to be coupled to one end of a resonator, a second terminal to be coupled to another end of the resonator, an amplifying element configured to amplify a signal from the first terminal to output the signal amplified to the second terminal, a first resistor element disposed on a signal path between an input node and an output node of the amplifying element, a capacitance element disposed on a signal path between the first terminal and the input node, and a first switch element configured to switch electrical coupling between the input node and a ground.

Abstract: A vibrator device includes a semiconductor substrate, a base, a vibrating element, and a lid. The semiconductor substrate has a first surface and a second surface which is in a front-back relationship with the first surface. The base includes an integrated circuit disposed on a first surface or a second surface. The vibrating element is electrically coupled to the integrated circuit and is disposed on the first surface side. The lid is joined to the base at a joining portion of the base to accommodate the vibrating element. The integrated circuit includes a passive element, and the passive element is disposed such that at least a part of the passive element overlaps with the joining portion in a plan view from a direction orthogonal to the first surface.

Abstract: A circuit device includes: an oscillation circuit configured to oscillate a resonator; a temperature compensation circuit configured to output a temperature compensation voltage for temperature compensating an oscillation frequency of the oscillation circuit, based on a temperature detection result of a temperature sensor; and a frequency control circuit configured to output a frequency control voltage for the oscillation frequency. The oscillation circuit includes a first variable capacitance circuit having a positive capacitance change characteristic with respect to a capacitance control voltage and a second variable capacitance circuit having a negative capacitance change characteristic with respect to the capacitance control voltage.

Abstract: A circuit device includes an oscillation circuit. The oscillation circuit includes a first variable capacitance circuit whose capacitance change characteristic with respect to a capacitance control voltage is a positive characteristic and a second variable capacitance circuit whose capacitance change characteristic with respect to the capacitance control voltage is a negative characteristic, and oscillates a resonator. The circuit device further includes a switch circuit.

Abstract: An oscillator circuit includes an oscillating circuit coupled to a vibrator, and a control circuit that controls the oscillating circuit. The oscillator circuit has a normal operation mode in which the oscillating circuit oscillates in a state where a negative resistance value is a first value, and a start mode in which the oscillator circuit shifts from a state where oscillation is stopped to the normal operation mode. In the start mode, the control circuit controls the negative resistance value to increase from a second value which is smaller than the first value.

Abstract: An integrated circuit apparatus includes a pad via which an AC signal is inputted or outputted, a circuit that overlaps with the pad in the plan view, protective wiring provided between the pad and the circuit, and a resistor having one end electrically coupled to the protective wiring and another end electrically coupled to an electric charge discharging path.

Abstract: A circuit device includes a first terminal to be coupled to one end of a resonator, a second terminal to be coupled to another end of the resonator, an amplifying element configured to amplify a signal from the first terminal to output the signal amplified to the second terminal, a first resistor element disposed on a signal path between an input node and an output node of the amplifying element, a capacitance element disposed on a signal path between the first terminal and the input node, and a first switch element configured to switch electrical coupling between the input node and a ground.

Abstract: The integrated circuit device includes: a pad that has a shape having a longitudinal direction and a lateral direction; a circuit that overlaps the pad in a plan view, and that is electrically coupled to the pad; a lead-out wiring that is led out from an outer edge on a longitudinal side of the pad along the lateral direction of the pad; and a via group that electrically couples the lead-out wiring and a wiring of the circuit and that does not overlap the pad in the plan view.

Abstract: A vibrator device includes a semiconductor substrate, a base, a vibrating element, and a lid. The semiconductor substrate has a first surface and a second surface which is in a front-back relationship with the first surface. The base includes an integrated circuit disposed on a first surface or a second surface. The vibrating element is electrically coupled to the integrated circuit and is disposed on the first surface side. The lid is joined to the base at a joining portion of the base to accommodate the vibrating element. The integrated circuit includes a passive element, and the passive element is disposed such that at least a part of the passive element overlaps with the joining portion in a plan view from a direction orthogonal to the first surface.

Abstract: An oscillator circuit includes an oscillating circuit coupled to a vibrator, and a control circuit that controls the oscillating circuit. The oscillator circuit has a normal operation mode in which the oscillating circuit oscillates in a state where a negative resistance value is a first value, and a start mode in which the oscillator circuit shifts from a state where oscillation is stopped to the normal operation mode. In the start mode, the control circuit controls the negative resistance value to increase from a second value which is smaller than the first value.

Abstract: An integrated circuit device includes a temperature sensor, a heat generation source circuit serving as a heat generation source, a pad for external coupling, and a capacitor having the MIM structure in which one electrode is electrically coupled to the pad for external coupling. In a plan view orthogonal to the substrate on which a circuit element is formed, the capacitor having the MIM structure and the temperature sensor overlap.

Abstract: An integrated circuit device includes a first pad and a second pad electrically coupled to one end and the other end of a resonator, an oscillation circuit that is electrically coupled to the first pad and the second pad and generates an oscillation signal by causing the resonator to oscillate, and an output circuit that outputs a clock signal based on the oscillation signal. The oscillation circuit is disposed along a first side of the integrated circuit device among the first side, a second side that intersects the first side, a third side that is an opposite side of the first side, and a fourth side that is an opposite side of the second side. The first pad and the second pad are disposed in the oscillation circuit along the first side in a plan view, and the output circuit is disposed along the second side.

Abstract: Provided is a circuit device including: an oscillation circuit oscillating a vibrator, in which the oscillation circuit includes a variable capacitance circuit having a first variable capacitance element and a second variable capacitance element constituted by a first transistor and a second transistor, and a reference voltage supply circuit. The first reference voltage is supplied to a first gate of the first transistor and a capacitance control voltage is supplied to a first impurity region of the first transistor, the second reference voltage is supplied to a second gate of the second transistor and the capacitance control voltage is supplied to a second impurity region of the second transistor, and the capacitance control voltage is supplied to a first common impurity region of the first transistor and the second transistor.